Patents by Inventor Satoka OHNISHI

Satoka OHNISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230407481
    Abstract: A plated material containing a base material and a metal plating that covers the base material, the base material containing a main raw material free of any carbon materials, and a carbon material that is present inside the main raw material. A plating pretreatment method including a first step of preparing a base material from a main raw material free of any carbon materials and a carbon material, the base material containing the main raw material and the carbon material that is present inside the main raw material; and a second step of charging the base material into a treatment tank, and immersing the base material in a supercritical fluid or subcritical fluid containing an organometallic complex of palladium in the treatment tank.
    Type: Application
    Filed: May 13, 2023
    Publication date: December 21, 2023
    Inventors: Hiroki Kondo, Satoka Ohnishi, Satoko Hongo
  • Publication number: 20230411037
    Abstract: There are provided a conductive nonwoven fabric and a manufacturing method thereof, the conductive nonwoven fabric including: a plated felt portion including a felt portion formed of a plurality of first fibers that extend in irregular directions and that are stacked, and a metal plating applied to the first fibers of the felt portion; and at least one plated warp including a warp formed of a plurality of second fibers and the metal plating applied to the second fibers of the warp. The at least one plated warp is formed to extend in a specific direction with respect to the plated felt portion, and a density of the second fibers is higher than a density of the first fibers.
    Type: Application
    Filed: May 13, 2023
    Publication date: December 21, 2023
    Inventors: Hiroki Kondo, Satoka Ohnishi, Satoko Hongo
  • Publication number: 20230352867
    Abstract: A terminal plating material includes a metallic base that contains copper or a copper alloy, and a carbon composite silver plating layer that disposed on the metallic base and contains either silver or a silver alloy and carbon.
    Type: Application
    Filed: April 28, 2023
    Publication date: November 2, 2023
    Applicant: Yazaki Corporation
    Inventors: Hiroshi FUJITA, Hideki MIZUNO, Yasuo YAMAUCHI, Satoka OHNISHI