Patents by Inventor Sang Won Choi

Sang Won Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363832
    Abstract: One embodiment of the present invention relates to a lithium metal anode. Wherein the lithium metal anode comprises a current collector and a lithium metal thin film layer disposed on at least one surface of the current collector and having a thickness in a range of 0.1 to 200 ?m and a coating layer disposed on a surface of the lithium metal thin film layer, wherein, the coating layer comprising a Li—N—C—H—O based ionic compound.
    Type: Application
    Filed: May 13, 2024
    Publication date: October 31, 2024
    Applicants: POSCO CO., LTD, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY
    Inventors: Jin Hong Kim, Hong-Youl Bae, Mun Kyu Cho, Nam Soon Choi, Sang-Lag Lee, Weon-Soo Bae, Yong Won Lee, Ji-Woong Moon
  • Publication number: 20240365622
    Abstract: A display device includes: a first pixel electrode comprising a first reflective electrode in a first emission area, a first light transmitting pattern on the first reflective electrode, and a first light transmitting electrode on the first reflective electrode and the first light transmitting pattern and connected to the first reflective electrode; a second pixel electrode comprising a second reflective electrode in a second emission area and a second light transmitting electrode on the second reflective electrode; a light emitting stack on the first and second pixel electrodes and comprising at least one light emitting layer; a common electrode on the light emitting stack; and a bank pattern surrounding the first and second emission areas, and having at least a portion between the first emission area and the second emission area, wherein the first light transmitting pattern and the bank pattern contain a same material and are spaced apart.
    Type: Application
    Filed: December 4, 2023
    Publication date: October 31, 2024
    Inventors: Il Ha SONG, Hyo Min KO, Sang Gyun KIM, Dae Woong LEE, Hyeon Jeong IM, Hye Won CHOI
  • Patent number: 12131978
    Abstract: The present invention improves a heat dissipation property of a semiconductor device by transferring hexagonal boron nitride (hBN) with a two-dimensional nanostructure to the semiconductor device. A semiconductor device of the present invention includes a substrate having a first surface and a second surface, a semiconductor layer formed on the first surface of the substrate, an hBN layer formed on at least one surface of the first surface and the second surface of the substrate, and a heat sink positioned on the second surface of the substrate. A radiation rate of heat generated during driving of an element is increased to decrease a reduction in lifetime of a semiconductor device due to a temperature increase. The semiconductor device has a structure and configuration which are very effective in improving a rapid temperature increase due to heat generated by high-power semiconductor devices.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 29, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Il Gyu Choi, Seong Il Kim, Hae Cheon Kim, Youn Sub Noh, Ho Kyun Ahn, Sang Heung Lee, Jong Won Lim, Sung Jae Chang, Hyun Wook Jung
  • Publication number: 20240353283
    Abstract: Disclosed herein is an apparatus for testing liquefied hydrogen valve that can configure the test valve to environmental conditions of a temperature below 20K by using only low-cost helium gas without using liquefied hydrogen or liquid helium as the test fluid. This helps companies developing liquefied hydrogen valves to safely and conveniently perform valve leakage and performance tests.
    Type: Application
    Filed: September 14, 2023
    Publication date: October 24, 2024
    Inventors: Chang Woo JUNG, Ji Won CHOI, Sang Min KIM, Hyung Min JUNG
  • Publication number: 20240352581
    Abstract: An atomic layer depositing apparatus includes: a gas supply assembly configured to supply a source gas, a reaction gas, and a purge gas; and a substrate transfer module disposed on a lower side of the gas supply assembly, configured to move linearly, and having an upper side on which the substrate is seated. The gas supply assembly includes: a purge gas supply module connected to a purge gas supply line in which the purge gas flows, a reaction gas supply module connected to a reaction gas supply line in which the reaction gas flows, a source gas supply module configured to selectively communicate with any one of the purge gas supply line and a source gas supply line in which the source gas flows, a pumping module disposed among the purge gas supply module, the reaction gas supply module, and the source gas supply module.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 24, 2024
    Applicant: NEXUSBE CO., LTD
    Inventors: Hag Young CHOI, Dong Won KIM, Sang Hun KIM, Keun Sik KIM
  • Patent number: 12125637
    Abstract: In an embodiment a shape-transformable switch apparatus includes an electromagnet arranged inside a housing, wherein the electromagnet has an outer circumferential surface wound with a solenoid coil and is configured to provide a magnetic field when a power is applied to the solenoid coil, a Magnetorheological Elastomer (MRE) disposed on an upper portion of the electromagnet, wherein the MRE is configured to change from an initial soft state to a relatively hard state when the power is applied to the solenoid coil and configured to be pressed and to move upward when the electromagnet moves upward and a switch cover disposed on an upper portion of the housing, the switch cover configured to form a switch shape and to protrude outward when the MRE moves in an upward direction.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: October 22, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Korea University Of Technology And Education Industry-University Cooperation Foundation
    Inventors: Yoon Im, Yong Won Choi, Myung Hoe Kim, Joo Hwa Kim, Seok Han Lee, Hyun U Ko, Sang Youn Kim
  • Patent number: 12117861
    Abstract: In an embodiment a magnetorheological fluid-based haptic knob apparatus includes a housing, a solenoid coil mounted inside the housing, the solenoid coil configured to generate a magnetic field thereby providing magnetic flux, a shaft connected to the housing and including a rotational rod, wherein the shaft is configured to generate a plurality of modes and a magnetorheological fluid accommodated inside the housing, the magnetorheological fluid configured to form a magnetic chain in response of the magnetic flux.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: October 15, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Korea University Of Technology And Education Industry-University Cooperation Foundation
    Inventors: Yoon Im, Yong Won Choi, Myung Hoe Kim, Joo Hwa Kim, In Ho Yun, Hyun U Ko, Sang Youn Kim
  • Publication number: 20240336690
    Abstract: An antibody binds to CD154. The antibody includes HCDR, which includes amino acid sequences of SEQ ID NOs: 1 to 3, and LCDR which includes amino acid sequences of SEQ ID NOs: 4 to 6. A composition including an antibody-drug conjugate in which a drug is conjugated to the antibody may prevent or treat a T cell-mediated autoimmune disease and/or organ transplant rejection.
    Type: Application
    Filed: August 1, 2022
    Publication date: October 10, 2024
    Inventors: JUN HO CHUNG, KYUNG HO CHOI, SANG IL KIM, YOUNG JAE LEE, SU JEONG KIM, SEO RYEONG PARK, SI WON HWANG, DONG MIN KANG, SU REE KIM
  • Publication number: 20240330598
    Abstract: Provided is an AI-based disaster safety knowledge integration management system enabling AI-driven question-and-answer services for specialized knowledge in the field of disaster safety and supports automatic reporting services for policy planning and report generation on specific topics by utilizing intelligent analysis services for sharing disaster safety data, and which consists of a disaster safety knowledge base integrated with a data network and an artificial intelligence section designed for high-dimensional information processing; the disaster safety knowledge base consisting of a data collection section for gathering and aggregating various information from external agencies; and a data transmission section for transmitting the aggregated information to the server; and big data for analyzing and accumulating the transmitted data, and in the AI section, the accumulated and analyzed data from the big data section being utilized to enable machine intelligence through rapid learning based on human cog
    Type: Application
    Filed: March 9, 2023
    Publication date: October 3, 2024
    Inventors: Dong Man LEE, Seon Hwa CHOI, Sang Hoon YOON, Jong Yeong SON, Mi Song KIM, Hee Won YOON, Shin Hye RYU
  • Patent number: 12106345
    Abstract: Provided is a surveillance planning device configured to generate a checklist with respect to a region based on spatial information and object information of the region, obtain device installation condition information based on a user response to the checklist, and recommend, to a user, a list of devices to be installed in the region and an installation location of the devices based on the spatial information, the object information, and the device installation condition information.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: October 1, 2024
    Assignee: Hanwha Vision Co., Ltd.
    Inventors: Sang Yun Lee, Dong Won Kim, Hye Lyoung Choi, Haan Joon Lee
  • Publication number: 20240298654
    Abstract: The present invention relates to a method for preparing dough for frozen pizza, dough for frozen pizza prepared by the preparation method, and frozen pizza comprising the same.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 12, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Jae Kyoung CHOI, Hye Won SHIN, Eun Yi KIM, Sang Geun KIM, Young Min HA, Hee Soo PARK, Min Hyuk KIM, Ki Moon KANG
  • Patent number: 12087934
    Abstract: A negative electrode for a secondary battery including: a negative electrode current collector; and a negative electrode active material layer present on the negative electrode current collector. The negative electrode active material layer includes a negative electrode active material, wherein the negative electrode active material for a secondary battery includes natural graphite, and has a sphericity of 0.58 to 1, a tap density of 1.08 g/cc to 1.32 g/cc, and Dmax?Dmin of 16 ?m to 19 ?m, wherein Dmax?Dmin is a difference between a maximum particle diameter Dmax and a minimum particle diameter Dmin in a particle size distribution.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: September 10, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Hee Won Choi, Je Young Kim, Sang Wook Woo, Li Lin Piao
  • Patent number: 12080889
    Abstract: A negative electrode for a lithium secondary battery including a negative electrode active material layer. The negative electrode active material layer is formed by steps of coating a negative electrode mixture slurry including spheroidized natural graphite particles as a negative electrode active material on at least one surface of a negative electrode current collector, followed by drying and pressing the negative electrode mixture slurry on the at least one surface of the negative electrode current collector. The spheroidized natural graphite particles include a plurality of pores. The negative electrode active material layer has a Brunauer-Emmett-Teller (BET) specific surface area of the negative electrode active material layer after the pressing is larger than a BET specific surface area of the negative electrode active material layer before pressing. A difference in the BET specific surface area before and after pressing ranges from 0.9 m2/g to 1.2 m2/g.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: September 3, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Lilin Piao, Je-Young Kim, Sang-Wook Woo, Hee-Won Choi
  • Patent number: 12080873
    Abstract: A negative electrode and a secondary battery including the negative electrode. The negative electrode including a current collector and a negative electrode active material layer, wherein the negative electrode active material layer includes negative electrode active material particles, the negative electrode active material particles include natural graphite particles and a carbon coating layer disposed on the natural graphite particles. The negative electrode active material particles have a D50 of 6 ?m to 9.2 ?m and a half-width of 5.0 ?m to 5.5 ?m based on a particle size distribution, and the specific surface area of the negative electrode active material particles is from 0.6 m2/g to 2.2 m2/g.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: September 3, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Li Lin Piao, Je Young Kim, Sang Wook Woo, Hee Won Choi
  • Publication number: 20240283823
    Abstract: Disclosed is an electronic apparatus for implementing a honeypot control system. The electronic apparatus includes a communication interface, a memory configured to store execution information including information on a virtual machine built on a cloud server, information on a running service, and information on an open port, and a processor configured to functionally control the communication interface and the memory, wherein the processor is configured to transmit execution information obtained based on information stored in the memory to each of a plurality of cloud servers in different Internet Protocol (IP) bands through the communication interface, when log information is received from each of the plurality of cloud servers that have received the execution information through the communication interface, normalize the received log information, and obtain malicious code information using the normalized log information.
    Type: Application
    Filed: November 22, 2023
    Publication date: August 22, 2024
    Applicants: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, S2W INC.
    Inventors: Seung Won SHIN, Dong Min CHOI, Hyun Min SEO, Sang Duk SUH, Jae Ki KIM
  • Patent number: 12063958
    Abstract: The present disclosure provides a disposable liquid aerosol generating article which includes an aerosol generating substrate portion and a filter portion, the aerosol generating substrate portion including an absorber impregnated with a liquid substance for forming an aerosol, and an amount of the liquid substance corresponding to 10 to 30 times of inhalation.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: August 20, 2024
    Assignee: KT&G CORPORATION
    Inventors: In Su Park, Dong Kyun Ko, Sang Won Choi, Sun Hwan Jung, Eun Mi Jeoung
  • Patent number: 12059762
    Abstract: In a system for automatically manufacturing a pipe spool, when information on a pipe spool is input to a control unit, manufacturing of a spool pipe by cutting an original pipe, processing of a spool pipe, processing of a connection member, manufacturing of a straight pipe spool by welding a spool pipe to a connection member, and manufacturing a three-dimensional spool by welding a straight pipe spool to the other straight pipe spool or a connection member may be automatically performed by a sensor, an automatic device or a robot included in each process and the control unit connected to each of the devices.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: August 13, 2024
    Assignees: HDHYUNDAI ROBOTICS CO., LTD, SAMSUNG E&A CO., LTD
    Inventors: Sung-Gi Kang, Young-Choon Kwak, Sun-Gyu Hwang, Sung-Keun Kim, Roh-Hyun Myung, Sang-Hun Rim, Byeong-Yeol Lee, Sang-Pil Cheon, Chan-Won Seo, Jung-Hoon Choo, Min-Kue Choi
  • Publication number: 20240266496
    Abstract: A lithium metal is physically pressed to a silicon wafer having a uniform intaglio or embossed pattern formed thereon in advance, or liquid lithium is applied to the silicon wafer and may then be cooled in order to form a uniform pattern on the surface of the lithium metal.
    Type: Application
    Filed: April 16, 2024
    Publication date: August 8, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Oh-Byong CHAE, Eun-Kyung KIM, Sang-Wook WOO, Geun-Sik JO, Soo-Hee KANG, Hee-Won CHOI
  • Publication number: 20240266251
    Abstract: A direct cooling type semiconductor package unit includes a substrate made of a material capable of manufacturing a semiconductor device, and having a material layer for forming the semiconductor device stacked on one side of the substrate, and a flow channel through which a cooling fluid flows formed on the other side of the substrate to enable direct cooling of the semiconductor device using the cooling fluid; a packaging block disposed at a position spaced apart from the substrate for packaging the semiconductor device, and having an electrode electrically connected to the semiconductor device through wiring and placed thereon to be insulated; a heat sink unit disposed on a lower side of the packaging block and having a fluid movement region formed at a position corresponding to a flow channel of the substrate; and a thin film type structure disposed between the substrate and the heat sink unit for coupling between the substrate and the heat sink unit and being moldable to have pattern structures of variou
    Type: Application
    Filed: February 4, 2024
    Publication date: August 8, 2024
    Inventors: Jun Rae PARK, Min Soo KANG, Hae Cheon KIM, Hyoung Soon LEE, Sung Jae CHANG, Hyun Wook JUNG, Il Gyu CHOI, Seong Il KIM, Sang Heung LEE, Ho Kyun AHN, Jong Won LIM
  • Publication number: 20240266253
    Abstract: Provided is a direct cooling device for an integrated circuit configured to form a direct cooling portion with a flow channel through which cooling fluid may flow in a through via hole of a substrate constituting the integrated circuit, and to couple the substrate to a heat sink unit through a bonding portion formed integrally with the direct cooling portion, unlike the prior art in which only a ground circuit is possible through the through via hole, which derives the effect of increasing product reliability due to improved thermal management efficiency of the integrated circuit by directly cooling the semiconductor device as well as the ground circuit, and the effect of simplifying and miniaturizing the structure by implementing the cooling function using a circuit for grounding the semiconductor device even without forming an additional flow path structure for cooling the semiconductor device.
    Type: Application
    Filed: February 4, 2024
    Publication date: August 8, 2024
    Inventors: Min Soo KANG, Jun Rae PARK, Hae Cheon KIM, Hyoung Soon LEE, Sung Jae CHANG, Hyun Wook JUNG, Il Gyu CHOI, Seong Il KIM, Sang Heung LEE, Ho Kyun AHN, Jong Won LIM