Abstract: The present invention relates to a roll stamp and a method of manufacturing the same, the roll stamp including a cylindrical metal mold including a debossed pattern formed on an outer side and a hollow portion formed on an inner side, and a dummy roller inserted into the hollow portion. Because a joining portion is not formed on the entire area of the cylindrical metal mold, a problem in which edge regions are separated does not occur. Also, due to the absence of the joining portion, it is possible to perform a patterning process continuously.

Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Abstract: The present invention relates to a roll stamp and a method of manufacturing the same, the roll stamp including a cylindrical metal mold including a debossed pattern formed on an outer side and a hollow portion formed on an inner side, and a dummy roller inserted into the hollow portion. Because a joining portion is not formed on the entire area of the cylindrical metal mold, a problem in which edge regions are separated does not occur. Also, due to the absence of the joining portion, it is possible to perform a patterning process continuously.

Abstract: Provided are a current collector for a battery, including: a base material; adhesive layers positioned on the base material; and metal mesh layers positioned on the adhesive layers, in which the metal mesh layer includes a plurality of metal mesh patterns, and holes positioned between the metal mesh patterns, and a method of manufacturing the same. An active material is applied onto the metal mesh layer through the holes of the metal mesh layer, and thus a contact area of the metal mesh layer and the active material is increased, so that it is possible to restrict the active material from being deintercalated from the current collector and improve a cycle lifespan property of a battery.

Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Abstract: Provided are a current collector for a battery, including: a base material; adhesive layers positioned on the base material; and metal mesh layers positioned on the adhesive layers, in which the metal mesh layer includes a plurality of metal mesh patterns, and holes positioned between the metal mesh patterns, and a method of manufacturing the same. An active material is applied onto the metal mesh layer through the holes of the metal mesh layer, and thus a contact area of the metal mesh layer and the active material is increased, so that it is possible to restrict the active material from being deintercalated from the current collector and improve a cycle lifespan property of a battery.

Abstract: Provided is hard trivalent chromium plating solution having improved covering power. The trivalent chromium plating solution comprises a trivalent chromium compound comprising a compound of formula (1) below; wherein Cr2(SO4)n(OH)6-2n (n<3) ??(1).

Abstract: An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Abstract: An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Abstract: A polishing head of a chemical and mechanical polishing apparatus includes a retainer ring which adheres more uniformly to a polishing pad. The retainer ring surrounds and protects a wafer chucked to the polishing head. The bottom surface of the retainer ring is inclined by a predetermined angle from the outer periphery thereof towards the inner periphery thereof. A resilient fixing plate disposed against the upper surface of the inner peripheral portion of the retainer ring provides a seal between the retainer ring and the carrier. Therefore, when the retainer ring is pressed against a polishing pad and the inner peripheral portion of the retainer ring is pushed downwardly due to the resiliency of the fixing plate, the retainer ring flexes such that uniform pressure is produced between the bottom surface of the retainer ring and the polishing pad. Hence, the wafer will be polished uniformly.

Abstract: A plasma etching apparatus used in the semiconductor device fabrication process improves the uniformity of the etch process by ensuring the uniformity of a plasma gas. The apparatus includes magnetic coils surrounding an outer wall of an etching chamber for generating a magnetic field within the chamber to guide a plasma etch gas created by radio frequency (RF) energy. A power cable is connected to the magnetic coils for supplying power. A bracket, made of an insulating material, is attached at one side to the outer wall of the etching chamber and at an opposing side to the power cable.