Patents by Inventor Satoru Hamasaki
Satoru Hamasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230397475Abstract: An electronic module including an electronic device including a pixel region, a transmissive member including a main surface facing the pixel region, and a frame member coupled to the electronic device and the transmissive member and deciding a positional relationship between the electronic device and the transmissive member is provided. The frame member includes a support portion arranged to surround the transmissive member and having a support surface that supports the transmissive member. The support surface includes a contact portion contacting the main surface, and a concave portion which is depressed more than the contact portion and in which a coupling member configured to couple the transmissive member and the frame member is arranged. The contact portion includes, between the concave portion and an inner edge of the support surface, a portion extending along an outer edge of the main surface.Type: ApplicationFiled: May 23, 2023Publication date: December 7, 2023Inventor: Satoru Hamasaki
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Patent number: 11830722Abstract: A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.Type: GrantFiled: January 25, 2023Date of Patent: November 28, 2023Assignee: CANON KABUSHIKI KAISHAInventors: Koichi Shimizu, Satoru Hamasaki
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Publication number: 20230097378Abstract: A head mounted display includes a display device having a display surface, an optical system configured to adjust a focal point of an eye of an observer to the display device, a driving mechanism configured to drive the display device, a line-of-sight detector configured to detect a line of sight of the observer, and a controller configured to control, based on an output from the line-of-sight detector, the driving mechanism so that an angle formed by the line of sight and the display surface falls within a preset allowable range with respect to 90° at an intersection point of the line of sight and the display surface.Type: ApplicationFiled: September 22, 2022Publication date: March 30, 2023Inventors: Koichi Shimizu, Satoru Hamasaki
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Patent number: 11587964Abstract: A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.Type: GrantFiled: March 13, 2020Date of Patent: February 21, 2023Assignee: CANON KABUSHIKI KAISHAInventors: Koichi Shimizu, Satoru Hamasaki
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Patent number: 10831235Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.Type: GrantFiled: March 19, 2019Date of Patent: November 10, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
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Publication number: 20200303439Abstract: A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.Type: ApplicationFiled: March 13, 2020Publication date: September 24, 2020Inventors: Koichi Shimizu, Satoru Hamasaki
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Patent number: 10735673Abstract: According to the disclosure, a relationship of Tgp>Tgf, ?f1<?PCB1, and (Tgp?To)×?PCB1<(Tgf?To)×?f1+(Tgp?Tgf)×?f2 or a relationship of Tgp<Tgf, ?PCB1<?f1, and (Tgf?To)×?f1<(Tgp?To)×?PCB1+(Tgf?Tgp)×?PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as ?PCB1 and ?PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as ?f1 and ?f2, respectively, and a room temperature is denoted as To.Type: GrantFiled: April 19, 2019Date of Patent: August 4, 2020Assignee: CANON KABUSHIKI KAISHAInventors: Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Yu Katase
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Publication number: 20190335119Abstract: According to the disclosure, a relationship of Tgp>Tgf, ?f1<?PCB1, and (Tgp-To) ×?PCB1<(Tgf-To)×?f1+(Tgp-Tgf)×?f2 or a relationship of Tgp<Tgf, ?PCB1<?f1, and (Tgf-To)×?f1<(Tgp-To)×?PCB1+(Tgf-Tgp)×?PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as ?PCB1 and ?PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as ?f1 and ?f2, respectively, and a room temperature is denoted as To.Type: ApplicationFiled: April 19, 2019Publication date: October 31, 2019Inventors: Koichi Shimizu, Tadashi Kosaka, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Yu Katase
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Publication number: 20190294213Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.Type: ApplicationFiled: March 19, 2019Publication date: September 26, 2019Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
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Patent number: 8698938Abstract: A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.Type: GrantFiled: January 27, 2012Date of Patent: April 15, 2014Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Takanori Suzuki, Hisatane Komori, Satoru Hamasaki
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Patent number: 8487237Abstract: Provided is a rotary encoder, including: a rotary scale, which has a predetermined pattern including continuous patterns and a rotational angle original point formed thereon with reference to a pattern center, has a polygonal outer shape, and has the rotational angle original point defined with reference to at least one side of sides of the polygonal outer shape; a hub, which includes projections for abutting the sides of the polygonal outer shape of the rotary scale and positioning the rotary scale; a rotating shaft, which is press-fitted into the hub and rotates coaxially with the pattern center of the rotary scale; and detecting units for irradiating the rotary scale with light and detecting the light reflected by the rotary scale.Type: GrantFiled: March 17, 2011Date of Patent: July 16, 2013Assignees: Canon Kabushiki Kaisha, Canon Precision Inc.Inventors: Ikuo Watanabe, Masahiko Igaki, Chihiro Nagura, Hiraku Kozuka, Satoru Hamasaki, Makoto Ogura, Tsutomu Nagao, Yasuji Yokoyama
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Publication number: 20130032585Abstract: A thermal head includes a head base having a substrate and a plurality of heat-generating sections arranged on or above the substrate, a circuit board, a drive IC disposed on or above the substrate or on or above the circuit board, the drive IC controlling energizing states of the heat-generating sections, and a cover member having electric conductivity, disposed at least above the circuit board. The circuit board has a plurality of signal wirings for supplying electric signals for operating the drive IC. A face on a circuit board side of the cover member has an inclined region located above the signal wiring.Type: ApplicationFiled: April 22, 2011Publication date: February 7, 2013Applicant: KYOCERA CORPORATIONInventors: Takashi Aso, Satoru Hamasaki
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Patent number: 8279336Abstract: A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(?A?2?C)?L1+L1? at any point on the upright surface, and H tan(?A?2?B)+(H1)tan ?B?L1 and ?B>?C at any point on the non-vertical surface, where ?A is the inclination of incident light, ?B is the inclination at a point on the non-vertical surface, ?C is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1? is the distance from the upper edge to the lower edge of the upright surface in the planar direction.Type: GrantFiled: June 7, 2010Date of Patent: October 2, 2012Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Hisatane Komori, Yasuhiro Matsuki, Satoru Hamasaki
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Publication number: 20120212637Abstract: A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member.Type: ApplicationFiled: January 27, 2012Publication date: August 23, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Hisatane Komori, Satoru Hamasaki
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Patent number: 8241951Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.Type: GrantFiled: December 17, 2009Date of Patent: August 14, 2012Assignee: Canon Kabushiki KaishaInventors: Hisatane Komori, Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki
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Publication number: 20120049051Abstract: Provided is a rotary encoder, including: a rotary scale, which has a predetermined pattern including continuous patterns and a rotational angle original point formed thereon with reference to a pattern center, has a polygonal outer shape, and has the rotational angle original point defined with reference to at least one side of sides of the polygonal outer shape; a hub, which includes projections for abutting the sides of the polygonal outer shape of the rotary scale and positioning the rotary scale; a rotating shaft, which is press-fitted into the hub and rotates coaxially with the pattern center of the rotary scale; and detecting units for irradiating the rotary scale with light and detecting the light reflected by the rotary scale.Type: ApplicationFiled: March 17, 2011Publication date: March 1, 2012Applicants: CANON PRECISION INC., CANON KABUSHIKI KAISHAInventors: Ikuo WATANABE, Masahiko Igaki, Chihiro Nagura, Hiraku Kozuka, Satoru Hamasaki, Makoto Ogura, Tsutomu Nagao, Yasuji Yokoyama
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Publication number: 20100309354Abstract: A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(?A?2?C)?L1+L1? at any point on the upright surface, and H tan(?A?2?B)+(H1)tan ?B?L1 and ?B>?C at any point on the non-vertical surface, where ?A is the inclination of incident light, ?B is the inclination at a point on the non-vertical surface, ?C is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1? is the distance from the upper edge to the lower edge of the upright surface in the planar direction.Type: ApplicationFiled: June 7, 2010Publication date: December 9, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Hisatane Komori, Yasuhiro Matsuki, Satoru Hamasaki
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Publication number: 20100155869Abstract: A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.Type: ApplicationFiled: December 17, 2009Publication date: June 24, 2010Applicant: CANON KABUSHIKI KAISHAInventors: Hisatane Komori, Koji Tsuduki, Yasuhiro Matsuki, Satoru Hamasaki