Patents by Inventor Sanjay Jha

Sanjay Jha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040162097
    Abstract: Techniques for managing peak-to-average power ratio (PAPR) for multi-carrier modulation in wireless communication systems. Different terminals in a multiple-access system may have different required transmit powers. The number of carriers to allocate to each terminal is made dependent on its required transmit power. Terminals with higher required transmit powers may be allocated fewer carriers (associated with smaller PAPR) to allow the power amplifier to operate at higher power levels. Terminals with lower required transmit powers may be allocated more carriers (associated with higher PAPR) since the power amplifier is operated at lower power levels. The specific carriers to assign to the terminals may also be determined by their transmit power levels to reduce out-of-band emissions. Terminals with higher required transmit powers may be assigned with carriers near the middle of the operating band, and terminals with lower required transmit powers may be assigned with carriers near the band edges.
    Type: Application
    Filed: February 18, 2003
    Publication date: August 19, 2004
    Inventors: Rajiv Vijayan, Avneesh Agrawal, Sanjay Jha
  • Patent number: 6754509
    Abstract: The dual microprocessor system includes one microprocessor configured to perform wireless telephony functions and another configured to perform personal digital assistant (PDA) functions and other non-telephony functions. A memory system and a digital signal processor (DSP) are shared by the microprocessors. By providing a shared memory system, data required by both data microprocessors is conveniently available to both of the microprocessors and their peripheral components thereby eliminating the need to provide separate memory subsystems and further eliminating the need to transfer data back and forth between the separate memory subsystems. By providing a shared DSP, separate DSP devices need not be provided, yet both microprocessors can take advantage of the processing power of the DSP. In a specific example described herein, the microprocessors selectively program the DSP to perform, for example, vocoder functions, voice recognition functions, handwriting recognition functions, and the like.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: June 22, 2004
    Assignee: Qualcomm, Incorporated
    Inventors: Safi Khan, Sanjay Jha, Albert Scott Ludwin, Mehraban Iraninejad, Raghu Sankuratri, Chauhung Lee, Richard Higgins, Nicholas K. Yu
  • Patent number: 6472747
    Abstract: Techniques for fabricating analog and digital circuits on separate dies and stacking and integrating the dies within a single package to form a mixed-signal IC that provides many benefits. In one aspect, the analog and digital circuits are implemented on two separate dies using possibly different IC processes suitable for these different types of circuits. The analog and digital dies are thereafter integrated (stacked) and encapsulated within the single package. Bonding pads are provided to interconnect the dies and to connect the dies to external pins. The bonding pads may be located and arranged in a manner to provide the required connectivity while minimizing the amount of die area required to implement the pads. In another aspect, the die-to-die connectivity may be tested in conjunction with a serial bus interface.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: October 29, 2002
    Assignee: Qualcomm Incorporated
    Inventors: Seyfollah Bazarjani, Haitao Zhang, Qiuzhen Zou, Sanjay Jha
  • Publication number: 20020121679
    Abstract: Techniques for fabricating analog and digital circuits on separate dies and stacking and integrating the dies within a single package to form a mixed-signal IC that provides many benefits. In one aspect, the analog and digital circuits are implemented on two separate dies using possibly different IC processes suitable for these different types of circuits. The analog and digital dies are thereafter integrated (stacked) and encapsulated within the single package. Bonding pads are provided to interconnect the dies and to connect the dies to external pins. The bonding pads may be located and arranged in a manner to provide the required connectivity while minimizing the amount of die area required to implement the pads. In another aspect, the die-to-die connectivity may be tested in conjunction with a serial bus interface.
    Type: Application
    Filed: March 2, 2001
    Publication date: September 5, 2002
    Inventors: Seyfollah Bazarjani, Haitao Zhang, Qiuzhen Zou, Sanjay Jha
  • Publication number: 20020097515
    Abstract: A method and apparatus for a variable mode multi-media data object storage device. Large digital objects can be quickly downloaded in approximately a minute. The digital objects can be utilized or played back at real-time speeds. Utilization or playback consumes minimal power, allowing the disk to support portable devices operating on battery power. The storage device uses multiple disk rotation speeds to support multiple modes of operation. The storage device operates in at least two modes of disk drive operation, supporting a fast platter rotation speed for writing and a slower platter rotation speed for reading. The multiple rotation speeds operate in conjunction with a head assembly configured with at least one head for reading and multiple heads for writing. When writing, the disk spins at the faster rotation speed. When in utilization or playback mode, the disk spins at the slower, power conserving rotation speed.
    Type: Application
    Filed: May 24, 2001
    Publication date: July 25, 2002
    Inventors: Franklin P. Antonio, Sanjay Jha
  • Patent number: 6407949
    Abstract: The flash and SRAM memory are embedded within an application specific integrated circuit (ASIC) to provide improved access times and also reduce overall power consumption of a mobile telephone employing the ASIC. The flash memory system includes a flash memory array configured to provide a set of individual flash macros and a flash memory controller for accessing the flash macros. The flash memory controller includes a read while writing unit for writing to one of the flash macros while simultaneously reading from another of the flash macros. By permitting read while writing, read operations need not be deferred until completion of pending write operations. The flash memory controller also includes programmable wait state registers. Each wait state register stores a programmable number of flash bus wait states associated with a portion of the flash memory.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: June 18, 2002
    Assignee: Qualcomm, Incorporated
    Inventors: Sanjay Jha, Stephen Simmonds, Jalal Elhusseini, Nicholas K. Yu, Safi Khan
  • Patent number: 6392925
    Abstract: The flash and SRAM memory are embedded within an application specific integrated circuit (ASIC) to provide improved access times and also reduce overall power consumption of a mobile telephone employing the ASIC. The flash memory system includes a flash memory array configured to provide a set of individual flash macros and a flash memory controller for accessing the flash macros. The flash memory controller includes a read while writing unit for writing to one of the flash macros while simultaneously reading from another of the flash macros. By permitting read while writing, read operations need not be deferred until completion of pending write operations. The flash memory controller also includes programmable wait state registers. Each wait state register stores a programmable number of flash bus wait states associated with a portion of the flash memory.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: May 21, 2002
    Assignee: QualComm, Incorporated
    Inventors: Sanjay Jha, Stephen Simmonds, Jalal Elhusseini, Nicholas K. Yu, Safi Khan
  • Publication number: 20010036109
    Abstract: The flash and SRAM memory are embedded within an application specific integrated circuit (ASIC) to provide improved access times and also reduce overall power consumption of a mobile telephone employing the ASIC. The flash memory system includes a flash memory array configured to provide a set of individual flash macros and a flash memory controller for accessing the flash macros. The flash memory controller includes a read while writing unit for writing to one of the flash macros while simultaneously reading from another of the flash macros. By permitting read while writing, read operations need not be deferred until completion of pending write operations. The flash memory controller also includes programmable wait state registers. Each wait state register stores a programmable number of flash bus wait states associated with a portion of the flash memory.
    Type: Application
    Filed: March 26, 2001
    Publication date: November 1, 2001
    Inventors: Sanjay Jha, Stephen Simmonds, Jalal Elhusseini, Nicholas K. Yu, Safi Khan