Abstract: An item may be formed from structures that include holes. Stitching may be used to form a seam that joins the structures. The stitching may be formed from a chain stitch that passes through the holes. The holes may be formed from loops of knit fabric or other holes. Leather layers, polymer layers, fabric layers, and other structures with holes may be joined using the stitching. During fabrication, a layer of material with holes may be placed on an adjustable-shape fixture having a bed of needles. The shape of the bed of nails in the adjustable-shape fixture may then be changed. After the fixture has been used to transform the shape of one or more of the structures, the structures may be placed on needles in an assembly fixture and the stitching between the structures may be formed. The item may be an electronic device cover or other item.

Abstract: A method of using an oscillating accessory with an oscillating power tool may include providing an attachment member. The attachment member may include an attachment plate, a raised rim portion extending from the attachment plate, the raised rim having a central recess, a keyed sidewall with an at least partially star shape configured to be engaged by a first mating geometry of an oscillating power tool, and a top wall that includes a receiving portion having a plurality of recesses configured to be engaged by a second mating geometry of an oscillating power tool. The central recess may not be in communication with any of the plurality of recesses. The attachment member may be used to facilitate tool-free attachment of a working portion to the oscillating power tool via a clamp assembly having a first clamp member moveable relative to a second clamp member without use of a secondary tool.

Abstract: An accessory for use with an oscillating power tool includes an attachment portion having a first planar member, a second planar member parallel to the first planar member, a central opening defined in one of the first planar member and the second planar member, a keyed sidewall disposed at least partially around the central opening and extending from the first planar member to the second planar member transverse to the first planar member and to the second planar member, and a plurality of equiangularly spaced recesses defined in one of the first planar member and the second planar member, the recesses spaced apart from the keyed sidewall and not in communication with the central opening. A working portion may be couplable to the attachment portion and configured to perform an operation on a workpiece.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: An item may be formed from structures that include holes. Stitching may be used to form a seam that joins the structures. The stitching may be formed from a chain stitch that passes through the holes. The holes may be formed from loops of knit fabric or other holes. Leather layers, polymer layers, fabric layers, and other structures with holes may be joined using the stitching. During fabrication, a layer of material with holes may be placed on an adjustable-shape fixture having a bed of needles. The shape of the bed of nails in the adjustable-shape fixture may then be changed. After the fixture has been used to transform the shape of one or more of the structures, the structures may be placed on needles in an assembly fixture and the stitching between the structures may be formed. The item may be an electronic device cover or other item.

Abstract: An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

Abstract: An accessory for use with an oscillating power tool includes an attachment portion having a first planar member, a second planar member parallel to the first planar member, a central opening defined in one of the first planar member and the second planar member, a keyed sidewall disposed at least partially around the central opening and extending from the first planar member to the second planar member transverse to the first planar member and to the second planar member, and a plurality of equiangularly spaced recesses defined in one of the first planar member and the second planar member, the recesses spaced apart from the keyed sidewall and not in communication with the central opening. A working portion may be couplable to the attachment portion and configured to perform an operation on a workpiece.

Abstract: A structural member having an internal geometry capable of receive an object and substantially seamless outer surfaces, and that is obtainable by a method that includes providing several small plates, welding together the small plates, removing the weld residue, and polishing an outer surface of the structural member to achieve a certain desired visual effect. A middle plate, or several middle plates, may be positioned between a first plate and a second plate. The middle portion occupied by the middle plates includes an opening, cavity, and/or channel. The opening, cavity, and/or channel may receive a cable from an electronic device, or house a component. The plates and the opening, cavity, and/or channels between the plates, generally have a small form factor, and accordingly, require an assembly process to create the opening, cavity, and/or channels rather than using traditional drilling and/or milling techniques.

Abstract: An accessory for use with an oscillating power tool includes an attachment plate and a raised annular rim extending from the attachment plate. The raised annular rim has a central recess and a keyed sidewall with a star shape configured to be engaged by a first mating geometry of an oscillating power tool. The raised annular rim may further include a receiving portion formed thereon configured to be engaged by a second mating geometry of an oscillating power tool.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

Abstract: A method for manufacturing an enclosure for an electronic device using laser texturing to create a first surface having different surface characteristics than a second surface adjacent to the first surface.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

Abstract: An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

Abstract: A clamp arrangement for securing an accessory to an oscillating power tool can include a clamp assembly including a first clamp member that moves relative to the accessory between a closed position wherein the clamp assembly retains the accessory and an open position wherein the first clamp is offset from the accessory permitting removal of the first accessory from the clamp assembly. The clamp assembly can further comprise a second clamp member having a first portion that opposes the first clamp member and cooperates with the first clamp member to clamp the accessory between the first and second clamp members. An attachment plate can carry the clamp assembly. The attachment plate can have a first mating detail formed thereon that is configured to selectively and removably mate with a complementary second mating detail on the power tool in an assembled position.

Abstract: A structural member having an internal geometry capable of receive an object and substantially seamless outer surfaces, and that is obtainable by a method that includes providing several small plates, welding together the small plates, removing the weld residue, and polishing an outer surface of the structural member to achieve a certain desired visual effect. A middle plate, or several middle plates, may be positioned between a first plate and a second plate. The middle portion occupied by the middle plates includes an opening, cavity, and/or channel. The opening, cavity, and/or channel may receive a cable from an electronic device, or house a component. The plates and the opening, cavity, and/or channels between the plates, generally have a small form factor, and accordingly, require an assembly process to create the opening, cavity, and/or channels rather than using traditional drilling and/or milling techniques.

Abstract: A clamp arrangement for securing an accessory to an oscillating power tool can include a clamp assembly including a first clamp member that moves relative to the accessory between a closed position wherein the clamp assembly retains the accessory and an open position wherein the first clamp is offset from the accessory permitting removal of the first accessory from the clamp assembly. The clamp assembly can further comprise a second clamp member having a first portion that opposes the first clamp member and cooperates with the first clamp member to clamp the accessory between the first and second clamp members. An attachment plate can carry the clamp assembly. The attachment plate can have a first mating detail formed thereon that is configured to selectively and removably mate with a complementary second mating detail on the power tool in an assembled position.