Patents by Inventor Sang-Hyun Oh

Sang-Hyun Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10608141
    Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: March 31, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
  • Patent number: 10415880
    Abstract: A hybrid drying apparatus including: a bed portion having a horizontally disposed top surface; an object-to-be-dried supplying portion configured to spread an object to be dried on the top surface of the bed portion; and a driving unit configured to rotate and drive the bed portion or the object-to-be-dried supplying portion, wherein the object to be dried supplied from the object-to-be-dried supplying portion is spread on the top surface of the bed portion while the bed portion or the object-to-be-dried supplying portion is rotated, and the top surface of the bed portion is heated in such a manner that a lower portion of the bed portion is primarily heated so that the bed portion is used to dry the object to be dried coated on the top surface of the bed portion by the object-to-be-dried supplying portion.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: September 17, 2019
    Assignee: Korea Institute of Energy Research
    Inventors: Sung Il Kim, Sang Hyun Oh, Ki Ho Park
  • Publication number: 20190280006
    Abstract: A semiconductor device includes: a first stack structure; a second stack structure adjacent to the first stack structure in a first direction; a first insulating layer including protrusion parts protruding in a second direction intersecting the first direction and including a concave part defined between the protrusion parts; and a second insulating layer located between the first stack structure and the second stack structure, the second insulating layer inserted into the concave part and the second insulating layer in contact with at least one protrusion part among the protrusion parts.
    Type: Application
    Filed: November 5, 2018
    Publication date: September 12, 2019
    Applicant: SK hynix Inc.
    Inventors: Sang Yong LEE, Sang Min KIM, Jung Ryul AHN, Sang Hyun OH, Seung Bum CHA, Kang Sik CHOI
  • Publication number: 20190123244
    Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 25, 2019
    Inventors: Ye Seul KIM, Kyoung Wan KIM, Sang Hyun OH, Duk Il SUH, Sang Won WOO, Ji Hye KIM
  • Patent number: 10234201
    Abstract: A complex type dryer includes a rotational cylinder, a drying material, a hot air provider, a hot air chamber and a scraping unit. The drying material provider is disposed over the rotational cylinder and coats a drying material on a surface of the rotational cylinder. The hot air provider is connected to both sides of the rotational cylinder, and includes first and second hot air tubes. The first and second hot air tubes alternately provide a hot air into the rotational cylinder or alternately exhaust the hot air passing through the rotational cylinder. The hot air chamber is disposed along an outer surface of the rotational cylinder outside of the rotational cylinder. The scraping unit is disposed at a side of the rotational cylinder, and removes the drying material from the surface of the rotational cylinder after dried by the rotational cylinder and the hot air chamber.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: March 19, 2019
    Assignee: Korea institute of energy research
    Inventors: Sung-il Kim, Jong-Won Choi, Sang-Hyun Oh, Kye-Jong Lee
  • Patent number: 10186638
    Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: January 22, 2019
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Sang Hyun Oh, Duk Il Suh, Sang Won Woo, Ji Hye Kim
  • Publication number: 20180361400
    Abstract: Devices, systems, and methods for applying a dielectrophoretic force on a particle include: a cell defining at least one channel for confining the particle; and a first electrode and a second electrode electrically isolated from the first electrode, at least one of the first and second electrodes being formed from a two-dimensional (2D) material providing an atomically sharp edge. The first and second electrodes are arranged sufficiently close to one another and sufficiently close to the channel such that application of a sufficient voltage across the first and second electrodes generates an electric field in at least part of the channel, the electric field having an electric field gradient sufficient to apply the dielectrophoretic force on the particle in the channel.
    Type: Application
    Filed: June 18, 2018
    Publication date: December 20, 2018
    Inventors: Sang-Hyun Oh, Steven John Koester
  • Publication number: 20180335257
    Abstract: A hybrid drying apparatus including: a bed portion having a horizontally disposed top surface; an object-to-be-dried supplying portion configured to spread an object to be dried on the top surface of the bed portion; and a driving unit configured to rotate and drive the bed portion or the object-to-be-dried supplying portion, wherein the object to be dried supplied from the object-to-be-dried supplying portion is spread on the top surface of the bed portion while the bed portion or the object-to-be-dried supplying portion is rotated, and the top surface of the bed portion is heated in such a manner that a lower portion of the bed portion is primarily heated so that the bed portion is used to dry the object to be dried coated on the top surface of the bed portion by the object-to-be-dried supplying portion.
    Type: Application
    Filed: September 15, 2017
    Publication date: November 22, 2018
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Sung Il KIM, Sang Hyun OH, Ki Ho PARK
  • Patent number: 10084112
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: September 25, 2018
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
  • Publication number: 20180219130
    Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
    Type: Application
    Filed: March 26, 2018
    Publication date: August 2, 2018
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
  • Patent number: 9929314
    Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: March 27, 2018
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
  • Patent number: 9777372
    Abstract: A method for fabricating articles for use in optics, electronics, and plasmonics includes large scale lithography or other patterning and conformal deposition such as by atomic layer deposition.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: October 3, 2017
    Assignee: REGENTS OF THE UNIVERSITY OF MINNESOTA
    Inventors: Sang-Hyun Oh, Xiaoshu Chen
  • Publication number: 20170200857
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Application
    Filed: March 24, 2017
    Publication date: July 13, 2017
    Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
  • Publication number: 20170125640
    Abstract: A light-emitting element according to an embodiment of the present document has a transparent electrode having an opening, and the transparent electrode has a protrusion on a side surface of the opening. A second electrode pad is arranged on the opening of the transparent electrode, and abuts the protrusion. Accordingly, peeling of the second electrode pad can be prevented, thereby improving the reliability of the light-emitting element.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Sang Hyun Oh, Duk Il Suh, Sang Won Woo, Ji Hye Kim
  • Patent number: 9608165
    Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: March 28, 2017
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
  • Publication number: 20170047483
    Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 16, 2017
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
  • Publication number: 20160380157
    Abstract: A light-emitting diode (LED) includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer; a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. The LED includes a first distributed Bragg reflector arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector including a first laminate structure including alternately stacked SiO2 and Nb2O5 layers. The first laminate structure of the first distributed Bragg reflector is configured to reflect at least 90% of a first wavelength range of blue light emitted from the light emitting structure.
    Type: Application
    Filed: September 12, 2016
    Publication date: December 29, 2016
    Inventors: Duk Il SUH, Jae Moo Kim, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee
  • Patent number: 9520536
    Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: December 13, 2016
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
  • Publication number: 20160252302
    Abstract: A complex type dryer includes a rotational cylinder, a drying material, a hot air provider, a hot air chamber and a scraping unit. The drying material provider is disposed over the rotational cylinder and coats a drying material on a surface of the rotational cylinder. The hot air provider is connected to both sides of the rotational cylinder, and includes first and second hot air tubes. The first and second hot air tubes alternately provide a hot air into the rotational cylinder or alternately exhaust the hot air passing through the rotational cylinder. The hot air chamber is disposed along an outer surface of the rotational cylinder outside of the rotational cylinder. The scraping unit is disposed at a side of the rotational cylinder, and removes the drying material from the surface of the rotational cylinder after dried by the rotational cylinder and the hot air chamber.
    Type: Application
    Filed: November 2, 2015
    Publication date: September 1, 2016
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Sung-il KIM, Jong-Won CHOI, Sang-Hyun OH, Kye-Jong LEE
  • Patent number: 9401370
    Abstract: A three-dimensional non-volatile memory device that may increase erase operation efficiency during an erase operation using Gate-Induced Drain Leakage (GIDL) current and a method for fabricating the three-dimensional non-volatile memory device. The non-volatile memory device includes a channel structure formed over a substrate including a plurality of inter-layer dielectric layers and a plurality of channel layers that are alternately stacked, and a first selection gate and a second selection gate that are disposed on a first side and a second side of the channel structure, wherein the first selection gate and the second selection gate are disposed on sidewalls of the multiple channel layers, respectively, wherein a work function of a material forming the first selection gate is different from a work function of a material forming the second selection gate.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: July 26, 2016
    Assignee: SK Hynix Inc.
    Inventors: Sang-Moo Choi, Byung-Soo Park, Sang-Hyun Oh, Han-Soo Joo