Patents by Inventor Sang Hoon Kim

Sang Hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11860341
    Abstract: A cover window includes a glass substrates, a first coating layer disposed on a first surface of the glass substrate, and a second coating layer disposed on the first coating layer, where a thickness of the glass substrate is equal to or less than about 100 micrometers (?m), and a thickness of each of the first coating layer and the second coating layer ranges from about 50 angstroms (?) to about 400 ?.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sang Hoon Kim, Seong Jin Hwang, Min Sang Koo, Kyung-Man Kim, Min-Hoon Choi
  • Publication number: 20230420477
    Abstract: An image sensor with improved performance, and a method of fabricating the same are provided.
    Type: Application
    Filed: September 13, 2023
    Publication date: December 28, 2023
    Inventors: Sang-Hoon KIM, Kwan Hee LEE
  • Publication number: 20230402529
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming alternating layers, where a silicon germanium layer and a silicon layer are alternately stacked, on a substrate, etching the alternating layers to form a fin structure protruding onto the substrate and then forming a silicon nitride film on a surface and a sidewall of each of the alternating layers having the fin structure, sequentially forming a dummy gate and a silicon oxide film on the alternating layers with the silicon nitride film therebetween and then forming a gate spacer on a sidewall of the dummy gate, etching the silicon nitride film upward exposed, and then, etching the alternating layers by using the silicon oxide film, and selectively forming an inner spacer in a sidewall of each of silicon germanium layers among the silicon germanium layers and silicon layers of the etched alternating layers.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 14, 2023
    Inventors: Sang Hoon KIM, Dongwoo SUH, JINHA KIM, Jeong Woo PARK, Seong Hyun LEE, Wangjoo LEE
  • Publication number: 20230386526
    Abstract: A reference voltage generation device includes a noise information generation circuit configured to generate power noise information based on a first power noise and a second power noise, the first power noise and the second power noise generated based on a first power and a second power supplied to a first electronic device and propagated from the first electronic device to a second electronic device through a communication line, and the first electronic device and the second electronic device configured to perform data communication using a multi-level signaling scheme. The device includes a reference voltage generation circuit configured to generate three or more reference voltages for the multi-level signaling scheme based on the power noise information, and the second electronic device is configured to use the three or more reference voltages.
    Type: Application
    Filed: January 9, 2023
    Publication date: November 30, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon KIM, SungYong Cho
  • Publication number: 20230354520
    Abstract: A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.
    Type: Application
    Filed: November 9, 2022
    Publication date: November 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Hoon KO, Ki Hee CHO, Sang Hoon KIM
  • Publication number: 20230335479
    Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Hoon KO, Sang Hoon KIM, Yoong OH, Hea Sung KIM
  • Patent number: 11791362
    Abstract: An image sensor with improved performance, and a method of fabricating the same are provided.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hoon Kim, Kwan Hee Lee
  • Patent number: 11777202
    Abstract: An antenna module includes an integrated circuit (IC), a substrate having a first region having one or more antenna disposed on a surface thereof and a second region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more antenna and the IC, a set substrate electrically connected to the IC, and a set module disposed on the set substrate between the set substrate and the first region.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: October 3, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Bal Kim, Wan Soo Kim, Sang Hoon Kim
  • Publication number: 20230290962
    Abstract: A method for preparing a support for an electrode catalyst including forming first and second polymer layers having charges different from each other on a surface of a carbon support and carbonizing the result, wherein the polymers included in the first and the second polymer layers are an aromatic compound including a heteroatom, and the first or the second polymer includes a pyridine group.
    Type: Application
    Filed: April 28, 2023
    Publication date: September 14, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Wonkyun LEE, Sang Hoon KIM, Gyo Hyun HWANG, Jun Yeon CHO, Kwanghyun KIM, Ran CHOI
  • Patent number: 11758653
    Abstract: A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: September 12, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Yong Duk Lee, Duck Young Maeng
  • Patent number: 11749702
    Abstract: An image sensor includes a substrate including a pixel region and a pad region and having a first surface and a second surface opposite to the first surface, the pad region of the substrate being provided with a first recess which is recessed to a first depth from the second surface toward the first surface and the pixel region of the substrate being provided with a plurality of unit pixels, an interlayer insulating layer disposed on the first surface, an interconnection line disposed in the interlayer insulating layer, a conductive pad disposed in the first recess of the pad region, and a plurality of penetration structures disposed in the pad region of the substrate and extending from a bottom surface of the first recess to the first surface of the substrate, and electrically connecting the conductive pad to the interconnection line.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: September 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hoon Kim, Min-Geun Kwon
  • Publication number: 20230245989
    Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
  • Publication number: 20230225153
    Abstract: A window member includes a window including a first flat part, a first pattern part disposed on a side of the first flat part and having a groove pattern, and a second flat part disposed on an opposite side of the first flat part, the first pattern part being disposed between the first flat part and the second flat part; and a first light-blocking member disposed on a surface of the first flat part and not overlapping the first pattern part or the second flat part in a plan view. The first light-blocking member includes a 1-1-th light-blocking member, a 1-2-th light-blocking member, and a 1-3-th light-blocking member facing the 1-1-th light-blocking member. The 1-1-th light-blocking member, the 1-2-th light-blocking member, and the 1-3-th light-blocking member define a first accommodation space. The 1-3-th light-blocking member is spaced apart from the 1-1-th light-blocking member to define a first open area.
    Type: Application
    Filed: August 26, 2022
    Publication date: July 13, 2023
    Applicant: Samsung Display Co., LTD.
    Inventors: Min Hoon CHOI, Kyung Man KIM, Da Woon KIM, Seung Ho KIM, Seong Jin HWANG, Sang Hoon KIM, Sung Hoon KIM, Yu Ri KIM
  • Patent number: 11699795
    Abstract: A method for preparing a support for an electrode catalyst including forming first and second polymer layers having charges different from each other on a surface of a carbon support and carbonizing the result, wherein the polymers included in the first and the second polymer layers are an aromatic compound including a heteroatom, and the first or the second polymer includes a pyridine group.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: July 11, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Wonkyun Lee, Sang Hoon Kim, Gyo Hyun Hwang, Jun Yeon Cho, Kwanghyun Kim, Ran Choi
  • Publication number: 20230216141
    Abstract: Provided are a separator and a method for producing the same, and more particularly, a separator which may secure battery stability and has characteristics of significantly low heat shrinkage even at a high temperature and minimally increased resistance, and a method for producing the same. The separator according to the present disclosure includes: a porous substrate; and an inorganic particle layer positioned on one or both surfaces of the porous substrate, wherein the inorganic particle layer includes inorganic particles and a rod-shaped inorganic binder.
    Type: Application
    Filed: January 4, 2023
    Publication date: July 6, 2023
    Inventors: Chang Q LEE, Sang Yoon Ji, Hye Jin Park, Young Eun Cheon, Sang Hoon Kim, Jae Suk Choi
  • Publication number: 20230215794
    Abstract: A printed circuit board includes: a substrate layer in which a plurality of insulating layers and a plurality of wiring patterns are repeatedly layered, the substrate layer including a conductive via layer disposed in one of the plurality of insulating layers to connect wiring patterns, among the plurality of wiring patterns, disposed on upper and lower surfaces of the one insulating layer, respectively; an uppermost substrate layer including an outermost insulating layer disposed outermost within the substrate layer, and a first wiring pattern disposed in the outermost insulating layer; and a bump pad disposed on a portion of an upper surface of the first wiring pattern and having a length shorter than a length of the first wiring pattern.
    Type: Application
    Filed: May 13, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Suk Chang HONG, Yong Duk LEE, Sang Hoon KIM, Ki Gon KIM, Woo Jeong CHOI, Cheol Min SHIN
  • Publication number: 20230216144
    Abstract: Provided are a separator and a method for producing the same, and more particularly, a separator which may secure battery stability and has characteristics of significantly low heat shrinkage even at a high temperature and minimally increased resistance, and a method for producing the same. The separator according to the present disclosure includes: a porous substrate; and an inorganic particle layer positioned on one or both surfaces of the porous substrate, wherein the inorganic particle layer includes inorganic particles and a sheet-shaped inorganic binder.
    Type: Application
    Filed: January 4, 2023
    Publication date: July 6, 2023
    Inventors: Chang Q LEE, Sang Yoon Ji, Hye Jin PARK, Young Eun CHEON, Sang Hoon KIM, Jae Suk CHOI
  • Publication number: 20230213979
    Abstract: A display device includes a display panel; and a window disposed on an upper surface of the display panel, the window includes a first flat panel part; a second flat panel part disposed on a side of the first flat panel part in a first direction; and a first segment part disposed between the first flat panel part and the second flat panel part, the first segment part includes segments extended in a second direction intersecting the first direction and spaced apart from each other in the first direction; and bridges connecting both ends of each of the segments in the second direction, the segments and the bridges include a same material.
    Type: Application
    Filed: October 19, 2022
    Publication date: July 6, 2023
    Applicant: Samsung Display Co., LTD.
    Inventors: Kyung Man KIM, Sang Hoon KIM, Sung Hoon KIM, Seung Ho KIM, Yu Ri KIM, Seong Jin HWANG
  • Publication number: 20230199956
    Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.
    Type: Application
    Filed: May 10, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
  • Publication number: 20230185342
    Abstract: A window includes a body unit in which a plurality of grooves is defined, and a width of a groove of the plurality of grooves in a first direction which is parallel to a main extension direction of the body unit is about 80 micrometers (?m) to about 100 ?m.
    Type: Application
    Filed: October 27, 2022
    Publication date: June 15, 2023
    Inventors: Min-Hoon CHOI, Seung Ho KIM, Yu Ri KIM, Seong Jin HWANG, Kyung-Man KIM, Byung Hoon KANG, Sang Hoon KIM, Sung Hoon KIM