Abstract: Systems and methods for providing the assembly electrochemical cells in neutral materials are described. Components can be eliminated from traditional electrochemical cell designs in this fashion. Embodiments of assemblies include a module block formed of a neutral material including a plurality of cell cavities, the cell cavities having at least an open top end. Each of the plurality of cell cavities is configured as a cell case for an electrochemical cell. The cavities can be provided a feed-through assembly, or have an electrochemical cell assembled therein.

Abstract: The disclosure relates to a Coriolis mass flowmeter with an oscillatable straight measuring tube consisting of a corrosion-resistant metal, in particular of titanium or a titanium alloy, to which are attached mounted parts connected directly to the measuring tube for the implementation of the Coriolis measurement principle. Furthermore, stabilizing elements running parallel to the measuring tube are coupled to the measuring tube via mounted parts connected directly to the measuring tube, the mounted parts and the stabilizing elements consisting of a metal other than that of the measuring tube. The stabilizing elements are manufactured from a second material which possesses a coefficient of thermal expansion adapted to the metal of the measuring tube. The mounted parts connected directly to the measuring tube are manufactured from a third material which possesses a higher coefficient of thermal expansion than the metal of the measuring tube.

Abstract: The high-power pack semiconductor module (1) comprises a layer (3, 4), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, (2), said layer being made of a metal matrix composite material whose coefficient of thermal expansion can be tailored to a value either close or matching that of Si.

Abstract: A first electronic component, e.g., a semiconductor die and a second electronic component, e.g., a substrate, each with a main surface, are bonded to each other by applying at least one metal layer comprising an indium layer on each of the main surfaces. Then the semiconductor die and the substrate are aligned against each other with their main surfaces facing each other. The die and substrate with the metal layers in between form an arrangement, which is introduced into a compression means. Afterwards the arrangement is compressed in the compression means at a pressure in a range of 10 to 35 MPa, and heat in a range of 230 to 275° C. is applied to the arrangement, by which temperature and pressure the electronic components are bonded to each other. The compression process is performable in oxygeneous gas atmosphere inside the compression means.

Abstract: The disclosure relates to a Coriolis mass flowmeter with an oscillatable straight measuring tube consisting of a corrosion-resistant metal, in particular of titanium or a titanium alloy, to which are attached mounted parts connected directly to the measuring tube for the implementation of the Coriolis measurement principle. Furthermore, stabilizing elements running parallel to the measuring tube are coupled to the measuring tube via mounted parts connected directly to the measuring tube, the mounted parts and the stabilizing elements consisting of a metal other than that of the measuring tube. The stabilizing elements are manufactured from a second material which possesses a coefficient of thermal expansion adapted to the metal of the measuring tube. The mounted parts connected directly to the measuring tube are manufactured from a third material which possesses a higher coefficient of thermal expansion than the metal of the measuring tube.

Abstract: The high-power pack semiconductor module (1) comprises a layer (3, 4), which is brought into direct contact with one or both of the main electrodes of the Si semiconductor chip, (2), said layer being made of a metal matrix composite material whose coefficient of thermal expansion can be tailored to a value either close or matching that of Si.