Abstract: A memory device includes a memory cell area including a plurality of cell blocks divided into a plurality of normal cell blocks, at least one ECC cell block, and at least one redundancy cell block, the plurality of cell blocks being configured to output data and error correction codes; an error correction circuit configured to generate error-corrected data by correcting errors in the data using the error correction codes; a first switch group configured to output the error-corrected data while performing, according to first repair control information, a shifting operation on the error-corrected data; and a second switch group configured to transfer the data from the memory cell area to the error correction circuit while performing, according to second repair control information, a zero-padding operation on the data output from one of the cell blocks.

Abstract: Provided is a compound of Chemical Formula 1: wherein: A is a benzene ring; X1 and X2 are each independently O or S; Y1 to Y3 are each independently N or CH, provided that at least one of Y1 to Y3 is N; Ar1 and Ar2 are each independently a substituted or unsubstituted: C6-?aryl or C2- 60 heteroaryl containing at least one of N, O, and S; R1 to R3 are each independently hydrogen, deuterium, halogen, cyano, nitro, amino, or a substituted or unsubstituted: C1-60 alkyl, C3-60 cycloalkyl, C2-60 alkenyl, C6-60 aryl, or C2-60 heteroaryl containing at least one of N, O, and S; and R?and R5 are each independently hydrogen, deuterium, halogen, cyano, nitro, amino, or a substituted or unsubstituted: C1-60 alkyl, C3-?cycloalkyl, C2-60 alkenyl, C6-60 aryl, or C2-60 heteroaryl containing at least one of N, O, and S, and an organic light emitting device including the same.

Abstract: Provided are a method and apparatus for providing a network switching service to a user equipment.

Abstract: A method may include loading a substrate into a substrate processing apparatus and performing a plasma treatment process on the substrate. The substrate processing apparatus includes a housing that defines a processing region, a power supply source on the housing and configured to generate plasma, a shower head in the housing and configured to supply the plasma to the processing region, an adapter between the power supply source and the shower head and separated from the shower head, a lid surrounding at least part of the adapter, and pads between the shower head and the lid. The shower head may include first fastening holes. The lid may be connected to the shower head through fastening portions respectively inserted into the first fastening holes. The pads may include polytetrafluoroethylene. At least a part of the pads may contact a bottom surface of the adapter.

Abstract: Provided are a method and apparatus for a user equipment, a core network, and a second device to enable bidirectional communication for second devices. The method of the second device may include receiving internet protocol (IP) configuration information for automatically configuring an IP version 6 (IPv6) address of the second device from a core network through a user equipment; generating the IPv6 address using information in the IP configuration information; and transmitting the generated IPv6 address to the core network through the UE.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.

Abstract: Provided are a method and apparatus for providing a multi virtual local area network service to user equipments.

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.