Patents by Inventor Satoru Kurozumi

Satoru Kurozumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141183
    Abstract: Provided is a coating agent preparation kit with which a coating agent layer having a desired thickness can be satisfactorily obtained and a coating film can be easily formed. A coating agent preparation kit according to the present invention is a coating agent preparation kit for obtaining a coating agent by mixing, the coating agent preparation kit including a first composition and a second composition, the first composition including a curable compound curable with ultraviolet rays, heat, or moisture, and the second composition including hollow particles.
    Type: Application
    Filed: March 4, 2022
    Publication date: May 2, 2024
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Akira KAMIYAMA, Satoru KUROZUMI
  • Publication number: 20220124911
    Abstract: [Problem to be solved] Provided is an electronic component having thermal insulation properties and insulation resistance, which can be suitably used for modularization by injection molding or the like. [Means to Solve the Problem] There is provided an electronic component comprising a circuit board on which an electronic element is mounted and a coating layer for coating the surface of the circuit board, wherein the coating layer comprises at least a thermoplastic resin and hollow particles; and the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board.
    Type: Application
    Filed: March 10, 2020
    Publication date: April 21, 2022
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Satoru KUROZUMI, Masao INOUE
  • Publication number: 20220046804
    Abstract: The present invention is to provide a coating agent that can form a coated layer having uniform heat insulating properties and suppress the electronic component from being damaged due to partial re-melting of solder or thermal expansion of the resin. The coating agent according to the present invention comprises (A) a thermoplastic resin, (B) an organic solvent, (C) a thixotropic agent, and (D) hollow particles.
    Type: Application
    Filed: December 4, 2019
    Publication date: February 10, 2022
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Satoru KUROZUMI, Masao INOUE
  • Patent number: 7172895
    Abstract: This invention relates to drainage process wherein Burkholderia cepacia AIK bacterial strain (FERM BP-7308) contacts disposed drainage and the new microorganism can aerobically decompose liquid and solid oil and fat and other organic matter in wide range of temperatures and a drainage process that uses the new microorganism.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: February 6, 2007
    Inventors: Takuya Kitamura, Satoru Kurozumi, Ryuichiro Kurane
  • Publication number: 20030203470
    Abstract: This invention relates to drainage process wherein Burkholderia cepacia AIK bacterial strain (FERM BP-7308) contacts disposed drainage and the new microorganism can aerobically decompose liquid and solid oil and fat and other organic matter in wide range of temperatures and a drainage process that uses the new microorganism.
    Type: Application
    Filed: April 25, 2002
    Publication date: October 30, 2003
    Inventors: Takuya Kitamura, Satoru Kurozumi, Ryuichiro Kurane