Abstract: It is an object of the invention to provide for a system than can help in using medical imaging systems in an improved way by at least one of reducing operating costs of the medical imaging systems or by improving image quality. This object is achieved by a medical imaging system management arrangement comprising one or more medical imaging systems configured to acquire medical imaging data, wherein the medical imaging systems have a current performance and/or an expected future performance. The medical imaging system management arrangement further comprises a central unit connected to the one or more medical imaging systems via a data link. The one or more medical imaging systems are configured to send performance data related to the current and/or the expected future performance to the central unit, wherein the central unit further comprises an analyzer configured to analyze the performance data and provide it to a user.

Abstract: It is an object of the invention to provide for a system that can help in using medical imaging systems in an improved way by reducing operating costs of the medical imaging systems or by improving image quality. This object is achieved by a medical imaging system management arrangement comprising multiple medical imaging systems configured to acquire medical imaging data according to an imaging protocol. The medical imaging system management arrangement also comprises a central unit connected to the multiple medical imaging systems via a data link. The central unit comprises a database comprising imaging protocols, wherein the central unit is configured to distribute imaging protocols to the multiple medical imaging systems and wherein the remote medical imaging system management arrangement is configured such that adaptation of the imaging protocols is restricted or impossible at the locations of the multiple medical imaging systems.

Abstract: A transfer device for holding an object comprises: i) a housing; ii) at least one inlet conduit having an inlet for gas; iii) a plurality of sets of outlet conduits, each set of outlet conduits being in fluid communication with the at least one inlet conduit and having a plurality of outlets for directing the gas out of the outlet conduits. The respective outlets of the sets of outlet conduits are arranged in a direction along the housing surface and away from a center region relative to the respective sets of outlet conduits, so that a laminar gas flow that flows along the housing surface generates a pressure differential which creates a force towards the center region to hold the object against the housing surface.

Abstract: Disclosed is a transfer device for holding an object. The transfer device comprises: i) a housing having a housing surface; ii) at least one inlet conduit having an inlet for introducing a gas into the at least one inlet conduit; iii) a plurality of sets of outlet conduits, each set of outlet conduits being in fluid communication with the at least one inlet conduit and having a plurality of outlets for directing the gas out of the outlet conduits. In particular, the respective outlets of the sets of outlet conduits are arranged in a direction along the housing surface and away from a centre region relative to the respective sets of outlet conduits, so that a laminar gas flow that is flows along the housing surface generates a pressure differential which creates a force towards the centre region to hold the object against the housing surface. A gang picker is also disclosed.

Abstract: A graphical visualization tool is disclosed that enables a user to graphically define multiple pre-scan volumes on a localizer image. The tool automatically determines appropriate shim values for both pre-scan volumes. Additionally, the tool displays the pre-scanned volumes on the localizer image such that the user knows that the slices/slabs for high resolution imaging are positioned in the region where the user wants the center frequency to lie.

Abstract: A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

Abstract: A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

Abstract: A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding tool and the ultrasonic generator for supporting the horn whereby to increase its dynamic rigidity in directions transverse to the longitudinal axis.

Abstract: A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

Abstract: A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

Abstract: An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet positionable adjacent to the first die is configured to project a hot gas onto bond pads of the first die for bringing the bond pads to a desired bonding temperature, thereby rapidly heating the first die for effective wire bonding.

Abstract: A bonding apparatus such as an ultrasonic transducer is provided that comprises an oscillation amplification device having a longitudinal axis and a substantially triangular cross-sectional area on a plane that is orthogonal to the longitudinal axis. An ultrasonic driver is coupled to the oscillation amplification device at a first position along the longitudinal axis and a bonding tool is mounted to the oscillation amplification device at a second position along the longitudinal axis spaced from the first position.

Abstract: A support structure supporting a movable component is provided with a vibration damper in the form of at least one cavity in the structure, the cavity being filled with a composite material; preferably a composite material of about 80% butyl rubber and 20% carbon particles. The composite material is preferably bonded to the cavity walls by adhesive or mechanically coupled by a texture on the cavity walls. The rubber composite may be first moulded then inserted into the cavity or may be injected into the cavity and moulded by the cavity. The cavities may be provided with a vent to facilitate insertion or injection of the composite material.

Abstract: A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to allow the tool to be inserted into, or removed from, the tool holder. The arms may be covered by protective walls, in which case an end wall is provided with an aperture to allow the wedge to access a slot between the arms.

Abstract: A transducer horn for holding a tool, such as a capillary, for a wire bonder has a pair of resilient arms which flex to clamp about a tool placed in a passage between the arms. The arms have free distal ends between which a wedge is inserted to open the passage to allow the tool to be inserted into, or removed from, the tool holder. The arms may be covered by protective walls, in which case an end wall is provided with an aperture to allow the wedge to access a slot between the arms.

Abstract: A support structure supporting a movable component is provided with a vibration damper in the form of at least one cavity in the structure, the cavity being filled with a composite material; preferably a composite material of about 80% butyl rubber and 20% carbon particles. The composite material is preferably bonded to the cavity walls by adhesive or mechanically coupled by a texture on the cavity walls. The rubber composite may be first moulded then inserted into the cavity or may be injected into the cavity and moulded by the cavity. The cavities may be provided with a vent to facilitate insertion or injection of the composite material.