Patents by Inventor Sangyeok SIM

Sangyeok SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11902109
    Abstract: The disclosure provides a method and a device for efficiently operating network slicing. According to the disclosure, a method of operating a first node configured to manage a network slice of a communication system includes: transmitting a service level agreement (SLA) range for each network slice subnet and a message requesting a resource according to the SLA range to a second node configured to manage the network slice subnet, receiving SLA arrangement flavor mapping relationship information in the network slice subnet unit from the second node, and identifying the SLA arrangement flavor mapping relationship in a network slice unit based on the received SLA arrangement flavor mapping relationship information in a network slice subnet unit.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangyeok Sim, Ilkook Yun
  • Publication number: 20230038522
    Abstract: The disclosure provides a method and a device for efficiently operating network slicing. According to the disclosure, a method of operating a first node configured to manage a network slice of a communication system includes: transmitting a service level agreement (SLA) range for each network slice subnet and a message requesting a resource according to the SLA range to a second node configured to manage the network slice subnet, receiving SLA arrangement flavor mapping relationship information in the network slice subnet unit from the second node, and identifying the SLA arrangement flavor mapping relationship in a network slice unit based on the received SLA arrangement flavor mapping relationship information in a network slice subnet unit.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventors: Sangyeok SIM, Ilkook YUN