Patents by Inventor Sanjeev Balwant Sathe
Sanjeev Balwant Sathe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080119029Abstract: A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a compliant medium to relieve stresses caused by thermal expansion mismatch between chip and substrate. Modules comprising chip and thin film may be fabricated at the chip or wafer level. The upper surface of the thin film has an array of pads matching the array of pads on the chip or wafer while the lower surface has pads matching those of the substrate. The multilayer thin film is first formed on a temporary substrate and then the chip is to the thin film before release from the temporary substrate. After release, the module is ready for mounting to the second level packaging substrate, such as a chip carrier or PCB. Where the multilayer thin film is formed directly on a wafer, the wafer is then diced to form the module.Type: ApplicationFiled: January 17, 2008Publication date: May 22, 2008Inventors: David Vincent Caletka, Seungbae Park, Sanjeev Balwant Sathe
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Patent number: 7348261Abstract: A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a compliant medium to relieve stresses caused by thermal expansion mismatch between chip and substrate. Modules comprising chip and thin film may be fabricated at the chip or wafer level. The upper surface of the thin film has an array of pads matching the array of pads on the chip or wafer while the lower surface has pads matching those of the substrate. The multilayer thin film is first formed on a temporary substrate and then the chip is attached to the thin film before release from the temporary substrate. After release, the module is ready for mounting to the second level packaging substrate, such as a chip carrier or PCB. Where the multilayer thin film is formed directly on a wafer, the wafer is then diced to form the module.Type: GrantFiled: May 15, 2003Date of Patent: March 25, 2008Assignee: International Business Machines CorporationInventors: David Vincent Caletka, Seungbae Park, Sanjeev Balwant Sathe
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Patent number: 7026706Abstract: An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.Type: GrantFiled: February 4, 2004Date of Patent: April 11, 2006Assignee: International Business Machines CorporationInventors: William Infantolino, Li Li, Steven G. Rosser, Sanjeev Balwant Sathe
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Publication number: 20040155339Abstract: An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.Type: ApplicationFiled: February 4, 2004Publication date: August 12, 2004Applicant: International Business Machines CorporationInventors: William Infantolino, Li Li, Steven G. Rosser, Sanjeev Balwant Sathe
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Patent number: 6747331Abstract: An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.Type: GrantFiled: July 17, 2002Date of Patent: June 8, 2004Assignee: International Business Machines CorporationInventors: William Infantolino, Li Li, Steven G. Rosser, Sanjeev Balwant Sathe
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Publication number: 20040012086Abstract: An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.Type: ApplicationFiled: July 17, 2002Publication date: January 22, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William Infantolino, Li Li, Steven G. Rosser, Sanjeev Balwant Sathe
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Publication number: 20030199121Abstract: A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a compliant medium to relieve stresses caused by thermal expansion mismatch between chip and substrate. Modules comprising chip and thin film may be fabricated at the chip or wafer level. The upper surface of the thin film has an array of pads matching the array of pads on the chip or wafer while the lower surface has pads matching those of the substrate. The multilayer thin film is first formed on a temporary substrate and then the chip is attached to the thin film before release from the temporary substrate. After release, the module is ready for mounting to the second level packaging substrate, such as a chip carrier or PCB. Where the multilayer thin film is formed directly on a wafer, the wafer is then diced to form the module.Type: ApplicationFiled: May 15, 2003Publication date: October 23, 2003Inventors: David Vincent Caletka, Seungbae Park, Sanjeev Balwant Sathe
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Patent number: 6631078Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.Type: GrantFiled: January 10, 2002Date of Patent: October 7, 2003Assignee: International Business Machines CorporationInventors: David J. Alcoe, Varaprasad Venkata Calmidi, Krishna Darbha, Sanjeev Balwant Sathe
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Patent number: 6627998Abstract: A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a compliant medium to relieve stresses caused by thermal expansion mismatch between chip and substrate. Modules comprising chip and thin film may be fabricated at the chip or wafer level. The upper surface of the thin film has an array of pads matching the array of pads on the chip or wafer while the lower surface has pads matching those of the substrate. The multilayer thin film is first formed on a temporary substrate and then the chip is attached to the thin film before release from the temporary substrate. After release, the module is ready for mounting to the second level packaging substrate, such as a chip carrier or PCB. Where the multilayer thin film is formed directly on a wafer, the wafer is then diced to form the module.Type: GrantFiled: July 27, 2000Date of Patent: September 30, 2003Assignee: International Business Machines CorporationInventors: David Vincent Caletka, Seungbae Park, Sanjeev Balwant Sathe
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Publication number: 20030129863Abstract: A heat dissipating flexible or resilient standoff is mechanically clamped between an electronic module and substrate, such as, PCB. The clamping arrangement comprises a heat sink compressing a thermally conductive flexible interface pad over the upper surface of the electronic module by way of mechanical linkage to the PCB. The heat dissipating flexible standoff provides a force opposing the compression force to thereby reduce stress on solder ball connections between electronic module and PCB. Thermally conductive flexible standoffs in the form of spring arrangements, such as a wire mesh, act to provide heat dissipation by both thermal conduction and thermal convection. A thermally conductive flexible polymer pad and a layer of porous metal foam may also act as thermally conductive standoffs.Type: ApplicationFiled: January 10, 2002Publication date: July 10, 2003Applicant: International Business Machines CorporationInventors: David J. Alcoe, Varaprasad Venkata Calmidi, Krishna Darbha, Sanjeev Balwant Sathe
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Patent number: 6255136Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: January 5, 1999Date of Patent: July 3, 2001Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 6245186Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: January 5, 1999Date of Patent: June 12, 2001Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 6058015Abstract: An electronic package incorporating a heat-generating element which is thermally coupled to a heat-sinking member, through the utilization of a predetermined thermally conductive material, and wherein all of these components are placed in compression during package operation so as to resultingly improve the thermal performance of the electronic package. A method is set forth of improving the thermal performance of an electronic package through the intermediary of compressive forces being generated between the package components during package operation.Type: GrantFiled: June 9, 1999Date of Patent: May 2, 2000Assignee: International Business Machines Corp.Inventors: Bahgat Ghaleb Sammakia, Sanjeev Balwant Sathe
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Patent number: 6037658Abstract: An electronic package including as part thereof a thermally conductive arrangement for restricting thermal fluid material motion about a heat-generating device, thereby assuring effective heat transference from the heat-generating device (e.g., module) to a cooling member (e.g., spaced heat sink), this arrangement preferably including: (1) a thermal fluid (e.g., thermal grease); and (2) structural elements (e.g., wire mesh, heat sink ridges, etc.). For restricting fluid movement, sealing structures (e.g., external gaskets) may be used to further assure fluid containment to a specified location. Pressure generation means (e.g., a plunger) can be used to increase fluid pressure when pressure droppages occur.Type: GrantFiled: October 7, 1997Date of Patent: March 14, 2000Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Glenn Lee Kehley, Sanjeev Balwant Sathe, John Robert Slack
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Patent number: 5966290Abstract: An electronic package incorporating a heat-generating element which is thermally coupled to a heat-sinking member, through the utilization of a predetermined thermally conductive material, and wherein all of these components are placed in compression during package operation so as to resultingly improve the thermal performance of the electronic package. A method is set forth of improving the thermal performance of an electronic package through the intermediary of compressive forces being generated between the package components during package operation.Type: GrantFiled: September 3, 1997Date of Patent: October 12, 1999Assignee: Internatioinal Business Machines CorporationInventors: Bahgat Ghaleb Sammakia, Sanjeev Balwant Sathe
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Patent number: 5912800Abstract: A method of enhancing the passive thermal management of electronic packages, and an electronic package consisting of a vertically-oriented substrate, such as a printed circuit board or the like, a heat-generating electronic module, for example, containing at least one chip which is positioned on a substrate, and a cover plate located adjacent to the module at a predetermined spaced relationship therefrom. The cover plate includes at least one opening located adjacent the module at a predetermined location relative thereto so as to ensure a maximum cooling air flow impinging on the module, and which air flow thereafter passes upwardly between the substrate and the cover plate. The cover plate may be equipped with a heat-sink structure, such as fins, for cooling the module, which structure is adapted to project through the opening formed in the cover plate or to lie flush therewith.Type: GrantFiled: September 3, 1997Date of Patent: June 15, 1999Assignee: International Business Machines CorporationInventors: Bahgat Ghaleb Sammakia, Sanjeev Balwant Sathe
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Patent number: 5863814Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: July 1, 1997Date of Patent: January 26, 1999Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 5786635Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.Type: GrantFiled: December 16, 1996Date of Patent: July 28, 1998Assignee: International Business Machines CorporationInventors: David James Alcoe, Sanjeev Balwant Sathe
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Patent number: 5754400Abstract: A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.Type: GrantFiled: February 5, 1997Date of Patent: May 19, 1998Assignee: International Business Machines CorporationInventors: Sanjeev Balwant Sathe, Pratap Singh
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Patent number: 5673177Abstract: A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.Type: GrantFiled: August 1, 1995Date of Patent: September 30, 1997Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Glenn Lee Kehley, Sanjeev Balwant Sathe