Abstract: A system for photolithography may include an exposure chamber providing a first isolated environment, an exposure stage in the exposure chamber, a radiation source, an interface chamber providing a second isolated environment, a port, a post exposure bake heater in the interface chamber, and a wafer handler. The exposure stage may be configured to receive a wafer having photoresist thereon to be exposed, and the radiation source may be configured to provide exposing radiation to the wafer being exposed. The port may be configured to allow wafer transport between the first and second isolated environments of the exposure and interface chambers, and the post exposure bake heater may be configured to bake the wafer after exposure.

Abstract: A wafer bake system includes a heating plate for heating a wafer, and means for supporting the wafer to be spaced from the heating plate, wherein a gap distribution between the wafer and the heating plate is measured, and a temperature gradient of the wafer is controlled based on the measured gap distribution.

Abstract: A system for photolithography may include an exposure chamber providing a first isolated environment, an exposure stage in the exposure chamber, a radiation source, an interface chamber providing a second isolated environment, a port, a post exposure bake heater in the interface chamber, and a wafer handler. The exposure stage may be configured to receive a wafer having photoresist thereon to be exposed, and the radiation source may be configured to provide exposing radiation to the wafer being exposed. The port may be configured to allow wafer transport between the first and second isolated environments of the exposure and interface chambers, and the post exposure bake heater may be configured to bake the wafer after exposure.

Abstract: A wafer bake system includes a heating plate for heating a wafer, and means for supporting the wafer to be spaced from the heating plate, wherein a gap distribution between the wafer and the heating plate is measured, and a temperature gradient of the wafer is controlled based on the measured gap distribution.

Abstract: A baking system includes a heat pipe including a top surface for receiving a wafer to be baked, the heat pipe to be filled with a predetermined amount of working fluid and having wicks formed on sides and a ceiling thereof for supplying the working fluid, a heater for heating the top surface by heating the working fluid, a subsidiary cooling system, which contains a liquid coolant that is to be exchanged with the working fluid from the heat pipe through circulation, a connection pipe for providing fluid communication between the heat pipe and the subsidiary cooling system to circulate the working fluid and the liquid coolant, and a control unit, which is installed in the connection pipe, for controlling a flow of the working fluid and the liquid coolant through the connection pipe.

Abstract: A cooling apparatus for a wafer baking plate is provided. The wafer baking plate has a support plate for supporting a wafer, a heater under the support plate, and a heat transfer plate interposed between the support plate and the heater, for transferring heat. In the cooling apparatus, a hollow bore is formed in the heat transfer plate of the wafer baking plate and partially filled with a liquid working fluid. A cooling pipe is laid in the heat transfer plate, for circulating a cooling medium. The wafer baking plate is cooled down via the working fluid, stabilizing its temperature distribution. Therefore, the product yield of wafers is increased.

Abstract: A baking system including a plate for receiving a wafer to be baked, a heater for heating the plate, and a cooling apparatus for cooling the plate, the cooling apparatus including a cooling element for cooling the plate using vaporization of a coolant therein, the cooling element arranged in proximity to the plate with the heater disposed therebetween, a coolant storage tank for supplying the coolant to the cooling element when the plate is cooled and for storing the coolant when the plate is heated, and a thermostatic element for maintaining a temperature of the coolant supplied into the cooling element constant when the plate is cooled.

Abstract: A wafer exposure apparatus includes a special wafer cooling unit, namely, an air showerhead, for controlling the temperature of a wafer which is to be transferred from a wafer pre-alignment system to a wafer stage of photolithography exposure equipment. The wafer which has been heated in the course of being transferred from a spin coater to the wafer pre-alignment system, and may be further heated by sensors of the wafer pre-alignment system, is cooled to the same temperature as that of a wafer stage. Accordingly, a thermal equilibrium may be rapidly established between the wafer and the wafer stage when the wafer is transferred to the wafer stage. Accordingly, excessive thermal expansion of the wafer caused by a difference in temperature between the wafer and the wafer stage is prevented. Therefore, an excessive error in aligning the wafer with the optics of the photolithography exposure equipment can be prevented.

Abstract: A wafer exposure apparatus includes a special wafer cooling unit, namely, an air showerhead, for controlling the temperature of a wafer which is to be transferred from a wafer pre-alignment system to a wafer stage of photolithography exposure equipment. The wafer which has been heated in the course of being transferred from a spin coater to the wafer pre-alignment system, and may be further heated by sensors of the wafer pre-alignment system, is cooled to the same temperature as that of a wafer stage. Accordingly, a thermal equilibrium may be rapidly established between the wafer and the wafer stage when the wafer is transferred to the wafer stage. Accordingly, excessive thermal expansion of the wafer caused by a difference in temperature between the wafer and the wafer stage is prevented. Therefore, an excessive error in aligning the wafer with the optics of the photolithography exposure equipment can be prevented.

Abstract: A wafer exposure apparatus includes a special wafer cooling unit, namely, an air showerhead, for controlling the temperature of a wafer which is to be transferred from a wafer pre-alignment system to a wafer stage of photolithography exposure equipment. The wafer which has been heated in the course of being transferred from a spin coater to the wafer pre-alignment system, and may be further heated by sensors of the wafer pre-alignment system, is cooled to the same temperature as that of a wafer stage. Accordingly, a thermal equilibrium may be rapidly established between the wafer and the wafer stage when the wafer is transferred to the wafer stage. Accordingly, excessive thermal expansion of the wafer caused by a difference in temperature between the wafer and the wafer stage is prevented. Therefore, an excessive error in aligning the wafer with the optics of the photolithography exposure equipment can be prevented.