Abstract: A system and method for quantitative image quality assessment for photogrammetry are disclosed.

Abstract: A system and method for using images from a commodity camera for object scanning, reverse engineering, metrology, assembly, and analysis are disclosed. A particular embodiment includes a mobile imaging system to: enable a user to align an object to be analyzed on a turntable with a stencil; issue commands, by use of a data processor, to the turntable for automatic rotation of the turntable and the object thereon to a particular orientation for a camera of a mobile imaging device; capture a plurality of images of the object being analyzed at different automatic rotations of the turntable; upload the plurality of images of the object to a server via a network interface and a data network; and cause the server to generate a three dimensional (3D) model of the object from the plurality of images of the object.

Abstract: A system and method for using images from a commodity camera for object scanning, reverse engineering, metrology, assembly, and analysis are disclosed. A particular embodiment includes a mobile imaging system to: enable a user to align an object to be analyzed on a turntable with a stencil; issue commands, by use of a data processor, to the turntable for automatic rotation of the turntable and the object thereon to a particular orientation for a camera of a mobile imaging device; capture a plurality of images of the object being analyzed at different automatic rotations of the turntable; upload the plurality of images of the object to a server via a network interface and a data network; and cause the server to generate a three dimensional (3D) model of the object from the plurality of images of the object.

Abstract: A system and method for using images from a commodity camera for object scanning, reverse engineering, metrology, assembly, and analysis are disclosed. A particular embodiment includes a mobile imaging system to: enable a user to align an object to be analyzed on a turntable with a stencil; issue commands, by use of a data processor, to the turntable for automatic rotation of the turntable and the object thereon to a particular orientation for a camera of a mobile imaging device; capture a plurality of images of the object being analyzed at different automatic rotations of the turntable; upload the plurality of images of the object to a server via a network interface and a data network; and cause the server to generate a three dimensional (3D) model of the object from the plurality of images of the object.

Abstract: A speckled calibration artifact to calibrate metrology equipment is disclosed. A particular embodiment includes a geometric solid having a smooth outer surface of a solid base color; and a speckled contrasting color applied on the outer surface of the geometric solid in a randomly speckled pattern enabling portions of the solid base color and portions of the contrasting color to be visible on the smooth outer surface of the geometric solid.

Abstract: A system and method for digital-representation-based flight path planning for object imaging is disclosed. An example embodiment is configured to: obtain a digital representation of an object; retrieve a dataset of image acquisition configuration parameters; extract a surface contour of the object from the digital representation of the object; generate a bounding polygon adjacent to the surface contour of the object, the bounding polygon being set-off from the surface contour of the object based on a configuration defined in the image acquisition configuration parameters; generate a configurable quantity of waypoints at configurable intervals along the bounding polygon; and generate an Image Acquisition Plan (IAP) from the waypoints, the IAP including, for each waypoint, a waypoint position, control instructions, and imaging instructions.

Abstract: A system and method for measurement of inflation pressure and load of tires from three-dimensional (3D) geometry measurements are disclosed.

Abstract: A system and method for quantitative image quality assessment for photogrammetry are disclosed.

Abstract: A system and method for performing visual inspection using synthetically generated images is disclosed. An example embodiment is configured to: receive one or more images of a compliant manufactured component; receive images of component defects; use the images of component defects to produce a variety of different synthetically-generated images of defects; combine the synthetically-generated images of defects with the one or more images of the compliant manufactured component to produce synthetically-generated images of a non-compliant manufactured component; and collect the one or more images of the compliant manufactured component with the synthetically-generated images of the non-compliant manufactured component into a training dataset to train a machine learning system.

Abstract: A system and method for using images from a commodity camera for object scanning, reverse engineering, metrology, assembly, and analysis are disclosed. A particular embodiment includes a mobile imaging system to: enable a user to align an object to be analyzed on a turntable with a stencil; issue commands, by use of a data processor, to the turntable for automatic rotation of the turntable and the object thereon to a particular orientation for a camera of a mobile imaging device; capture a plurality of images of the object being analyzed at different automatic rotations of the turntable; upload the plurality of images of the object to a server via a network interface and a data network; and cause the server to generate a three dimensional (3D) model of the object from the plurality of images of the object.

Abstract: A speckled calibration artifact to calibrate metrology equipment is disclosed. A particular embodiment includes a geometric solid having a smooth outer surface of a solid base color; and a speckled contrasting color applied on the outer surface of the geometric solid in a randomly speckled pattern enabling portions of the solid base color and portions of the contrasting color to be visible on the smooth outer surface of the geometric solid.

Abstract: A system and method for using images from a commodity camera for object scanning, reverse engineering, metrology, assembly, and analysis are disclosed. A particular embodiment includes a mobile imaging system to: enable a user to align an object to be analyzed on a turntable with a stencil; issue commands, by use of a data processor, to the turntable for automatic rotation of the turntable and the object thereon to a particular orientation for a camera of a mobile imaging device; capture a plurality of images of the object being analyzed at different automatic rotations of the turntable; upload the plurality of images of the object to a server via a network interface and a data network; and cause the server to generate a three dimensional (3D) model of the object from the plurality of images of the object.

Abstract: A system and method for using images from a commodity camera for object scanning, reverse engineering, metrology, assembly, and analysis are disclosed. A particular embodiment includes a mobile imaging system to: enable a user to align an object to be analyzed on a turntable with a stencil; issue commands, by use of a data processor, to the turntable for automatic rotation of the turntable and the object thereon to a particular orientation for a camera of a mobile imaging device; capture a plurality of images of the object being analyzed at different automatic rotations of the turntable; upload the plurality of images of the object to a server via a network interface and a data network; and cause the server to generate a three dimensional (3D) model of the object from the plurality of images of the object.

Abstract: A system and method for using images for automatic visual inspection with machine learning are disclosed. A particular embodiment includes an inspection system to: train a machine learning system to detect defects in an object based on training with a set of training images including images of defective and non-defective objects; enable a user to use a camera to capture a plurality of images of an object being inspected at different poses of the object; and detect defects in the object being inspected based on the plurality of images of the object being inspected and the trained machine learning system.

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

Abstract: A linear coefficient of thermal expansion (CTE) mismatch between two materials, such as between a microelectronic die and a mounting substrate, may induce stress at the interface of the materials. The temperature changes present during the process of attaching a die to a mounting substrate can cause cracking and failure in the electrical connections used to connect the die and mounting substrate. A material with a CTE approximately matching the die CTE is introduced in the mounting substrate to reduce the stress and cracking at the electrical connections between the die and mounting substrate. Additionally, this material may comprise thin film capacitors useful for decoupling power supplies.

Abstract: A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.

Abstract: An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In an alternative embodiment, the core material is selected based upon considerations such as it modulus, its coefficient of thermal expansion, and/or the resulting total accumulated strain. In an alternative embodiment, boundaries with respect to the softness of the core material are established be considering the reflective density in opposing conductive build-up layers above and below the core region.