Abstract: An apparatus for supporting a substrate in a process chamber and regulating surface temperature of the substrate and method of making the same is provided. The apparatus includes a base support having a surface adapted to support the substrate and a heater for heating the substrate with the heater being disposed proximate the base support. The base support is made of a composite material comprising a plurality of thermally conductive arcuate members embedded within a matrix, each of the plurality thermally conductive arcuate members being arranged concentrically and defining predetermined intervals in a radial direction such that the composite material provides an anisotropic thermal conductivity in radial (?), azimuthal (?) and axial (z) directions in a cylindrical coordinate system of the base support.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: A method of predicting the temperature of a resistive heating element in a heating system is provided. The method includes obtaining resistance characteristics of resistive heating elements and compensating for variations in the resistance characteristics over a temperature regime. The resistance characteristics of the resistive heating element include, but are not limited to, inaccuracies in resistance measurements due to strain-induced resistance variations, variations in resistance due to the rate of cooling, shifts in power output due to exposure to temperature, resistance to temperature relationships, non-monotonic resistance to temperature relationships, system measurement errors, and combinations of resistance characteristics. The method includes interpreting and calibrating resistance characteristics based on a priori measurements and in situ measurements.

Abstract: A heater for use in heating a fluid flow through a passageway is provided that includes a continuous resistive heating element having a predefined shape that is directly exposed to the fluid flow. The predefined shape includes a cross-sectional geometry that provides a required heat distribution, structural strength, and reduced back pressure within the passageway. The predefined shape may include airfoils, while the cross-sectional geometry provides a required heat distribution, structural strength, and reduced back pressure within the passageway.

Abstract: A control system for a heating system of an exhaust system is provided. The control system includes at least one electric heater disposed within an exhaust fluid flow pathway, and a control device adapted to receive at least one input selected from the group consisting of mass flow rate of an exhaust fluid flow, mass velocity of an exhaust fluid flow, flow temperature upstream of the at least one electric heater, flow temperature downstream of the at least one electric heater, power input to the at least one electric heater, parameters derived from physical characteristics of the heating system, and combinations thereof. The control device is operable to modulate power to the at least one electric heater based on at least one input.

Abstract: A heater is provided that includes at least one resistive heating element having a material with a non-monotonic resistivity vs. temperature profile and exhibiting a negative dR/dT characteristic over a predetermined operating temperature range along the profile. The heater can include a plurality of circuits disposed in a fluid path to heat fluid flow.

Abstract: A control system for use in a fluid flow application is provided. The control system includes a heater having at least one resistive heating element. The heater is adapted to heat the fluid flow. The control system further includes a control device that uses heat loss from at least one resistive heating element to determine flow characteristics of the fluid flow.

Abstract: A heater system for an exhaust system is provided. The heater system includes a heater disposed in an exhaust conduit. The heater includes a plurality of heating elements disposed in the exhaust conduit. A heating control module controls the plurality of heating elements differently according to operating conditions specific to each heating element. In other forms, the heater system for an exhaust system has a plurality of heating zones, instead of a plurality of heating elements. The heating control module controls the plurality of heating zones differently according to operating conditions specific to each heating zone.

Abstract: A thermal system includes a base member, a two-phase fluid, a tuning heater, and a chuck. The base member includes at least one fluid passageway. The two-phase fluid is disposed within the fluid passageway. A pressure of the two-phase fluid is controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. The tuning heater is secured to the base member. The chuck is secured to the tuning heater opposite to the base member. The tuning heater includes a plurality of zones to fine tune a heat distribution provided by the base member to the chuck.

Abstract: An apparatus for supporting a substrate in a process chamber and regulating surface temperature of the substrate and method of making the same is provided. The apparatus includes a base support having a surface adapted to support the substrate and a heater for heating the substrate with the heater being disposed proximate the base support. The base support is made of a composite material comprising a plurality of thermally conductive arcuate members embedded within a matrix, each of the plurality thermally conductive arcuate members being arranged concentrically and defining predetermined intervals in a radial direction such that the composite material provides an anisotropic thermal conductivity in radial (?), azimuthal (?) and axial (z) directions in a cylindrical coordinate system of the base support.

Abstract: A thermal system includes: a base member including at least one fluid passageway in which a two-phase fluid is disposed; a tuning layer secured to the base member; and a control system. The pressure of the two-phase fluid is controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. The tuning layer includes a plurality of zones. The control system includes a plurality of sets of power lines in communication with the tuning layer, and a plurality of addressable control elements in electrical communication with the power lines and with the tuning layer. The control elements provide selective control of the tuning layer zones.

Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: A heater system is provided that includes a base functional layer having at least one functional zone. A substrate is secured to the functional member, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer provides lower power than the base functional layer. A component is secured to the tuning layer opposite the substrate, and the substrate defines a thermal conductivity to absorb and dissipate a requisite amount of power from the base functional layer. A control system is also provided that has a plurality of addressable control elements in electrical communication with power lines and with the tuning layer, the control elements providing selective control of the tuning layer zones.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: A nickel based, high silicon alloy exhibits very high corrosion resistance in high temperature sulfuric acid environments. The alloy may be cast and is sufficiently ductile to be fabricated and machined. The alloy is ductile and has sufficient resistance to mechanical and thermal shock to be reliable in service when used as rotating parts. The alloy may have the following composition, in percent by weight: Nickel about 82-86% Silicon about 9-11% Niobium about 3-6% Cerium about 0-0.1% Boron about 0.-0.11% Cesium about 0.1-0.7% Lanthanum about 0.04-0.3% Neodymium about 0.04-0.3% Iron about 0-0.65% Carbon about 0-0.08%.