Patents by Inventor Saragarvani Pakeriasamy

Saragarvani Pakeriasamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5979660
    Abstract: A chip carrier tube for packing and shipping of Flash miniature cards in a side-by-side arrangement includes a tubular body member (24), a first end stop member (26a), and a second end stop member (26b). The tubular body member has a first end and a second end. The tubular body member has a bore of a rectangular cross-section extending therethrough between the first end and the second end. The tubular body member includes an upper wall section (34), a lower wall section (36), and a pair of opposed side walls (38,40) all integrally connected together. There are provided a stepped end portion (50) formed on the lower wall section for supporting only a small portion of the bottom surface adjacent to the side edge opposite to a plurality of terminal leads of the miniature cards and a rib member supporting the plurality of terminal leads so that top and bottom surfaces thereof are substantially suspended freely between raised mid-portions on the respective upper and lower wall sections of the tubular member.
    Type: Grant
    Filed: June 5, 1997
    Date of Patent: November 9, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Saragarvani Pakeriasamy, Mohd Alkhadzari Harun
  • Patent number: 5957293
    Abstract: A dual-purpose carrier tray is specially adapted for packing and shipping either a plurality of ceramic substrates and/or ceramic BGA packages. The carrier tray includes a tray member having a plurality of pockets disposed therein for packing and storing the plurality of ceramic substrates and/or ceramic BGA packages. Semicircularly depressed support members are provided to support only the lower surface adjacent corresponding corners of the plurality of ceramic substrates and/or ceramic BGA packages. A plurality of stand-offs are provided for contactly engaging only the top surface of the plurality of substrates and/or BGA packages adjacent its corners in a lower tray member when stacked so as to retain firmly the substrates and/or BGA packages in the pockets.
    Type: Grant
    Filed: May 4, 1998
    Date of Patent: September 28, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Saragarvani Pakeriasamy
  • Patent number: 5857573
    Abstract: A PCMCIA card carrier for packing and shipping of a plurality of PCMCIA cards in a vertical side-by-side arrangement is formed of a tray member and a cover member. The tray member includes a plurality of first vertical slots disposed therein. A plurality of PCMCIA cards are disposed in the plurality of first vertical slots. The cover member has a plurality of second vertical slots disposed therein which are vertically aligned with corresponding ones of the first vertical slots in the tray member when the cover member is placed on top of the tray member. The tray and cover members have ledge portions in which are formed interlocking members so as to latch together the cover member with the tray member.
    Type: Grant
    Filed: January 15, 1998
    Date of Patent: January 12, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Saragarvani Pakeriasamy
  • Patent number: 5848702
    Abstract: A .mu.BGA carrier for packing and shipping of a plurality of .mu.BGA packages is specially adapted for facilitating the inspection of the solder balls on the bottom surfaces of the .mu.BGA packages. The carrier consists of a tray member having a plurality of first pockets disposed therein for packing and storing the plurality of .mu.BGA packages, and a lid member having a plurality of second pockets formed therein. The second pockets are vertically aligned with corresponding ones of the plurality of first pockets in the tray member when the lid member is placed on top of the tray member. The carrier can be flipped upside-down so that when the tray member is removed the solder balls are facing upwardly to allow inspection of the same.
    Type: Grant
    Filed: June 5, 1997
    Date of Patent: December 15, 1998
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Saragarvani Pakeriasamy
  • Patent number: 5435446
    Abstract: A BGA carrier for storing and shipping of BGA packages in a side-by-side arrangement adapted for dispensing of the same in a one-by-one fashion under gravity includes a flat elongated tubular body member (22), a lower end plug member (24), and an upper end plug member (26). The tubular body member has a first end and a second end. The tubular body member has a bore of a rectangular cross-section extending therethrough between the first end and the second end. The tubular body member includes a flat top wall portion (29), a flat bottom wall portion (30), and a pair of vertically extending side walls (32, 34) all formed integrally together. Opposed overhanging slot means (36) are formed in the pair of vertically extending side walls for supporting only two side edges of a plurality of BGA packages (12) so that top and bottom surfaces thereof are suspended freely between the top and bottom wall portions of the tubular body member.
    Type: Grant
    Filed: November 26, 1993
    Date of Patent: July 25, 1995
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Mohsen Hosseinmardi, Saragarvani Pakeriasamy, Mokhtar Ghani