Abstract: A semiconductor memory device includes a vertical MISFET having a source region, a channel forming region, a drain region, and a gate electrode formed on a sidewall of the channel forming region via a gate insulating film. In manufacturing the semiconductor memory device, the vertical MISFET in which leakage current (off current) is less can be realized by: counter-doping boron of a conductivity type opposite to that of phosphorus diffused into a poly-crystalline silicon film (10) constituting the channel forming region from an n type poly-crystalline silicon film (7) constituting the source region of the vertical MISFET, and the above-mentioned poly-crystalline silicon film (10); and reducing an effective impurity concentration in the poly-crystalline silicon film (10).

Abstract: A semiconductor memory device includes a vertical MISFET having a source region, a channel forming region, a drain region, and a gate electrode formed on a sidewall of the channel forming region via a gate insulating film. In manufacturing the semiconductor memory device, the vertical MISFET in which leakage current (off current) is less can be realized by: counter-doping boron of a conductivity type opposite to that of phosphorus diffused into a poly-crystalline silicon film (10) constituting the channel forming region from an n type poly-crystalline silicon film (7) constituting the source region of the vertical MISFET, and the above-mentioned poly-crystalline silicon film (10); and reducing an effective impurity concentration in the poly-crystalline silicon film (10).

Abstract: A semiconductor memory device includes a vertical MISFET having a source region, a channel forming region, a drain region, and a gate electrode formed on a sidewall of the channel forming region via a gate insulating film. In manufacturing the semiconductor memory device, the vertical MISFET in which leakage current (off current) is less can be realized by: counter-doping boron of a conductivity type opposite to that of phosphorus diffused into a poly-crystalline silicon film (10) constituting the channel forming region from an n type poly-crystalline silicon film (7) constituting the source region of the vertical MISFET, and the above-mentioned poly-crystalline silicon film (10); and reducing an effective impurity concentration in the poly-crystalline silicon film (10).

Abstract: A vertical MIS is provided immediately above a trench-type capacitor provided in a memory cell forming region of a semiconductor substrate, and a lateral nMIS is provided in the peripheral circuit forming region of the semiconductor substrate. After forming the capacitor, the lateral nMIS is formed. In addition, after forming the lateral nMIS, the vertical MIS is formed. Furthermore, after forming a capacitor, an isolation part of the peripheral circuit is formed.

Abstract: A vertical MIS is provided immediately above a trench-type capacitor provided in a memory cell forming region of a semiconductor substrate, and a lateral nMIS is provided in the peripheral circuit forming region of the semiconductor substrate. After forming the capacitor, the lateral nMIS is formed. In addition, after forming the lateral nMIS, the vertical MIS is formed. Furthermore, after forming a capacitor, an isolation part of the peripheral circuit is formed.

Abstract: A method of manufacturing a valve element for a solenoid valve to open and close a valve seat, comprising the steps of; preparing a leaf spring including an outer peripheral ring section and a hub section having a central hole, forming a ring-shaped outer peripheral seal along the peripheral ring section, and preparing a movable core having a cup-shaped cross section and including a cylindrical section and an end wall section. The method further comprising, forming a valve seal on the end wall section by placing the movable core and the leaf spring in a mold and aligning and holding the leaf spring and the stepped section in contact with each other, and aligning a holder ring along an outer periphery of the movable core, and bringing the holder ring into engagement with the movable core, wherein the leaf spring and the movable core are rigidly secured to each other.

Abstract: A valve element with a disk-shaped leaf spring carrying a movable core in a solenoid valve to open/close a valve seat. The leaf spring includes an outer peripheral ring section, a hub section having a central hole and a plurality of radially arranged arm sections connected between the ring; section and hub section. A seal of elastic material extends along the outer peripheral, ring section of the leaf spring. The movable core has a cylindrical section and an end wall section having a through central hole. The cylindrical section has a stepped section on its outer periphery adapted to be held in contact with the leaf spring. A valve seal is formed on the end wall section through vulcanization and molding, and has a main body section on the outer surface of the end wall section, a small diameter section in said through hole and a holder section connected to the main body section by the small diameter section and inner surface of the end wall section.

Abstract: When the source and drain regions (an n.sup.- type semiconductor region and an n.sup.+ type semiconductor region) of a complementary MISFET and a p-type semiconductor region for use as a punch-through stopper are formed in a p-type well in a substrate having a p- and an n-type well, p-type impurities for the punch-through stopper are suppressed from being supplied to the feeding portion (an n.sup.+ type semiconductor region) of the n-type well.

Abstract: An increase in the GND resistance and a drop in the resistance against electromigration are minimized when the ground voltage lines for shunting are finely constituted by using an Al wiring of the same layer as the pad layer, owing to the employment of a layout in which the arrangement of connection holes 24, 26 in a pad layer connected to one (data line) of the complementary data lines and the arrangement of connection holes in a pad layer connected to the other one (data line bar) of the complementary data lines, are inverted from each other every two bits of memory cells in the SRAM along the direction in which the complementary data lines extend.