Abstract: There are provided optical bonding particles capable of improving the visibility and controlling gaps with high accuracy. The optical bonding particles according to the present invention include silicone particles and coating particles or a coating layer disposed on the surface of the silicone particles, and in the optical bonding particles, the absolute value of the difference between the refractive index of the silicone particles and the refractive index of the coating particles or the refractive index of the coating layer is 0.03 or less.

Abstract: Provided is a dimming laminate which can effectively suppress occurrence of color unevenness and light omission. The dimming laminate according to the present invention includes a first transparent base material, a second transparent base material, and a dimming layer disposed between the first transparent base material and the second transparent base material. In this dimming laminate, the dimming layer includes a resin spacer, the resin spacer is a plurality of resin particles, and the resin spacer does not contain resin particles having a particle diameter of 1.4 times or more an average particle diameter of the resin particles or contains 0.0006% or less of the resin particles having a particle diameter of 1.4 times or more the average particle diameter of the resin particles, relative to 100% of the whole number of the resin particles.

Abstract: Provided is a dimming laminate which can effectively suppress occurrence of color unevenness and light omission. The dimming laminate according to the present invention includes a first transparent base material, a second transparent base material, and a dimming layer disposed between the first transparent base material and the second transparent base material. In this dimming laminate, the dimming layer includes a resin spacer, the resin spacer is a plurality of resin particles, and the resin spacer does not contain resin particles having a particle diameter of 1.4 times or more an average particle diameter of the resin particles or contains 0.0006% or less of the resin particles having a particle diameter of 1.4 times or more the average particle diameter of the resin particles, relative to 100% of the whole number of the resin particles.

Abstract: There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.

Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

Abstract: Provided is a composition for bonding that forms, after bonding, an adhesive layer that is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test; also provided are an optical adhesive and an adhesive for pressure sensors, both of which comprise the composition. The composition for bonding comprises resin particles. The resin particles have a recovery rate of 20% or less, and a cured product of the composition with a thickness of 250±50 ?m has a moisture permeability of 90 g/m2-24 h or less. An adhesive layer formed from the composition for bonding is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test.

Abstract: Provided is a dimming laminate which can effectively suppress occurrence of color unevenness and light omission. The dimming laminate according to the present invention includes a first transparent base material, a second transparent base material, and a dimming layer disposed between the first transparent base material and the second transparent base material. In this dimming laminate, the dimming layer includes a resin spacer, the resin spacer is a plurality of resin particles, and the resin spacer does not contain resin particles having a particle diameter of 1.4 times or more an average particle diameter of the resin particles or contains 0.0006% or less of the resin particles having a particle diameter of 1.4 times or more the average particle diameter of the resin particles, relative to 100% of the whole number of the resin particles.

Abstract: Provided is a composition for bonding that forms, after bonding, an adhesive layer that is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test; also provided are an optical adhesive and an adhesive for pressure sensors, both of which comprise the composition. The composition for bonding comprises resin particles. The resin particles have a recovery rate of 20% or less, and a cured product of the composition with a thickness of 250±50 ?m has a moisture permeability of 90 g/m2-24 h or less. An adhesive layer formed from the composition for bonding is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test.

Abstract: Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm2 or more and 2000 N/mm2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: Provided is a composite particle capable of effectively suppressing the occurrence of color unevenness in a light-modulating material and effectively enhancing the light-modulating performance. The composite particle according to the present invention contains a pigment and has a particle diameter of 10 ?m or more and 100 ?m or less.

Abstract: Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more and 15000 N/mm2 or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.

Abstract: There is provided a light control laminate in which the gap between base materials can be controlled with high precision. The light control laminate according to the present invention includes a first transparent base material, a second transparent base material, and a light control layer arranged between the first transparent base material and the second transparent base material, and the light control layer contains plural resin spacers.

Abstract: The disclosed retroreflective sheet contains a retroreflective layer and a polyurethane surface protecting layer, wherein the surface protecting layer contains at least a reaction product of a polyol with either a polyester backbone or a polycarbonate backbone and a trifunctional or higher aliphatic isocyanate, and the glass transition temperature Tg of the surface protecting layer is 50° C. or higher, and the tan ? of the loss tangent at 120° C. is 0.1 or less.

Abstract: Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more and 15000 N/mm2 or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm2 or more and 2000 N/mm2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?or more and 15 ?m or loss, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.