Patents by Inventor Sanjay Kumar Nurugan

Sanjay Kumar Nurugan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Functionalized interface structure
    Publication number: 20170098598
    Abstract: An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.
    Type: Application
    Filed: September 21, 2016
    Publication date: April 6, 2017
    Inventors: Ralf OTREMBA, Edward Fuergut, Christian Kasztelan, Hsieh Ting Kuek, Teck Sim Lee, Sanjay Kumar Nurugan, Lee Shuang Wang