Abstract: A high-pressure liquid jet cutting system can include a hopper configured to contain an abrasive mixture that includes abrasive and an additive, and a cutting head configured to receive the abrasive mixture from the hopper and introduce the abrasive mixture into a high-pressure liquid jet. The system can further include a sensor configured to detect a characteristic of the abrasive mixture associated with the additive, and one or more processors operably connected to the sensor and configured to determine information about the abrasive based, at least in part, on the detected characteristic. The one or more processors can be configured to adjust or otherwise control operation of one or more components of the high-pressure liquid jet cutting system based, at least in part, on the information to, e.g., improve or optimize system performance.

Abstract: A sensor comprising a light emitter and light detector coupled directly with or formed directly on a lead frame and directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector wherein in some embodiments the gap can be filled with a light blocking barrier material.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector filled with a light blocking barrier.

Abstract: An optical sensor comprising a substrate. a silicon layer having an optical sensor. light transmissive material covering at least portions of the silicon layer, the optical sensor and the substrate; and an optical layer positioned above the light transmissive material. In some embodiments the optical layer can be a light filtering layer adapted and configured to selectively reflect, absorb or prohibit passage of light in a desired frequency range.

Abstract: An optical sensor comprising a substrate, a silicon layer having an optical sensor, light block material covering at least portions of said silicon layer and the substrate, defining a light pipe aperture above the optical sensor; and an optical layer positioned within the light pipe aperture. In some embodiments, the light pipe aperture is at least partially filled with a light transmissive material.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector filled with an infrared ink. In some embodiments, an infrared ink can cover at least a portion of a top surface of the sensor and define apertures above the light detector and/or light emitter.

Abstract: A sensor comprising a light emitter and light detector coupled directly with or formed directly on a lead frame and directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector wherein in some embodiments the gap can be filled with a light blocking barrier material.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector filled with a light blocking barrier.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light transmissive compound. A gap in the light transmissive compound between the light emitter and the light detector filled with an infrared ink. In some embodiments, an infrared ink can cover at least a portion of a top surface of the sensor and define apertures above the light detector and/or light emitter.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light blocking compound. The light blocking compound can be thick enough between the light emitter and light detector to block substantially all light emitted by the light emitter from reaching the light detector directly, but be thin enough above the light emitter and light detector to allow at least some level of light emitted by the light emitter to escape out of the sensor, be reflected by another object, re-enter the sensor, and survive passing through the light blocking compound to enter the light detector.

Abstract: The present invention is directed to a system that updates files with updated financial data. The system of the present invention is configured to receive from a user one or more selections of files (e.g., datastores of financial data utilized and/or referenced by financial reporting application for purposes of generating up-to-date financial reports) to be updated with updated financial data. The user is further enabled by the system of the present invention to schedule importations of updated financial data into each selected file. The system of the present invention also is configured to generate a report of complete file updates so that the user may more effectively monitor and review the file-updating processes.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light blocking compound. The light blocking compound can be thick enough between the light emitter and light detector to block substantially all light emitted by the light emitter from reaching the light detector directly, but be thin enough above the light emitter and light detector to allow at least some level of light emitted by the light emitter to escape out of the sensor, be reflected by another object, re-enter the sensor, and survive passing through the light blocking compound to enter the light detector.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light blocking compound. The light blocking compound can be thick enough between the light emitter and light detector to block substantially all light emitted by the light emitter from reaching the light detector directly, but be thin enough above the light emitter and light detector to allow at least some level of light emitted by the light emitter to escape out of the sensor, be reflected by another object, re-enter the sensor, and survive passing through the light blocking compound to enter the light detector.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light blocking compound. The light blocking compound can be thick enough between the light emitter and light detector to block substantially all light emitted by the light emitter from reaching the light detector directly, but be thin enough above the light emitter and light detector to allow at least some level of light emitted by the light emitter to escape out of the sensor, be reflected by another object, re-enter the sensor, and survive passing through the light blocking compound to enter the light detector.

Abstract: A sensor comprising a light emitter and light detector directly covered and encapsulated by a layer of light blocking compound. The light blocking compound can be thick enough between the light emitter and light detector to block substantially all light emitted by the light emitter from reaching the light detector directly, but be thin enough above the light emitter and light detector to allow at least some level of light emitted by the light emitter to escape out of the sensor, be reflected by another object, re-enter the sensor, and survive passing through the light blocking compound to enter the light detector.

Abstract: The present invention is directed to a system that updates files with updated financial data. The system of the present invention is configured to receive from a user one or more selections of files (e.g., datastores of financial data utilized and/or referenced by financial reporting application for purposes of generating up-to-date financial reports) to be updated with updated financial data. The user is further enabled by the system of the present invention to schedule importations of updated financial data into each selected file. The system of the present invention also is configured to generate a report of complete file updates so that the user may more effectively monitor and review the file-updating processes.

Abstract: A plastic package assembly method suitable for ferroelectric-based integrated circuits includes a strict thermal budget that reduces the time at temperature for four key processing steps: die attach cures, die coat cures, molding cures, and marking cures. The plastic package assembly method uses low temperature mold and die coat materials, as well as low temperature curable inks or laser marking in order to minimize degradation of electrical performance, thus improving yields and reliability. The assembly method uses a snap cure die attach step, a die coat followed by a room temperature cure, and formation of the plastic package with room temperature curable molding compounds not requiring a post mold cure. Front and back marking of the plastic package is accomplished using either an infrared or ultraviolet curable ink followed by minimum cure time at elevated temperature, or by using laser marking.

Abstract: A yield enhancement technique for integrated circuit processing which reduces the deleterious effects of H2O contamination which is absorbed by conventional dielectric films resulting in an undesired subsequent out-diffusion of hydrogen when the integrated circuit die is subsequently subjected to relatively high processing temperatures such as those experienced in CERDIP packaging. The technique disclosed comprises the formation of an interlevel dielectric layer having hydrophilic properties (for example, 7.5% phosphorus doped TEOS) at least partially surrounding a device on the integrated circuit which layer is then subjected to an annealing operation to drive off at least a portion of any moisture present therein.

Abstract: A yield enhancement technique for integrated circuit processing which reduces the deleterious effects of H.sub.2 O contamination which is absorbed by conventional dielectric films resulting in an undesired subsequent out-diffusion of hydrogen when the integrated circuit die is subsequently subjected to relatively high processing temperatures such as those experienced in CERDIP packaging. The technique disclosed comprises the formation of an interlevel dielectric layer having hydrophilic properties (for example, 7.5% phosphorus doped TEOS) at least partially surrounding a device on the integrated circuit which layer is then subjected to an annealing operation to drive off at least a portion of any moisture present therein.

Abstract: A test method for ferroelectric memories includes the steps of: functionally testing the ferroelectric memories to determine functional yield; storing the ferroelectric memories for at least eight hours; writing an initial pattern into the ferroelectric memories; baking the ferroelectric memories; reading the initial pattern to determine same state yield; writing an inverse pattern into the ferroelectric memories; reading the inverse pattern to determine opposite state yield; and again writing the initial pattern into the ferroelectric memories. The steps of baking, reading the initial pattern and writing the inverse pattern, and reading the inverse pattern and writing the initial pattern are repeated for a number of test cycles. The ferroelectric memories are baked at a temperature of about 150.degree. C. for a predetermined duration that is incremented with each successive test cycle.