Patents by Inventor Sang Nam Go

Sang Nam Go has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball attaching apparatus for correcting warpage of substrate and method of attaching solder balls using the same
    Patent number: 7546941
    Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: June 16, 2009
    Assignee: Hynix Semiconductor Inc.
    Inventors: Hai Ju No, Hee Sung Kim, Jung Bum Woo, Sang Nam Go, Tae Hyung Kim
  • BALL ATTACHING APPARATUS FOR CORRECTING WARPAGE OF SUBSTRATE AND METHOD OF ATTACHING SOLDER BALLS USING THE SAME
    Publication number: 20080222888
    Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.
    Type: Application
    Filed: May 10, 2007
    Publication date: September 18, 2008
    Inventors: Hai Ju No, Hee Sung Kim, Jung Bum Woo, Sang Nam Go, Tae Hyung Kim