Patents by Inventor Sanjeev Baluja
Sanjeev Baluja has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950384Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.Type: GrantFiled: January 31, 2023Date of Patent: April 2, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Akshay Gunaji, Uday Pai, Timothy J. Roggenbuck, Sanjeev Baluja, Kalesh Panchaxari Karadi, Tejas Ulavi
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Publication number: 20240096688Abstract: Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Applicant: Applied Materials, Inc.Inventors: Michael Robert Rice, Joseph AuBuchon, Sanjeev Baluja, Mandyam Sriram
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Patent number: 11923172Abstract: Processing chambers with a plurality of processing stations and individual wafer support surfaces are described. The processing stations and wafer support surfaces are arranged so that there is an equal number of processing stations and heaters. An RF generator is connected to a first electrode in a first station and a second electrode in a second station. A bottom RF path is formed by a connection between a first support surface and a second support surface.Type: GrantFiled: February 8, 2022Date of Patent: March 5, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Hari Ponnekanti, Tsutomu Tanaka, Mandyam Sriram, Dmitry A. Dzilno, Sanjeev Baluja, Mario D. Silvetti
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Publication number: 20240068095Abstract: Gas distribution apparatuses described herein include a mixing plate adjacent a back plate of a showerhead. The mixing plate has a back surface and a front surface defining a thickness of the mixing plate. The mixing plate has a mixing channel comprising a top portion and a bottom portion defining a mixing channel length and at least two gas inlets in fluid communication with the top portion of the mixing channel. The gas distribution apparatus also includes a mixer disposed within the thickness of the mixing plate in the top portion of the mixing channel. The mixer has a top plate and a mixer stem extending from the top plate and a plurality of blades positioned along the mixer stem length. Also provided are processing chambers including the gas distribution apparatuses described herein.Type: ApplicationFiled: August 29, 2022Publication date: February 29, 2024Applicant: Applied Materials, Inc.Inventors: Youngki Chang, Dhritiman Subha Kashyap, Rakesh Ramadas, Ashutosh Agarwal, Shashidhara Patel H B, Muhannad Mustafa, Sanjeev Baluja
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Publication number: 20240047256Abstract: Processing chambers, substrate supports, centering wafers and methods of center calibrating wafer hand-off are described. A centering wafer comprises a disc-shaped body having a top surface and a bottom surface defining a thickness, a center, an outer edge having an outer peripheral face, a first arc-shaped slit and a second arc-shaped slit. Embodiments of the disclosure advantageously provide the ability to use the centering wafer to monitor and control backside pressure and thereby determine the center of a substrate support prior to processing the centering wafer. The centering wafer may be centered at a plurality of different angles by rotating the centering wafer.Type: ApplicationFiled: August 2, 2022Publication date: February 8, 2024Applicant: Applied Materials, Inc.Inventors: Muhannad Mustafa, Sanjeev Baluja
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Patent number: 11894257Abstract: Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.Type: GrantFiled: October 26, 2018Date of Patent: February 6, 2024Assignee: Applied Materials, Inc.Inventors: Michael Rice, Joseph AuBuchon, Sanjeev Baluja, Mandyam Sriram
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Publication number: 20240018646Abstract: Embodiments disclosed herein include semiconductor processing tools. In an embodiment, the semiconductor processing tool comprises a chamber, a chuck within the chamber, where the chuck is configured to rotate, a pedestal holder around the chuck, and a utility column coupled to the chuck. In an embodiment, the utility column comprises a magnetic coupler to enable rotation of portions of the utility column and the chuck, and a rotary electrical feedthrough.Type: ApplicationFiled: July 14, 2022Publication date: January 18, 2024Inventors: ANANTHA SUBRAMANI, YANG GUO, JOHN FORSTER, WADE HARRELSON, ANDREW TOMKO, ANTHONY CHAN, SATHYA SWAROOP GANTA, MIKE MURTAGH, SANJEEV BALUJA
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Publication number: 20230407473Abstract: Embodiments of the present disclosure are related to directed to a pump liner for a process chamber. The pump liner is aligned with particular components in the process chamber so that there is an upper gap and a lower gap between the pump liner and the particular processing chamber components (e.g., an edge ring). The pump liner advantageously reduces side to side variation in temperature and gas flow based on its alignment with particular components in the process chamber (e.g., the edge ring) and the size of the upper gap and the lower gap. Some embodiments advantageously provide better precursor flow distribution for various process spacing between the showerhead and wafer.Type: ApplicationFiled: June 13, 2023Publication date: December 21, 2023Applicant: Applied Materials, Inc.Inventors: Muhannad Mustafa, Sanjeev Baluja
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Publication number: 20230407981Abstract: Variable orifice check valves comprising a flange with a guide pin, spring and movable plate are described. The flange has a body with at least one guide pin opening in the top surface. A guide pin is positioned within the at least one guide pin opening and a spring is positioned around the guide pin. The movable plate has an opening and slides along the guide pins with the spring between the top surface of the flange body and the bottom surface of the movable plate.Type: ApplicationFiled: June 21, 2023Publication date: December 21, 2023Applicant: Applied Materials, Inc.Inventors: Muhannad Mustafa, Sanjeev Baluja
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Patent number: 11818810Abstract: A heater assembly having a backside purge gap formed between a top plate and a heater of the heater assembly, the top plate having a top plate wall. The top plate wall having an upper portion, a middle portion and a lower portion, the middle portion forming an incline relative to the top portion.Type: GrantFiled: March 26, 2021Date of Patent: November 14, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Dhritiman Subha Kashyap, Amit Rajendra Sherekar, Kartik Shah, Ashutosh Agarwal, Eric J. Hoffmann, Sanjeev Baluja, Vijay D. Parkhe
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Patent number: 11791190Abstract: Substrate supports, substrate support assemblies and methods of using the substrate supports are described. The substrate support has a support surface with at least two electrodes and a plurality of purge channels bounded by a seal band. A power supply connected to the electrodes configured as an electrostatic chuck. A capacitance of the substrate is measured while on the substrate support to determine the chucking state of the substrate.Type: GrantFiled: May 7, 2021Date of Patent: October 17, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Tejas Ulavi, Arkaprava Dan, Mike Murtagh, Sanjeev Baluja
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Patent number: 11791136Abstract: In one embodiment, at least a processing chamber includes a perforated lid, a gas blocker disposed on the perforated lid, and a substrate support disposed below the perforated lid. The gas blocker includes a gas manifold, a central gas channel formed in the gas manifold, a first gas distribution plate comprising an inner and outer trenches surrounding the central gas channel, a first and second gas channels formed in the gas manifold, the first gas channel is in fluid communication with a first gas source and the inner trench, and the second gas channel is in fluid communication with the first gas source and the outer trench, a second gas distribution plate, a third gas distribution plate disposed below the second gas distribution plate, and a plurality of pass-through channels disposed between the second gas distribution plate and the third gas distribution plate.Type: GrantFiled: April 26, 2021Date of Patent: October 17, 2023Assignee: Applied Materials, Inc.Inventors: Sanjeev Baluja, Yi Yang, Truong Nguyen, Nattaworn Boss Nunta, Joseph F. Aubuchon, Tuan Anh Nguyen, Karthik Janakiraman
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Patent number: 11769684Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.Type: GrantFiled: December 13, 2022Date of Patent: September 26, 2023Assignee: Applied Materials, Inc.Inventors: Tejas Ulavi, Vijay D. Parkhe, Naveen Kumar Nagaraja, Sanjeev Baluja, Surajit Kumar, Dhritiman Subha Kashyap, Ashutosh Agarwal
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Patent number: 11746417Abstract: Gas distribution apparatus, processing chambers and methods using a dead volume-free valve are described. The valve has a first inlet line with upstream and downstream ends and a second inlet line with a downstream end that connects to the first inlet line. A sealing surface at the downstream end of the second inlet line separates the first inlet line from the second inlet line preventing fluid communication between the first inlet line and the second inlet line.Type: GrantFiled: September 20, 2022Date of Patent: September 5, 2023Assignee: Applied Materials, Inc.Inventors: Ashutosh Agarwal, Sanjeev Baluja
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Patent number: 11713508Abstract: Processing chambers and methods to disrupt the boundary layer are described. The processing chamber includes a showerhead and a substrate support therein. The showerhead and the substrate support are spaced to have a process gap between them. In use, a boundary layer is formed adjacent to the substrate support or wafer surface. As the reaction occurs at the wafer surface, reaction products and byproduct are produced, resulting in reduced chemical utilization rate. The processing chamber and methods described disrupt the boundary layer by changing one or more process parameters (e.g., pressure, flow rate, time, process gap or temperature of fluid passing through the showerhead).Type: GrantFiled: June 21, 2022Date of Patent: August 1, 2023Assignee: Applied Materials, Inc.Inventors: Kevin Griffin, Sanjeev Baluja, Joseph AuBuchon, Mario D. Silvetti, Hari Ponnekanti
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Publication number: 20230207345Abstract: Embodiments of the disclosure advantageously provide base plates with decreased metal contamination. Some embodiments of the disclosure advantageously provide base plates with increased edge purge channel uniformity. Some embodiments provide methods of forming base plates. Embodiments of the disclose are directed to a heater pedestal configured to support a substrate during processing. In some embodiments, the heater pedestal includes the base plate described herein.Type: ApplicationFiled: December 23, 2021Publication date: June 29, 2023Applicant: Applied Materials, Inc.Inventors: Muhannad Mustafa, Mario D. Silvetti, Michael Jerry Duret, Sanjeev Baluja, Satish Radhakrishnan, Yuan Xiaoxiong
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Patent number: 11682576Abstract: Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.Type: GrantFiled: June 21, 2022Date of Patent: June 20, 2023Assignee: Applied Materials, Inc.Inventors: Tejas Ulavi, Sanjeev Baluja, Dhritiman Subha Kashyap
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Publication number: 20230175131Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.Type: ApplicationFiled: January 31, 2023Publication date: June 8, 2023Applicant: Applied Materials, Inc.Inventors: Akshay Gunaji, Uday Pai, Timothy J. Roggenbuck, Sanjeev Baluja, Kalesh Panchaxari Karadi, Tejas Ulavi
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Publication number: 20230146837Abstract: Pedestal heater radiators, pedestal assemblies including the pedestal heater radiators and methods of decreasing deposition non-uniformity are described. The pedestal heater radiator has a first radiator body and a second radiator body with different emissivities. The first radiator body and second radiator body are sized and positioned to decrease the heat loss differential between sides of the pedestal.Type: ApplicationFiled: November 9, 2021Publication date: May 11, 2023Applicant: Applied Materials, Inc.Inventors: Muhannad Mustafa, Mario D. Silvetti, Mandyam Sriram, Sanjeev Baluja
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Publication number: 20230128297Abstract: Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.Type: ApplicationFiled: December 16, 2022Publication date: April 27, 2023Inventors: Kalyanjit GHOSH, Shailendra SRIVASTAVA, Tejas ULAVI, Yusheng ZHOU, Amit Kumar BANSAL, Sanjeev BALUJA