Abstract: Sensing patch systems are disclosed herein. A sensing patch system includes a flexible substrate and a sensor node. The flexible substrate includes one or more substrate sensors configured to provide sensor data, one or more substrate conductors electrically coupled to a corresponding substrate sensor to conduct the sensor data provided by the corresponding substrate sensor, and a node interface. The sensor node includes a substrate interface configured to receive the node interface of the flexible substrate. The sensor node is configured to receive the sensor data provided by the substrate sensors, process the sensor data, and communicate the processed sensor data to a remote device.

Abstract: In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

Abstract: Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

Abstract: Examples of an electronic package include a package assembly. The package assembly can include a substrate having a first substrate surface that includes a conductive layer attached to the first substrate surface. The package assembly includes a die communicatively coupled to the conductive layer and a contact block that includes a first contact surface on one end of the contact block, a second contact surface on an opposing side of the contact block, and a contact block wall extended therebetween. The contact block can include a conductive material. The first contact surface can be coupled to the package assembly with a joint extended partially up the contact block wall. The electronic package can further include an overmold covering portions of the substrate, conductive layer, and die. The second contact surface of the contact block can be exposed through the overmold.

Abstract: Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.

Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.

Abstract: Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.

Abstract: Embodiments of the invention include an active mm-wave interconnect. In an embodiment, the active mm-wave inter-connect includes a dielectric waveguide that is coupled to a first connector and a second connector. According to an embodiment, each of the first and second connectors may include a mm-wave engine. In an embodiment, the mm-wave engines may include a power management die, a modulator die, a demodulator die, a mm-wave transmitter die, and a mm-wave receiver die. Additional embodiments may include connectors that interface with predefined interfaces, such as small form-factor pluggables (SFP), quad small form-factor pluggables (QSFP), or octal small form-factor pluggables (OSFP). Accordingly, embodiments of the invention allow for plug and play functionality with existing servers and other high performance computing systems.

Abstract: Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.

Abstract: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

Abstract: A millimeter wave (mm-wave) communication interface includes a first semiconductor package coupled to a first substrate and a second semiconductor package coupled to a second substrate. The second substrate may be coupled at approximately a 90° angle to the first substrate. The second semiconductor package may include a mm-wave die that modulates digital data on a high frequency microwave signal and a mm-wave launcher that launches the modulated high-frequency microwave signal into a waveguide member operably coupled to the second substrate. In such an implementation, the waveguide member may beneficially exit the second substrate along a longitudinal axis parallel to the principal plane of the first substrate. Advantageously, all high-frequency components are close coupled to the second substrate without the use of an intervening interface.

Abstract: Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.

Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slidably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.

Abstract: A device for harvesting energy from fabric or clothing includes a piece of fabric or clothing. One or more piezoelectric harvesters are coupled with the piece of fabric or clothing. The piezoelectric harvesters are capable of producing electric energy in response to the movement of the piece of fabric or clothing. Additionally, the device includes one or more energy storage mediums coupled to the one or more piezoelectric harvesters. The energy storage mediums are capable of storing the energy produced by the one or more piezoelectric harvesters. Further, the method for harvesting energy from fabric or clothing involves moving a piece of fabric such that one or more piezoelectric harvesters generate electricity. The method for harvesting energy from fabric or clothing also involves storing the generated electricity in one or more energy storage mediums.

Abstract: Sensing patch systems are disclosed herein. A sensing patch system includes a flexible substrate and a sensor node. The flexible substrate includes one or more substrate sensors configured to provide sensor data, one or more substrate conductors electrically coupled to a corresponding substrate sensor to conduct the sensor data provided by the corresponding substrate sensor, and a node interface. The sensor node includes a substrate interface configured to receive the node interface of the flexible substrate. The sensor node is configured to receive the sensor data provided by the substrate sensors, process the sensor data, and communicate the processed sensor data to a remote device.

Abstract: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

Abstract: Devices and methods include an electronic package having a through-mold interconnect are shown herein. Examples of the electronic package include a package assembly. The package assembly including a substrate having a first substrate surface. The first substrate surface including a conductive layer attached to the first substrate surface. The package assembly includes a die communicatively coupled to the conductive layer and a contact block. The contact block including a first contact surface on one end of the contact block, a second contact surface on an opposing side of the contact block, and a contact block wall extended therebetween. The contact block includes a conductive material. The first contact surface is coupled to the package assembly with a joint extended partially up the contact block wall. The electronic package further includes an overmold covering portions of the substrate, conductive layer, and die. The second contact surface of the contact block is exposed through the overmold.

Abstract: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

Abstract: A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.