Abstract: A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3?) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.

Abstract: There is provided a position detecting method for detecting a position of an object, on which an alignment mark including plural mark elements is formed. The method includes the steps of obtaining positional information indicative of each position of the plural mark elements, selecting positional information that has predetermined precision among plural pieces of positional information obtained by the obtaining step, and calculating the position of the object using the positional information that has the predetermined precision selected by the selecting step.

Abstract: An exposure method includes the steps of acquiring information of an alignment mark formed on an object to be exposed, by changing a value of a device parameter, the information being used for an alignment between a reticle and the object, the reticle forming a circuit pattern to be transferred to the object, and the value being able to be set in an exposure apparatus, determining the value of the device parameter of the exposure apparatus based on the information acquired in the acquiring step, and transferring the pattern onto the object using the exposure apparatus that sets the value of the device parameter, which has been determined.

Abstract: A semiconductor device manufacturing apparatus management system includes a semiconductor device manufacturing apparatus which operates in accordance with a parameter, an obtaining device for obtaining evaluation values of an operation result of the semiconductor device manufacturing apparatus corresponding to a plurality of parameter values of the parameter, a holding device for holding the evaluation values obtained by the obtaining device for each object to be processed by the semiconductor device manufacturing apparatus, and an optimization device for analyzing the evaluation values held by the holding device. The optimization device optimizes the parameter on the basis of at least one of a sensitivity representing a change degree of the evaluation values upon the change in the parameter, and a variation amount of the evaluation values for each object to be processed.

Abstract: A position detecting method includes the steps of forming an image of a mark on a sensor, performing a first process that processes a raw signal obtained from the sensor with plural parameters, performing a second process that determines an edge of a signal processed by the first process for each parameter, determining a parameter from a result of the second process obtained for each parameter, and calculating a position of the mark based on a determined parameter.

Abstract: A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3 &sgr;) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.

Abstract: An exposure apparatus performs AGA measurement by using a predetermined sample shot group formed on a wafer, and decides an alignment parameter. The exposure apparatus executes wafer alignment processing and exposure processing by using the alignment parameter. The exposure apparatus notifies a central processing unit (4) of AGA measurement results and the alignment parameter. An overlay inspection apparatus measures an actual exposure position on the exposed wafer, and notifies the central processing unit of the measurement result. The central processing unit (4) optimizes alignment processing on the basis of the AGA measurement results, alignment parameter, and actually measured exposure position.

Abstract: This invention provides a computer apparatus which is connected to an exposure apparatus capable of executing AGA measurement by using a set parameter value and another parameter value and executing acquisition processing of acquiring measurement results, and an overlay inspection apparatus for inspecting the processing result obtained with the set parameter value in the exposure apparatus, and which executes optimization processing of optimizing the set parameter value on the basis of the processing results acquired in acquisition processing and the inspection result value by the inspection apparatus. The computer apparatus causes the inspection apparatus to acquire and accumulate inspection result values, and evaluates variations in processing results on the basis of the accumulated inspection results. Based on the evaluation result, the computer apparatus decides a frequency at which acquisition processing in the semiconductor exposure apparatus is executed.

Abstract: A system which manages a plurality of semiconductor exposure apparatuses holds TIS information representing the characteristics of the respective semiconductor exposure apparatuses. In a semiconductor exposure apparatus, a parameter value is optimized on the basis of AGA measurement results obtained using a set parameter value and another parameter value and AGA measurement estimation results obtained by virtually changing the parameter value. Whether to reflect the optimized parameter value in another industrial device is decided on the basis of the TIS information. If it is decided to reflect the optimized parameter value, the parameter value of another semiconductor exposure apparatus is optimized by the optimized parameter value. In this manner, the optimization result of a parameter value by a given industrial device can be properly reflected in another industrial device, realizing efficient parameter value setting.

Abstract: An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light; an optical unit for guiding the alignment light, which has been emitted by the light source, to an alignment mark provided on the reticle and a reference mark provided on a reticle stage that holds the reticle; and detecting unit for detecting the alignment light reflected from the alignment mark and the reference mark, wherein the reticle is aligned on the basis of the result of detection by the detection unit.

Abstract: An apparatus control system controls the operation of an industrial apparatus while the apparatus is operating in order to achieve operating efficiency without stopping the apparatus. The apparatus control system sets parameters for operating the industrial apparatus, inspects the results of operating the apparatus according to the parameters thus set, evaluates the operating results according to a first parameter value and a second parameter value different from the first parameter value, determines new parameter values, revises the first and second parameters to the newly determined values, and continues to operate the industrial apparatuses according to the revised parameter values.

Abstract: A position detector suitable for an exposure apparatus includes a reticle stage on which is provided a reticle-stage reference mark constituted by a substrate that exhibits a transmitting property with respect to alignment light. In alignment measurement, the relative position of the reticle-stage reference mark and a wafer alignment mark is detected. The relative position of a reticle reference mark and reticle alignment mark is measured beforehand using a separate detection mechanism, and the relative position of a reticle and wafer is decided from the relative position of the reticle-stage reference mark and wafer alignment mark.

Abstract: A reticle stage reference mark 3 of material having high reflectivity to alignment illumination light is provided on a reticle 5, and a chuck mark 8 of material having high reflectivity to the alignment illumination light is provided on a wafer chuck 11. A relative position of the reticle stage reference mark 3 to the chuck mark 8 is detected by using a first position detection optical system 1 and a first illumination optical system 2, and relative alignment is performed between the reticle 5 and a wafer 10.

Abstract: An X-ray diagnostic apparatus includes an X-ray tube for irradiating a subject with X-rays, a rectangular planar type X-ray detector formed by arraying a plurality of solid-state detection elements, a supporting mechanism for supporting the X-ray tube and the planar type X-ray detector in arbitrary postures with respect to the subject, and a suspending mechanism for suspending the planar type X-ray detector from the supporting mechanism. The suspending mechanism has a rotating mechanism for rotating the planar type X-ray detector through an arbitrary angle about a central path of the X-rays. When necessary, the planar type X-ray detector is rotated about the central path of the X-rays so as to be very close to the subject. When necessary, the planar type X-ray detector is rotated, so that the longitudinal direction of the subject on the image and the vertical direction of the screen can coincide with each other.

Abstract: An X-ray tomosynthesis system as an X-ray diagnostic system is provided. The system comprises an X-ray generator irradiating an X-ray toward a subject, and a planar-type X-ray detector detecting the X-ray passing through the subject and outputting two dimensional imaging signals based on the detected X-ray. The system comprises a supporting/moving mechanism supporting at least one of the X-ray generator and the X-ray detector so that the at least one is moved relatively to the subject.

Abstract: A positioning apparatus and a method which enables precise positioning of a mask and a wafer without being influenced by the deviation of the gap between the mask and wafer or the positional deviation of the irradiated light beam. A light beam irradiates on a first mark of a first object and a second mark of a second object. The relative position of the two objects is detected on the basis of a plurality of spot images of the light beam transmitting through the two marks, or being reflected upon or diffracted upon the marks. Each centroid of the plurality of spots is detected and a first alignment amount is obtained; in addition, a correction amount for the first alignment is obtained by applying the fuzzy inference method based on an additional signal, such as the positional relation of the first and second objects or the positional relation of the irradiated light beam and the first mark.