Patents by Inventor Satoru Matsuda
Satoru Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130049533Abstract: An acoustic wave device includes: a comb-like electrode provided on a piezoelectric substrate; and a first medium that covers the comb-like electrode and has at least a silicon oxide film in which an element is doped, wherein sonic speed in the silicon oxide film in which the element is doped is lower than sonic speed in an undoped silicon oxide film.Type: ApplicationFiled: August 2, 2012Publication date: February 28, 2013Applicant: TAIYO YUDEN CO., LTD.Inventors: Satoru MATSUDA, Takashi MATSUDA, Michio MIURA
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Patent number: 8354896Abstract: An acoustic wave device includes a plurality of acoustic wave devices each including a substrate made of a piezoelectric material, a pair of interdigital electrodes formed on the substrate, each of the interdigital electrodes including a plurality of electrode fingers, and an adjustment medium. The adjustment medium includes at least a single layer and is formed on at least a part of the pair of the interdigital electrodes. The adjustment medium further includes at least one thick portion and a thin portion, the thin portion being null or thinner than the thick portion, a total area of the at least one thick portion in a region covering the pair of interdigital electrodes being determined according to a predetermined characteristic value, wherein the plurality of acoustic wave devices include at least two acoustic wave devices that differ from each other with respect to the size of the total area of the at least one thick portion of the adjustment medium.Type: GrantFiled: July 29, 2009Date of Patent: January 15, 2013Assignee: Taiyo Yuden Co., Ltd.Inventors: Satoru Matsuda, Michio Miura, Takashi Matsuda
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Publication number: 20120313483Abstract: An acoustic wave device includes a substrate, a dielectric film formed on the substrate and a pair of IDT electrodes opposing each other provided between the substrate and the dielectric film. At least one of the substrate and the dielectric film is piezoelectric. The IDT electrodes each include an electrode finger that extends in at least one direction. A film thickness of the dielectric film changes in a gap portion between a tip of the electrode finger of one of the IDT electrodes and the other opposing IDT electrode in the direction of extension of the electrode finger.Type: ApplicationFiled: August 23, 2012Publication date: December 13, 2012Applicant: TAIYO YUDEN CO., LTD.Inventors: Satoru MATSUDA, Michio MIURA, Takashi MATSUDA
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Patent number: 8264299Abstract: A boundary acoustic waves device includes a piezoelectric substrate having piezoelectricity, interdigitated electrodes formed on the piezoelectric substrate, a first medium formed on the piezoelectric substrate so as to cover the interdigitated electrode, and a second medium formed on the first medium. The interdigitated electrodes include a plurality of electrode fingers and bus bars that connect ends of the plurality of electrode fingers. A third medium is formed on the first medium. The second medium and the third medium are in contact with the first medium. The first medium, the second medium, and the third medium are formed of different materials. The first medium, the second medium, and the third medium are different in a ratio in length of a part with the third medium formed with respect to a length of a propagation path of boundary acoustic waves in a cross-section perpendicular to a longitudinal direction of the electrode fingers, in the longitudinal direction of the electrode fingers.Type: GrantFiled: February 24, 2010Date of Patent: September 11, 2012Assignee: Taiyo Yuden Co., Ltd.Inventors: Satoru Matsuda, Michio Miura, Takashi Matsuda
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Patent number: 8258891Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.Type: GrantFiled: October 29, 2009Date of Patent: September 4, 2012Assignee: Taiyo Yuden Co., Ltd.Inventors: Michio Miura, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Patent number: 8085116Abstract: An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.Type: GrantFiled: March 20, 2009Date of Patent: December 27, 2011Assignee: Taiyo Yuden Co., Ltd.Inventors: Michio Miura, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Publication number: 20110204497Abstract: A semiconductor integrated circuit having a semiconductor chip mounted over a tape- or film-like substrate, the semiconductor integrated circuit having a higher strength against bending, as well as a method for manufacturing the semiconductor integrated circuit, are disclosed. The semiconductor integrated circuit comprises a bendable tape-like substrate, the tape-like substrate including external terminals, internal terminals provided for coupling to a rectangular semiconductor chip, and wiring lines for coupling the internal terminals and the external terminals with each other; and a reinforcing member for reinforcing the semiconductor chip over the tape-like substrate in a longitudinal direction of the semiconductor chip, the semiconductor chip and the reinforcing member being sealed with resin.Type: ApplicationFiled: February 14, 2011Publication date: August 25, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Satoru Matsuda, Tsukasa Yasuda, Ichiro Matsumoto
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Publication number: 20110204994Abstract: A boundary acoustic waves device includes a piezoelectric substrate (16) having piezoelectricity, interdigitated electrodes (14a, 14b) formed on the piezoelectric substrate, a first medium (17) formed on the piezoelectric substrate so as to cover the interdigitated electrode, and a second medium (18) formed on the first medium. The interdigitated electrodes include a plurality of electrode fingers (13a, 13b) and bus bars (12a, 12b) that connect ends of the plurality of electrode fingers. A third medium (19a) is formed on the first medium. The second medium and the third medium are in contact with the first medium. The first medium, the second medium, and the third medium are formed of different materials.Type: ApplicationFiled: February 24, 2010Publication date: August 25, 2011Inventors: Satoru Matsuda, Michio Miura, Takashi Matsuda
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Patent number: 7981648Abstract: An object of the present invention is to provide a novel microalga that produces hydrocarbons available as an alternative fuel to a diesel fuel (light oil). The present invention relates to a novel microalga Pseudochoricystis ellipsoidea having the ability to produce hydrocarbons, and to a process for producing hydrocarbons, characterized by culturing a microalga belonging to the genus Pseudochoricystis or the genus Choricystis having the ability to produce hydrocarbons, and collecting the hydrocarbon from the resulting cultured product.Type: GrantFiled: March 24, 2006Date of Patent: July 19, 2011Assignee: Denso CorporationInventors: Norihide Kurano, Hiroshi Sekiguchi, Akira Sato, Satoru Matsuda, Kyoko Adachi, Mika Atsumi
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Publication number: 20110148945Abstract: A DAC includes a DAC unit that selects one of a plurality of selection voltages according to an input digital signal, and outputs the selected selection voltage as an analog signal, a first power-supply voltage terminal through which a first power-supply voltage is supplied to a first terminal of a transistor constituting the DAC unit upon power-up of the DAC unit, and a voltage supply control unit that detects a potential difference between the first power-supply voltage and a second voltage used to generate the selection voltages, outputs a voltage corresponding to the first power-supply voltage to a second terminal of the transistor constituting the DAC unit when the potential difference is larger than a predetermined value, and outputs a voltage corresponding to the second voltage to the second terminal of the transistor constituting the DAC unit when the potential difference is smaller than the predetermined value.Type: ApplicationFiled: December 14, 2010Publication date: June 23, 2011Inventor: Satoru MATSUDA
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Patent number: 7915786Abstract: An elastic boundary wave device of the present invention includes a plurality of elastic boundary wave elements. The elastic boundary wave elements each include a piezoelectric material layer, an electrode disposed over the piezoelectric material layer, a first dielectric layer formed over the piezoelectric material layer so as to cover the electrode, and a second dielectric layer formed over the first dielectric layer. An acoustic velocity of the second dielectric layers is faster than an acoustic velocity of the first dielectric layers, and the acoustic velocity of the second dielectric layer of at least one elastic boundary wave element from among the plurality of elastic boundary wave elements is different from the acoustic velocity of the second dielectric layer of another of the elastic boundary wave elements. This enables improving the degree of suppression in use as a filter in the elastic boundary wave device.Type: GrantFiled: February 12, 2010Date of Patent: March 29, 2011Assignee: Taiyo Yuden Co., Ltd.Inventors: Takashi Matsuda, Satoru Matsuda, Michio Miura
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Publication number: 20110057922Abstract: A drive device according to the present invention includes a plurality of output amplifier circuits that are connected in parallel, a bias wire that supplies a bias voltage from a bias voltage supply source to the plurality of output amplifier circuits, a power supply wire that supplies a power supply voltage from a power supply voltage supply source to the plurality of output amplifier circuits, and a correction unit that superposes an offset voltage on the bias voltage so that a voltage difference between the power supply voltage and the bias voltage supplied to the plurality of output amplifier circuits is to be desirable.Type: ApplicationFiled: September 3, 2010Publication date: March 10, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Tsukasa YASUDA, Ichiro MATSUMOTO, Satoru MATSUDA
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Publication number: 20110007063Abstract: A driving circuit includes: output buffers provided to drive first and second groups of data lines, which are connected with pixels of a display panel, with drive voltage signals supplied to input terminals of the output buffers, respectively; first and second common portions; and a first short-circuiting section provided for each of the data lines of the first group to connect the input terminal of a corresponding one of the output buffers for the first group of data lines to the first common portion in response to a first connection control signal. A second short-circuiting section is provided for each of the data lines of the second group to connect the input terminal of a corresponding one of the output buffers for the second group of data lines to the second common portion in response to a second connection control signal.Type: ApplicationFiled: June 29, 2010Publication date: January 13, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventor: Satoru MATSUDA
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Patent number: 7830067Abstract: An elastic boundary wave device includes a first medium with piezoelectricity, an electrode exciting an elastic wave and provided on the first medium, a second medium made of a different material from the first medium and provided on the first medium to cover the electrode, and a sound absorbing portion provided on the second medium.Type: GrantFiled: April 28, 2009Date of Patent: November 9, 2010Assignee: Taiyo Yuden Co., Ltd.Inventors: Satoru Matsuda, Michio Miura, Takashi Matsuda, Masanori Ueda
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Publication number: 20100244624Abstract: A method of producing an acoustic wave device includes: forming an interdigital electrode 3 on a piezoelectric substrate 2; forming a barrier film 4 so as to cover the interdigital electrode 3; forming a medium 5 on the barrier film 4; measuring a frequency characteristic of an acoustic wave excited by the interdigital electrode 3; and forming, in an excitation region, an adjustment region having a thickness different from other portions by patterning the barrier film 4 or further providing an adjustment film. When forming the adjustment region, an area T of the adjusting area is adjusted in accordance with the measured frequency characteristic.Type: ApplicationFiled: December 24, 2009Publication date: September 30, 2010Applicant: FUJITSU LIMITEDInventors: Satoru MATSUDA, Michio Miura, Takashi Matsuda
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Publication number: 20100219906Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.Type: ApplicationFiled: October 29, 2009Publication date: September 2, 2010Applicant: FUJITSU LIMITEDInventors: Michio MIURA, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Publication number: 20100188173Abstract: A first acoustic wave device includes a second acoustic wave device. The second acoustic wave device includes a substrate made of a piezoelectric material, a pair of interdigital electrodes formed on the substrate, each of the intergidital electrodes including a plurality of electrode fingers, and a adjustment medium. The adjustment medium includes at least a single layer and is formed on at least a part of the pair of the intergidital electrodes. The adjustment medium further includes a thick portion and a thin portion being null or thinner than the thick portion, an area of the thick portion opposed to a region being determined according to a predetermined characteristic value, the area including the intergital electrodes and a plurality of spaces between the electrode fingers adjacent each other.Type: ApplicationFiled: July 29, 2009Publication date: July 29, 2010Applicant: FUJITSU LIMITEDInventors: Satoru MATSUDA, Michio MIURA, Takashi MATSUDA
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Patent number: 7741931Abstract: A filter includes a parallel resonator having first comb electrodes provided on a piezoelectric substrate and a first dielectric film that covers the first comb electrodes, and a series resonator having second comb electrodes provided on the piezoelectric substrate and a second dielectric film covers the second comb electrodes and is made of a material identical to that of the first dielectric film. The first dielectric film has a different thickness from that of the second dielectric film.Type: GrantFiled: September 25, 2007Date of Patent: June 22, 2010Assignees: Fujitsu Media Devices Limited, Fujitsu LimitedInventors: Satoru Matsuda, Michio Miura, Shogo Inoue, Takashi Matsuda, Masanori Ueda, Seiichi Mitobe
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Publication number: 20100141088Abstract: An elastic boundary wave device of the present invention includes a plurality of elastic boundary wave elements. The elastic boundary wave elements each include a piezoelectric material layer, an electrode disposed over the piezoelectric material layer, a first dielectric layer formed over the piezoelectric material layer so as to cover the electrode, and a second dielectric layer formed over the first dielectric layer. An acoustic velocity of the second dielectric layers is faster than an acoustic velocity of the first dielectric layers, and the acoustic velocity of the second dielectric layer of at least one elastic boundary wave element from among the plurality of elastic boundary wave elements is different from the acoustic velocity of the second dielectric layer of another of the elastic boundary wave elements. This enables improving the degree of suppression in use as a filter in the elastic boundary wave device.Type: ApplicationFiled: February 12, 2010Publication date: June 10, 2010Inventors: Takashi MATSUDA, Satoru Matsuda, Michio Miura
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Patent number: 7688161Abstract: An acoustic wave device includes a piezoelectric substrate, a resonator having comb electrodes that are provided above the piezoelectric substrate and excite an acoustic wave, and a capacitor that is provided above the piezoelectric substrate and is connected in series or parallel with the resonator, the capacitor including electrodes that horizontally face each other above the piezoelectric substrate. The electrodes of the capacitor are further from the piezoelectric substrate than the comb electrodes of the resonator.Type: GrantFiled: October 24, 2007Date of Patent: March 30, 2010Assignees: Fujitsu Media Devices Limited, Fujitsu LimitedInventors: Michio Miura, Satoru Matsuda, Shogo Inoue, Takashi Matsuda, Masanori Ueda, Seiichi Mitobe