Abstract: A secondary battery includes an electrode assembly having a positive electrode provided with a positive electrode tab, a separator, and a negative electrode provided with a negative electrode tab, the positive electrode, the separator, and the negative electrode being wound, the electrode assembly having a core part at a center thereof; a can configured to receive the electrode assembly therein, the negative electrode tab being connected to the can; a cap assembly coupled to an opening of the can, the positive electrode tab being connected to the cap assembly; and a reinforcing member provided on an end of the separator exposed beyond the positive electrode or the negative electrode to prevent heat of the positive electrode tab or the negative electrode tab from being transferred to the separator.

Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.

Abstract: Disclosed herein is a method for manufacturing a composite having nanofibers uniformly dispersed in a metal, polymer or ceramic matrix. The method comprises mixing the nanofibers with a metallic, polymeric or ceramic material, followed by uniformly dispersing the nanofibers in the material via deformation of the metal, polymer or ceramic matrix by application of mechanical energy to the material; and imparting a directionality to the nanofibers via application of a mechanical mass flowing process to a composite material with the nanofibers uniformly dispersed in the metal, polymer or ceramic matrix. With the method, since the nanofibers can be uniformly dispersed in the metal, polymer or ceramic matrix via a simple mechanical process, the composite can be manufactured through a simple process, thereby enhancing manufacturing efficiency.

Abstract: The present invention relates to a solder paste containing 70 to 90 wt % of a solder powder having the melting point of 100 to 250° C.; 5 to 15 wt % of an ultraviolet curable or degradable photosensitive polymer; 0.5 to 2 wt % of an additive; and 4.5 to 13 wt % of a composite solvent, and a method for forming solder bumps using the solder paste. The solder bumps can be formed so as to have a fine width of a few or a few tens of micrometers, thereby easily achieving miniaturization and increased integration of semiconductor devices. In addition, the process is very simplified to realize an improvement in the process yield and mass production.

Abstract: Disclosed herein is a method for manufacturing a composite having nanofibers uniformly dispersed in a metal, polymer or ceramic matrix. The method comprises mixing the nanofibers with a metallic, polymeric or ceramic material, followed by uniformly dispersing the nanofibers in the material via deformation of the metal, polymer or ceramic matrix by application of mechanical energy to the material; and imparting a directionality to the nanofibers via application of a mechanical mass flowing process to a composite material with the nanofibers uniformly dispersed in the metal, polymer or ceramic matrix. With the method, since the nanofibers can be uniformly dispersed in the metal, polymer or ceramic matrix via a simple mechanical process, the composite can be manufactured through a simple process, thereby enhancing manufacturing efficiency.

Abstract: An apparatus for manufacturing a trapezoidal wire using two-set shaping rollers has a body rotating about a central axis at a predetermined speed, a plurality of first shaping roller sets installed along an outer circumference of the body, each first shaping roller set including an upper roller and a lower roller and a shaping portion, into which a wire is inserted to be processed, between the upper roller and the lower roller, and a plurality of second shaping roller sets arranged after the first shaping roller sets along the outer circumference of the body and in a direction in which the wire moves, each second shaping roller set comprising an upper roller and a lower roller and a shaping portion, into which the wire is inserted to be processed again, between the upper roller and the lower roller, wherein wires processed by the first and second shaping roller sets while passing therethrough are stranded by the rotating body.

Abstract: An apparatus for manufacturing a trapezoidal wire using two-set shaping rollers has a body rotating about a central axis at a predetermined speed, a plurality of first shaping roller sets installed along an outer circumference of the body, each first shaping roller set including an upper roller and a lower roller and a shaping portion, into which a wire is inserted to be processed, between the upper roller and the lower roller, and a plurality of second shaping roller sets arranged after the first shaping roller sets along the outer circumference of the body and in a direction in which the wire moves, each second shaping roller set comprising an upper roller and a lower roller and a shaping portion, into which the wire is inserted to be processed again, between the upper roller and the lower roller, wherein wires processed by the first and second shaping roller sets while passing therethrough are stranded by the rotating body.

Abstract: In an insulating film having improved adhesive strength and a multilayer printed circuit board having the same, the insulating film made of an epoxy resin, a rubber and a filler, for use in an insulating layer of a multilayer printed circuit board, is composed of a first coating layer and a second coating layer. The first coating layer has a greater amount of rubber and filler and a smaller amount of epoxy resin than the second coating layer.

Abstract: Disclosed are a cyanate ester based resin-containing insulating composition, an insulating film made therefrom and a multilayer printed board having the insulating film. The insulating composition comprises 1-75% by weight of epoxy resin, 1-60% by weight of cyanate ester resin, up to 20% by weight of a filler, a curing agent and a metal catalyst, from which the insulating film can be prepared, and the film-applied multilayer printed board can be manufactured. Use of epoxy resins having excellent electrical properties and cyanate ester based resins having high heat resistance causes the reaction of hydroxy groups in some epoxy resins with cyanate ester, thus forming such net structures as to increase the heat resistance of the insulating composition, the insulating film and the multilayer printed circuit board.

Abstract: Disclosed are a cyanate ester based resin-containing insulating composition, an insulating film made therefrom and a multilayer printed board having the insulating film. The insulating composition comprises 1-75% by weight of epoxy resin, 1-60% by weight of cyanate ester resin, up to 20% by weight of a filler, a curing agent and a metal catalyst, from which the insulating film can be prepared, and the film-applied multilayer printed board can be manufactured. Use of epoxy resins having excellent electrical properties and cyanate ester based resins having high heat resistance causes the reaction of hydroxy groups in some epoxy resins with cyanate ester, thus forming such net structures as to increase the heat resistance of the insulating composition, the insulating film and the multilayer printed circuit board.

Abstract: Disclosed are an insulating film having improved adhesive strength and a multilayer printed circuit board having the same. The insulating film made of an epoxy resin, a rubber and a filler, for use in an insulating layer of a multilayer printed circuit board, is composed of a desmear-treated first coating layer and a non-desmear treated second coating layer. As such, the first coating layer has more rubber and filler amounts and less epoxy resin amount than does the second coating layer. The insulating film is advantageous in light of high roughness thereon by the desmear treatment, and an improvement of adhesive strength between an insulating layer and a plating layer formed on the insulating layer, upon preparation of the multilayer printed circuit board.