Patents by Inventor Sang-Hyon Paek

Sang-Hyon Paek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamic acid, polyimide film and fabrication method of the polyimide film
    Patent number: 11396582
    Abstract: A polyamic acid according to an embodiment is formed by a polymerization reaction of a dianhydride compound, a first diamine compound represented by the following Formula 1, and a second diamine compound, which is different from the first diamine compound.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: July 26, 2022
    Assignees: Samsung Display Co., Ltd., University-Industry Cooperation Group of Kyung Hee University
    Inventors: Chaungi Choi, Sang-hyon Paek, Seulgi Kim, Jangju Lee
  • POLYAMIC ACID, POLYIMIDE FILM AND FABRICATION METHOD OF THE POLYIMIDE FILM
    Publication number: 20200247955
    Abstract: A polyamic acid according to an embodiment is formed by a polymerization reaction of a dianhydride compound, a first diamine compound represented by the following Formula 1, and a second diamine compound, which is different from the first diamine compound.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: Chaungi CHOI, Sang-hyon PAEK, Seulgi KIM, Jangju LEE
  • POLYAMIC ACID, POLYIMIDE FILM AND FABRICATION METHOD OF THE POLYIMIDE FILM
    Publication number: 20180230271
    Abstract: A polyamic acid according to an embodiment is formed by a polymerization reaction of a dianhydride compound, a first diamine compound represented by the following Formula 1, and a second diamine compound, which is different from the first diamine compound.
    Type: Application
    Filed: October 30, 2017
    Publication date: August 16, 2018
    Inventors: Chaungi CHOI, Sang-hyon PAEK, Seulgi KIM, Jangju LEE
  • Structural design and processes to control probe position accuracy in a wafer test probe assembly
    Publication number: 20030048108
    Abstract: The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for positioning and maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.
    Type: Application
    Filed: May 14, 2002
    Publication date: March 13, 2003
    Inventors: Brian Samuel Beaman, Fuad Elias Doany, Keith Edward Fogel, James Lupton Hedrick, Paul Alfred Lauro, Maurics Heathcote Norcott, John James Ritsko, Sang-Hyon Paek, Leathen Shi, Da-Yuan Shih, George Frederick Walker