Patents by Inventor Saori Ishigaki

Saori Ishigaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9241410
    Abstract: A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: January 19, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Saori Ishigaki, Jun Ishii, Yoshito Fujimura, Yuu Sugimoto
  • Patent number: 8835767
    Abstract: A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: September 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Saori Ishigaki, Hitoki Kanagawa, Yoshito Fujimura
  • Publication number: 20130014976
    Abstract: [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability. [Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.
    Type: Application
    Filed: May 31, 2012
    Publication date: January 17, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Saori ISHIGAKI, Jun ISHII, Yoshito FUJIMURA, Yuu SUGIMOTO
  • Publication number: 20120193127
    Abstract: A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 2, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Saori ISHIGAKI, Hitoki KANAGAWA, Yoshito FUJIMURA
  • Patent number: 8222530
    Abstract: A wired-circuit-board assembly sheet includes a plurality of wired circuit boards and a supporting sheet for supporting the wired circuit boards in an aligned state. Each of the wired circuit boards includes a distinguishing mark forming portion to be formed with a distinguishing mark for distinguishing between defectiveness and non-defectiveness of the wired circuit board. The distinguishing mark forming portion is divided by a weir portion for preventing the distinguishing mark from flowing out from the distinguishing mark forming portion.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: July 17, 2012
    Assignee: Nitto Denko Corporation
    Inventor: Saori Ishigaki
  • Publication number: 20110071377
    Abstract: A circuit board for body fluid collection includes a belt-like supporting substrate, and a plurality of measurement units defined in the supporting substrate along the longitudinal direction of the supporting substrate. The measurement units each include a puncture needle formed from the supporting substrate along the longitudinal direction of the supporting substrate by forming an opening in the supporting substrate, an insulating base layer formed on the supporting substrate, and a conductive layer formed on the insulating base layer and including an electrode for making contact with a body fluid collected by puncturing with the puncture needle.
    Type: Application
    Filed: January 9, 2009
    Publication date: March 24, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Tetsuya Ohsawa, Saori Ishigaki, Toshiki Naito
  • Publication number: 20100331730
    Abstract: A circuit board for body fluid collection includes a plurality of measurement units including a puncture needle and an electrode for making contact with a body fluid collected by puncturing with the puncture needle, the plurality of measurement units being arranged in parallel in a predetermined direction, and a support portion extending along the parallel arrangement direction and supporting the plurality of measurement units, wherein the support portion is rolled so that the plurality of measurement units can be disposed radially.
    Type: Application
    Filed: January 21, 2009
    Publication date: December 30, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshiki Naito, Saori Ishigaki, Tetsuya Ohsawa
  • Publication number: 20100175913
    Abstract: A wired-circuit-board assembly sheet includes a plurality of wired circuit boards and a supporting sheet for supporting the wired circuit boards in an aligned state. Each of the wired circuit boards includes a distinguishing mark forming portion to be formed with a distinguishing mark for distinguishing between defectiveness and non-defectiveness of the wired circuit board. The distinguishing mark forming portion is divided by a weir portion for preventing the distinguishing mark from flowing out from the distinguishing mark forming portion.
    Type: Application
    Filed: December 10, 2009
    Publication date: July 15, 2010
    Applicant: Nitto Denko Corporation
    Inventor: Saori Ishigaki