Patents by Inventor Sarkis Minas Keshishian
Sarkis Minas Keshishian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11518082Abstract: Plasma applications are disclosed that operate with argon or helium at atmospheric pressure, and at low temperatures, and with high concentrations of reactive species in the effluent stream. Laminar gas flow is developed prior to forming the plasma and at least one of the electrodes can be heated which enables operation at conditions where the argon or helium plasma would otherwise be unstable and either extinguish, or transition into an arc. The techniques can be employed to clean and activate a metal substrate, including removal of oxidation, thereby enhancing the bonding of at least one other material to the metal.Type: GrantFiled: September 10, 2020Date of Patent: December 6, 2022Assignee: Surfx Technologies LLCInventors: Siu Fai Cheng, Thomas Scott Williams, Toby Desmond Oste, Sarkis Minas Keshishian, Robert F. Hicks
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Patent number: 10800092Abstract: Plasma applications are disclosed that operate with argon or helium at atmospheric pressure, and at low temperatures, and with high concentrations of reactive species in the effluent stream. Laminar gas flow is developed prior to forming the plasma and at least one of the electrodes can be heated which enables operation at conditions where the argon or helium plasma would otherwise be unstable and either extinguish, or transition into an arc. The techniques can be employed to clean and activate a metal substrate, including removal of oxidation, thereby enhancing the bonding of at least one other material to the metal.Type: GrantFiled: July 23, 2018Date of Patent: October 13, 2020Assignee: Surfx Technologies LLCInventors: Siu Fai Cheng, Thomas Scott Williams, Toby Desmond Oste, Sarkis Minas Keshishian, Robert F. Hicks
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Patent number: 10032609Abstract: Plasma applications are disclosed that operate with helium or argon at atmospheric pressure, and at low temperatures, and with high concentrations of reactive species in the effluent stream. Laminar gas flow is developed prior to forming the plasma and at least one of the electrodes is heated which enables operation at conditions where the helium plasma would otherwise be unstable and either extinguish, or transition into an arc. The techniques can be employed to remove organic materials from a substrate, thereby cleaning the substrate; activate the surfaces of materials thereby enhancing adhesion between the material and an adhesive; kill microorganisms on a surface, thereby sterilizing the substrate; etches thin films of materials from a substrate, and deposit thin films and coatings onto a substrate.Type: GrantFiled: June 29, 2016Date of Patent: July 24, 2018Assignee: Surfx Technologies LLCInventors: Siu Fai Cheng, Thomas Scott Williams, Toby Desmond Oste, Sarkis Minas Keshishian, Robert F. Hicks
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Patent number: 9406485Abstract: An argon and helium plasma apparatus and method are disclosed that operate with argon or helium at atmospheric pressure, and at low temperatures, and with high concentrations of reactive species in the effluent stream. Laminar gas flow is developed prior to forming the plasma and at least one of the electrodes is heated which enables operation at conditions where the argon or helium plasma would otherwise be unstable and either extinguish, or transition into an arc. The apparatus and method can be employed to remove organic materials from a substrate, thereby cleaning the substrate; activate the surfaces of materials thereby enhancing adhesion between the material and an adhesive; kill microorganisms on a surface, thereby sterilizing the substrate; etches thin films of materials from a substrate, and deposit thin films and coatings onto a substrate.Type: GrantFiled: December 18, 2014Date of Patent: August 2, 2016Assignee: Surfx Technologies LLCInventors: Siu Fai Cheng, Thomas Scott Williams, Toby Desmond Oste, Sarkis Minas Keshishian, Robert F. Hicks
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Patent number: 8444252Abstract: A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.Type: GrantFiled: December 20, 2010Date of Patent: May 21, 2013Assignee: Zamtec LtdInventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Publication number: 20110085010Abstract: A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.Type: ApplicationFiled: December 20, 2010Publication date: April 14, 2011Inventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Patent number: 7875139Abstract: A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.Type: GrantFiled: May 19, 2010Date of Patent: January 25, 2011Assignee: Silverbrook Research Pty LtdInventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Patent number: 7845755Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.Type: GrantFiled: March 17, 2008Date of Patent: December 7, 2010Assignee: Silverbrook Research Pty LtdInventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Patent number: 7845763Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.Type: GrantFiled: March 17, 2008Date of Patent: December 7, 2010Assignee: Silverbrook Research Pty LtdInventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Publication number: 20100224319Abstract: A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.Type: ApplicationFiled: May 19, 2010Publication date: September 9, 2010Inventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Patent number: 7727348Abstract: A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C.Type: GrantFiled: March 17, 2008Date of Patent: June 1, 2010Assignee: Silverbrook Research Pty LtdInventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Publication number: 20090231384Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.Type: ApplicationFiled: March 17, 2008Publication date: September 17, 2009Inventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Publication number: 20090229744Abstract: A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C.Type: ApplicationFiled: March 17, 2008Publication date: September 17, 2009Inventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Publication number: 20090231400Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.Type: ApplicationFiled: March 17, 2008Publication date: September 17, 2009Inventors: Sarkis Minas Keshishian, Susan Williams, Paul Andrew Papworth, Kia Silverbrook
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Patent number: 6740447Abstract: A charge storage device includes a layered strip which is folded lengthways along fold lines (14, 15) in the directions indicated by arrows (16, 17) to form a folded layered strip (18). Strip (18) is then cut to a predetermined length (19). After the proportions of activated and conductive carbon, and the thickness of the paste, have been settled the length to which strip (18) is cut is the final determining factor for the capacitance, time constant, power density and energy density of the charge storage device. The cut length (19) is then folded crossways along fold lines (20, 21) in the directions indicated by respective arrows (22, 23) to form a twice folded structure (24).Type: GrantFiled: October 11, 2000Date of Patent: May 25, 2004Assignee: Energy Storage Systems PTY LTDInventor: Sarkis Minas Keshishian
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Patent number: 6275372Abstract: An energy storage device in the form of a cylindrical double layer capacitor (1) includes a plurality of integrally formed first electrode members (2) which each extend between a first end (3) and a second end (4). A plurality of integrally formed second electrode members (5) each extend between a third end (6) and a fourth end (7). As shown, members (5) are interleaved with members (2) such that ends (7) are located intermediate ends (3, 4) of the adjacent members (2). An insulator in the form of carbon layer (8) are disposed between adjacent members (2, 5) to prevent electrical contact therebetween. First contact means in the form of flanges (11) extend from respective ends (3) of each member (2) and electrically connect all the first members. Flanges (11) provide a site for the metallisation of particles thereupon. Those particles form a porous connection layer (12) for an electrical terminal (13) for members (2). Flanges (11) also form a barrier against the ingress of the particles beyond ends (3).Type: GrantFiled: March 9, 2000Date of Patent: August 14, 2001Assignees: Energy Storage Systems Pty. Ltd., Commonwealth Scientific Industrial Research OrganisationInventors: Anthony Michael Vassallo, Sarkis Minas Keshishian