Patents by Inventor Sarawut Waiyawong

Sarawut Waiyawong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and devices for acheiving high throughput attachment and sub-micron alignment of components
    Patent number: 10297276
    Abstract: Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: May 21, 2019
    Assignee: WESTERN DIGITAL (FREMONT), LLC
    Inventors: Wachira Puttichaem, Sarawut Waiyawong
  • SYSTEMS AND DEVICES FOR ACHIEVING HIGH THROUGHPUT ATTACHMENT AND SUB-MICRON ALIGNMENT OF COMPONENTS
    Publication number: 20180141167
    Abstract: Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
    Type: Application
    Filed: January 17, 2018
    Publication date: May 24, 2018
    Inventors: WACHIRA PUTTICHAEM, SARAWUT WAIYAWONG
  • Systems and devices for achieving high throughput attachment and sub-micron alignment of components
    Patent number: 9902023
    Abstract: Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: February 27, 2018
    Assignee: Western Digital (Fremont), LLC
    Inventors: Wachira Puttichaem, Sarawut Waiyawong