Abstract: Provided is a method of operating a terminal. The method includes determining a profile item applicable to the profile view for the account based on an input received by the terminal and a coordinate indicating a position where the profile item is provided on the profile view. The method includes displaying the profile item on a screen of the terminal based on the determined profile item and the determined coordinate. The method includes receiving an input related to the profile item, and displaying a visual effect corresponding to the input on the screen.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: A vehicular power window safety device by which the state of a foreign object being stuck is recognized only when the foreign object makes contact with a weather strip mounted on the upper portion of a door frame, deforming the weather strip, and preventing an excessive contact between the window glass and run channel from being misjudged as an object being jammed therebetween and thereby enabling to obtain an operational trustworthiness on the power window safety device. The device comprises a motor for generating the driving power for lifting and lowering a window glass; a weather strip mounted on an upper area of a door frame and inherently provided with a sensor of which electric resistance is changed by pressure provided by a foreign object stuck in between the weather strip and the window glass due to the lifting of the window glass; and a controller for controlling the motor in response to signals supplied from the sensor.

Abstract: A vehicular power window safety device by which the state of a foreign object being stuck is recognized only when the foreign object makes contact with a weather strip mounted on the upper portion of a door frame, deforming the weather strip, and preventing an excessive contact between the window glass and run channel from being misjudged as an object being jammed therebetween and thereby enabling to obtain an operational trustworthiness on the power window safety device. The device comprises a motor for generating the driving power for lifting and lowering a window glass; a weather strip mounted on an upper area of a door frame and inherently provided with a sensor of which electric resistance is changed by pressure provided by a foreign object stuck in between the weather strip and the window glass due to the lifting of the window glass; and a controller for controlling the motor in response to signals supplied from the sensor.

Abstract: A measurement system for a semiconductor manufacturing line for measuring at least one wafer, which has gone through a specified manufacturing process includes a plurality of checking parts and a robot for conveying the wafer between the checking parts. After being loaded by the robot, the wafer goes through each checking part, and is then unloaded. The measurement apparatus is connected to a control part which is interfaced with each checking part so that when the measurement of the wafer is completed at a certain checking part, the wafer is conveyed to another checking part and to the unloading portion.