Abstract: A molded hook surface fastener having a base plate and hook engaging elements projecting from a surface of the base plate, both the base plate and the hook engaging elements being formed of a resin mixture containing polybutylene succinate (A), a modified starch having an amylose content of 45% by weight or more (B), and polyvinyl alcohol (C). The resin mixture is further characterized by having both a continuous phase and a dispersed phase, with the polybutylene succinate (A) present in the continuous phase, and the modified starch (B) and polyvinyl alcohol (C) present in the dispersed phase.

Abstract: A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.

Abstract: Provided is a substrate grinding device including: a work table; a first grinding wheel; and a second grinding wheel, wherein the work table is configured to rotate while sucking and holding a substrate, the first grinding wheel and the second grinding wheel are cup wheel type wheels, and provided at positions where the first grinding wheel and the second grinding wheel can be simultaneously in contact with the substrate rotating, the first grinding wheel and the second grinding wheel being configured to grind the substrate rotating, while rotating, and the work table is configured to be able to move a rotation center of the substrate from a first grinding position within a grinding range of the first grinding wheel to a second grinding position within a grinding range of the second grinding wheel.

Abstract: A monitor controller configured to control a display content on a display unit is configured to keep displaying a bird's-eye-view image when an operation of an operation device is sensed in the state where the display unit displays the bird's-eye-view image, and to cause the display unit to display the bird's-eye-view image when the operation of the operation device is sensed in the state where the display unit does not display the bird's-eye-view image.

Abstract: A work machine includes a manipulation device, a surrounding area monitoring device, and a controller. The manipulation device outputs a manipulation signal to operate the work machine. The surrounding area monitoring device serves as a device for detecting whether an object to be recognized is present or not inside a set region that is set in a surrounding area of the work machine. The controller controls the work machine. The controller is capable of switching a setting of an object sensing function between execution and non-execution, the object sensing function being to restrict movement of the work machine when it is detected that the object is present inside the set region. When the manipulation signal is detected in a state where the object sensing function is set at non-execution, the controller switches the setting of the object sensing function to execution.

Abstract: A work machine is improved in manipulability. The work machine includes a manipulation device, an actuator, a surrounding area monitoring device, and a controller. The manipulation device is manipulated to operate the work machine. The actuator drives the work machine in a manner corresponding to a manipulation of the manipulation device. The surrounding area monitoring device serves as a device for detecting whether an object to be recognized is present or not inside a set region that is set in a surrounding area of the work machine. The controller controls the work machine. When a prescribed manipulation device is manipulated in a case where it is detected that the object is present inside the set region, the controller restricts an operation of the actuator corresponding to a manipulation of the manipulation device.

Abstract: A set area is appropriately set around a work machine. A hydraulic excavator includes a surroundings monitoring apparatus that detects whether or not an object to be recognized is present within a set area set around the hydraulic excavator, a sensor that detects change in position of a traveling unit with respect to a revolving unit, and a controller that controls the hydraulic excavator. The controller sets the set area in accordance with change in position of the traveling unit with respect to the revolving unit detected by the sensor.

Abstract: A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.

Abstract: Provided is a substrate grinding device including: a work table rotatable with the work table sucking and holding a substrate; a cup wheel-type first grinding wheel configured to grind the rotating substrate while rotating, the substrate being held by the work table; and a cup wheel-type second grinding wheel configured to grind the substrate along with grinding by the first grinding wheel while rotating in a close vicinity of the substrate.

Abstract: A hydraulic excavator includes an engine hood covering an engine from above and a vent member disposed inside the engine hood. The engine hood includes a third side plate. The third side plate is provided with a lower side vent hole group, and simultaneously, a region located laterally to the lower side vent hole group is imperforate. The vent member covers the lower side vent hole group with a first opening from inside. A second opening of the vent member communicates with an interior of the engine hood. The vent member upwardly tilts toward the engine hood.

Abstract: A monitor controller configured to control a display content on a display unit is configured to keep displaying a bird's-eye-view image when an operation of an operation device is sensed in the state where the display unit displays the bird's-eye-view image, and to cause the display unit to display the bird's-eye-view image when the operation of the operation device is sensed in the state where the display unit does not display the bird's-eye-view image.

Abstract: An exhaust gas aftertreatment unit includes a selective catalytic reduction device that treats engine exhaust gas, a connecting pipe that guides the engine exhaust gas to the reduction device, a reducing agent injection device disposed on the connecting pipe to inject a reducing agent into the exhaust gas, and a cooling water flowpath that guides cooling water to an internal flowpath of the injection device. The cooling water path includes a first flowpath joined with the internal flowpath, second and third flowpaths branching off from the first flowpath, and a branching point where the first flowpath branches into the second flowpath and the third flowpath is positioned higher than a connecting portion of the injection device and the first flowpath. The third flowpath extends further upward than the second flowpath from the branching point. The second and third flowpaths merge on an opposite side of the branching point.

Abstract: A hydraulic excavator includes an engine hood covering an engine from above and a vent member disposed inside the engine hood. The engine hood includes a third side plate. The third side plate is provided with a lower side vent hole group, and simultaneously, a region located laterally to the lower side vent hole group is imperforate. The vent member covers the lower side vent hole group with a first opening from inside. A second opening of the vent member communicates with an interior of the engine hood. The vent member upwardly tilts toward the engine hood.

Abstract: A work vehicle includes a hydraulic fluid tank having a breather valve, and a breather hose attached to the breather valve. The breather hose has a first flowpath joined to the breather valve and a second flowpath and a third flowpath branching off from the first flowpath. The second flowpath has an extension direction that is different from the first flowpath. The second flowpath has an open end, and the third flowpath has a closed end.

Abstract: An exhaust gas aftertreatment unit includes a selective catalytic reduction device that treats engine exhaust gas, a connecting pipe that guides the engine exhaust gas to the reduction device, a reducing agent injection device disposed on the connecting pipe to inject a reducing agent into the exhaust gas, and a cooling water flowpath that guides cooling water to an internal flowpath of the injection device. The cooling water path includes a first flowpath joined with the internal flowpath, second and third flowpaths branching off from the first flowpath, and a branching point where the first flowpath branches into the second flowpath and the third flowpath is positioned higher than a connecting portion of the injection device and the first flowpath. The third flowpath extends further upward than the second flowpath from the branching point. The second and third flowpaths merge on an opposite side of the branching point.

Abstract: A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

Abstract: A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

Abstract: The present invention is a chemical mechanical polishing apparatus which polishes a substrate by causing relative movement of this substrate and a polishing pad in a state in which a polishing liquid is interposed between this polishing pad and the substrate, wherein the shape of the above-mentioned polishing pad is an annular shape in which the central portion of a circle or ellipse is bored through in a circular or elliptical shape that has a smaller diameter. The internal diameter li of the hole that is bored through the annular polishing pad is 5 to 75%, preferably 30 to 50%, of the external diameter lo of the polishing pad.

Abstract: A polishing device includes a wafer chuck mechanism which retains a wafer while its plane to be polished faces upward, a polishing pad component which possesses a polishing plane which polishes the wafer, a polishing head, and a shift mechanism which enables a relative displacement of said polishing pad component in relation to the wafer. A fixation and retention mechanism fixes and retains said polishing pad component to the polishing head in a detachable fashion while its polishing plane faces downward. The displacement distance of the shift mechanism ranges from the polishing position of the wafer to the exchange position of the polishing pad component, so that the polishing pad component is automatically exchanged.

Abstract: A method of detecting an end point of polishing of a wafer, comprising the steps of: using a color identifying sensor for recognizing a color component of light by applying light from a light source and by converging reflected light to an optical fiber to cause the color identifying sensor to previously recognize a color component of a substance of a wafer which must be polished; displaying an ON-state when the color component is recognized and an OFF-state when the color component is not recognized; one point (except for the central point) of the surface of the rotating wafer is irradiated with light emitted from the color identifying sensor to cause the color identifying sensor to detect the number of times (m) of off-states; and determining an end of polishing of the wafer when the detected number of times (m) coincides with the number (n) of off-states indicating an optimum end point of polishing of the wafer.