Patents by Inventor Sang-nam JEONG

Sang-nam JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240284968
    Abstract: The present disclosure relates to a lyocell material with controlled whiteness by hydrogen peroxide treatment and a manufacturing method thereof, wherein the lyocell material has improved whiteness due to an aging effect through drying and packaging by a predetermined amount of hydrogen peroxide remaining in a tow, and may replace a CA cigarette filter to lower environmental pollution problems caused by discarded cigarette butts, and thus the lyocell material is suitable as a cigarette filter.
    Type: Application
    Filed: September 21, 2022
    Publication date: August 29, 2024
    Inventors: Sang Woo JIN, Jong Cheol JEONG, Jeong Hun LEE, Seung Dong SEO, Yeong Nam HWANG, Sunghoon HA, Kyengbae MA, Jin-Chul YANG, Bong Su CHEONG
  • Publication number: 20240284970
    Abstract: The present disclosure relates to a lyocell material for a cigarette filter and a method of manufacturing the same, in which, by setting the optimal total denier range of crimped lyocell tow, which may realize filter properties equivalent to cellulose acetate (CA) currently used as a cigarette filter, the optimal processability for manufacturing a cigarette filter may be secured, and due to the excellent biodegradability thereof, environmental pollution factors caused by conventional discarded cigarette butts may be reduced.
    Type: Application
    Filed: September 21, 2022
    Publication date: August 29, 2024
    Inventors: Sang Woo JIN, Jong Cheol JEONG, Jeong Hun LEE, Seung Dong SEO, Yeong Nam HWANG, Sunghoon HA, Kyengbae MA, Jin-Chul YANG, Bong Su CHEONG
  • Patent number: 10141293
    Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: November 27, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok-hong Kwon, Sang-nam Jeong, Sun-won Kang, Hee-jin Lee
  • Publication number: 20180122790
    Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.
    Type: Application
    Filed: December 29, 2017
    Publication date: May 3, 2018
    Inventors: Seok-hong KWON, Sang-nam JEONG, Sun-won KANG, Hee-jin LEE
  • Patent number: 9859263
    Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: January 2, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seok-hong Kwon, Sang-nam Jeong, Sun-won Kang, Hee-jin Lee
  • Publication number: 20170125393
    Abstract: A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.
    Type: Application
    Filed: August 17, 2016
    Publication date: May 4, 2017
    Inventors: Seok-hong KWON, Sang-nam JEONG, Sun-won KANG, Hee-jin LEE