Abstract: An X-ray apparatus and system are capable of preventing possible generation of after-images and ghost images due to partial imaging of an object by determining an order of imaging operations with respect to a plurality of partial X-ray imaging regions based on size information about portions of the object respectively represented on the plurality of partial X-ray imaging regions.

Abstract: A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and an upper package on the interposer. The lower package includes a first package substrate, a first semiconductor chip on the first package substrate, and a first molding compound layer on the first package substrate. The upper package includes a second package substrate and at least one upper semiconductor chip on the second package substrate. A heat transfer member includes a first portion disposed between the interposer and the upper package, a second portion disposed in the at least one opening of the interposer, and a third portion disposed between the interposer and the lower package.

Abstract: An X-ray apparatus includes an X-ray radiator configured to radiate X-rays to an object and a controller configured to acquire orientation information indicating an orientation of the X-ray radiator and motion information indicating a movement of an X-ray detector configured to detect the X-rays radiated by the X-ray radiator and select the X-ray detector based on the orientation information and the motion information.

Abstract: An X-ray detector may include a plurality of pixels on a substrate, a first insulating layer configured to cover the plurality of pixels, an electrode block configured to penetrate the first insulating layer and be in contact with the plurality of pixels, a second insulating layer on the electrode block, and a metal wire configured to penetrate the second insulating layer and be in contact with the electrode block. Each of the plurality of pixels may include a first electrode on the substrate, a photoelectronic conversion device on the first electrode, and a second electrode on the photoelectronic conversion device.

Abstract: A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and an upper package on the interposer. The lower package includes a first package substrate, a first semiconductor chip on the first package substrate, and a first molding compound layer on the first package substrate. The upper package includes a second package substrate and at least one upper semiconductor chip on the second package substrate. A heat transfer member includes a first portion disposed between the interposer and the upper package, a second portion disposed in the at least one opening of the interposer, and a third portion disposed between the interposer and the lower package.

Abstract: The present invention relates to a method for preparing a target-specific non-antibody protein, and more particularly, to a method for preparing a target-specific non-antibody protein comprising the steps of: selecting non-antibody proteins having a structural complementarity with the target site of a target protein in a non-antibody protein library; calculating a binding energy of the selected non-antibody protein and the target protein; selecting a non-antibody protein having a favorable binding energy among the selected non-antibody proteins; selecting amino acid residues having a high binding energy among the interfacial amino acid residues of the selected non-antibody protein and the target protein; and substituting the selected amino acid residues with the amino acid residues having a low binding energy.

Abstract: A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip.

Abstract: A workstation includes a receiver configured to receive identification information of an X-ray detector from the X-ray detector; a controller configured to set assign indicator information of the X-ray detector, based on the received identification information of the X-ray detector; an output unit configured to display the set assign indicator information of the X-ray detector; and a transmitter configured to transmit the set assign indicator information of the X-ray detector to the X-ray detector. The X-ray detector includes a transmitter configured to transmit the identification information of the X-ray detector to the workstation; a receiver configured to receive the assign indicator information from the workstation after the transmitter transmits the identification information of the X-ray detector to the workstation; and an output unit configured to display an assign indicator based on the received assign indicator information.

Abstract: A semiconductor package device includes a lower package, an interposer disposed on the lower package and including a ground layer and at least one opening, and an upper package on the interposer. The lower package includes a first package substrate, a first semiconductor chip on the first package substrate, and a first molding compound layer on the first package substrate. The upper package includes a second package substrate and at least one upper semiconductor chip on the second package substrate. A heat transfer member includes a first portion disposed between the interposer and the upper package, a second portion disposed in the at least one opening of the interposer, and a third portion disposed between the interposer and the lower package.

Abstract: The present invention relates to a hemispherical polymethylmethacrylate bead, wherein the hemispherical polymethylmethacrylate bead of the invention has high adhesive property and oil absorption when applied to cosmetics, medical supply, household items, display devices, lighting fixtures, and miscellaneous goods and especially, it enables cheerful color when applied to cosmetics in comparison with spherical polymethylmethacrylate beads.

Abstract: A liquid crystal display device having a built in touch screen including a first substrate having pixel units comprising: a plurality of pixels displaying an image and sensor regions having light sensors formed adjacent to the corresponding pixel units to sense a position of a contacted object; a second substrate disposed on the first substrate, comprising: color filters formed on regions corresponding to the pixel units and first black matrices formed on regions corresponding to the sensor regions of the pixel units; a liquid crystal layer interposed between the first substrate and the second substrate; and a backlight assembly disposed on a bottom portion of the first substrate and providing light to the first substrate and the second substrate. The liquid crystal display device with the built in touch screen determines a point of contact on the touch screen.

Abstract: This invention relates to a mass preparation method of spherical natural color wax beads and according to the invention, the beads have a higher specific gravity than water so that the beads do not flow into the sea and they are biodegradable to fundamentally remarkably reduce marine ecosystem contamination, and it enables mass preparation by significantly improving the previous preparation of spherical natural color wax beads which had difficulties in their mass preparation while using expensive equipment.

Abstract: A semiconductor package comprising: a lower semiconductor package comprising a lower semiconductor chip mounted on a lower package substrate and a lower molding layer substantially covering the lower semiconductor chip and having through holes arranged in a first direction and a second direction. The first direction is different from the second direction; and for each of the through holes, first and second upper widths of the through hole in the first and second directions are less than a third upper width of the through hole in a third direction that is a diagonal direction with respect to the first and second directions.

Abstract: A membrane electrode assembly for a fuel cell is provided that includes a membrane, electrodes on both sides of the membrane, respectively, and sub-gaskets bonded to the edges of the electrodes, respectively. In particular, the sub-gasket may be bonded to the membrane at a predetermined distance from the edge of the electrode.

Abstract: A liquid crystal display (LCD) with a built-in touch screen includes: a first substrate including a sensor area having a plurality of photosensors; a second substrate positioned over the first substrate, and including a color filter, a light receiving portion, and a transparent electrode layer and a front polarizing plate; an LCD panel including a liquid crystal layer interposed between the first and second substrates; a touch screen driver circuit to measure a capacitance variation sensed through a first sensing line connected to the transparent electrode layer and to calculate a touch area using optical information sensed through a second sensing line connected to the photosensors when a contact object is in contact with the LCD panel, and to output position information of the contact object, sensed by determining whether a touch occurs and whether a multi-touch occurs using the capacitance variation and the touch area.

Abstract: A liquid crystal display (LCD) with a built-in touch screen includes: a first substrate including a pixel area having a plurality of pixels and a sensor area having a plurality of photosensors; a second substrate positioned over the first substrate, and including a color filter, a light receiving portion, a transparent electrode layer, and a front polarizing plate; an LCD panel including a liquid crystal layer interposed between the first and second substrates; and a touch screen driver circuit to sense a capacitance variation provided through a first sensing line connected to the transparent electrode layer when an object is in contact with the LCD panel, and to output position information of the object, sensed by using optical information sensed through a second sensing line connected the plurality of photosensors when the capacitance variation is greater than or equal to a predetermined threshold value.

Abstract: A semiconductor package includes a wiring board, a semiconductor chip mounted on the wiring board, and a mounting connection terminal electrically connecting a bonding pad of the semiconductor chip to a first connection pad of the wiring board. The mounting connection terminal includes a core portion and a connecting shell solder portion substantially surrounding the core portion. The core portion of the mounting connection terminal is not in contact with the bonding pad of the semiconductor chip.

Abstract: A liquid crystal display (LCD) with a built-in touch screen includes: a first substrate including a pixel area having a plurality of pixels and a sensor area having a plurality of photosensors; a second substrate positioned over the first substrate, and including a color filter, a light receiving portion, a transparent electrode layer, and a front polarizing plate; an LCD panel including a liquid crystal layer interposed between the first and second substrates; and a touch screen driver circuit to sense a capacitance variation provided through a first sensing line connected to the transparent electrode layer when an object is in contact with the LCD panel, and to output position information of the object, sensed by using optical information sensed through a second sensing line connected the plurality of photosensors when the capacitance variation is greater than or equal to a predetermined threshold value.

Abstract: A flat panel display (FPD) with a photo sensor type built-in touch screen capable of performing a scan operation. The FPD with the built-in touch screen includes a plurality of unit pixels disposed in a display region of the FPD and arranged in pixel groups and photo sensors adjacent to the unit pixels of the respective pixel groups. In a scan operation mode, the plurality of unit pixels in each of the pixel groups sequentially emit light to perform a scan operation using the light emitted from the unit pixels and reflected by a scan object to be scanned to be incident on the photo sensors.

Abstract: A sensor scan driver may include a shift register unit for driving photodiodes, a transmission gate unit for changing a voltage range of sensor scan signals generated by the shift register unit, and a buffer unit for supplying the sensor scan signals supplied from the transmission gate unit to the photodiodes, wherein the transmission gate unit includes first and second transmission gates, each including an electrode adapted to receive an output signal of the shift register unit, another electrode adapted to receive the inverted output signal of the shift register unit, an input terminal coupled to first and second power sources, respectively, and an output terminal coupled to an output terminal of the transmission gate unit.