Abstract: The present invention is a system and method for allowing an administrator of a computer network higher up in a hierarchical arrangement to define the scope of policies for the services offered, and users lower in the hierarchical arrangement to customize policies within the scope defined by the administrator. While defining policy rules, administrators classify them as scoping or non-scoping. Users lower in the hierarchical arrangement can then customize scoping rules by defining sub-rules. Policy rules have a condition part and an action part, and the sub-rules can be used to change the scope of the condition and action parts. The present invention adds all the non-scoping policy rules, all the scoping policy rules, and all the sub-rules (with their scope limited by the scoping rules) to a rules database. This rules database is then used by any policy enforcement engine to enforce policy rules.

Abstract: A wafer handling apparatus having input and output robotic systems directed by a programmed controller. Each system has components including a robot, a twist and rotate, and a carrier and automated carrier rail. The input system is for removing wafers from their wafer pod, placing them in the carrier and transporting them via the rail to a wafer processing area. The output system performs the reverse operation, taking wafers from a carrier following processing and placing them in a pod. Each robot includes a plurality of interconnected, articulated cantilevered arms. The last one of the arms has a wand on one end and a laser emitter detector on the other end, and operates in cooperation with the controller to provide location detection of system components. The controller also includes circuitry for sensing contact of the wand with an object by measuring the increased robot motor torque occurring upon contact.

Abstract: Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door.