Patents by Inventor Satoru Tsukagoshi

Satoru Tsukagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for electrolytic copper plating
    Publication number: 20040089557
    Abstract: A process for electrolytic copper plating, that is suitable for the formation of filled vias without compromising the brightness of the deposit is provided. In this process, copper electroplating is carried out in the presence of a transition metal oxide.
    Type: Application
    Filed: November 7, 2002
    Publication date: May 13, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Hideki Tsuchida, Masaru Kusaka, Shinjiro Hayashi, Satoru Tsukagoshi