Abstract: Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar1 to Ar3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Abstract: Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar1 to Ar3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Abstract: Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (Td5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Abstract: A high molecular weight aliphatic polyester copolymer, a high molecular weight aliphatic polyester copolymer containing polylactic acid; process for industrially producing these copolymers; composition of these copolymers; and various uses thereof. These copolymers have practical properties which make the copolymers moldable. They are free from the problem of plasticizer bleeding and can be degraded by microorganisms present in soils or water. They give moldings, such as sheets and films, which combine a sufficient strength with tear resistance. When the copolymers are ones having a branched structure, they give a molding having excellent mechanical properties. The moldings obtained from compositions containing either of these copolymers are excellent in elongation and biodegradability and have a satisfactory balanc therebetween. In particular, blending with one or more other biodegradable resins gives a molding having better moldability.