Abstract: A communication hole inspection device for inspecting a communication hole in a structure, a casting surface being formed on an inner surface of the hole, said communication hole inspection device having: a light-emitting body that is arranged in a portion of the communication hole and emits a beam of light; a light-receiving body that is arranged in a different portion of the communication hole and receives the light beam from the light-emitting body; a rotation mechanism for changing the rotation angle of the light-emitting body and thereby changing the light beam received by the light-receiving body; and a determination unit for determining the open state of the communication hole at least on the basis of based on the light beam received by the light-receiving body when the rotation angle of the light-emitting body is set at a first angle, and at a second angle different from the first anile.

Abstract: The present invention provides a fuel pump capable of preventing the occurrence of cavitation near a seat member in a valve mechanism. The fuel pump includes a plunger adapted to reciprocate, a pressurizing chamber adapted to increase and decrease its volumetric capacity through the reciprocation of the plunger, and a relief valve mechanism adapted to return a fuel to the pressurizing chamber. The relief valve mechanism includes a relief valve, and a seat member having a valve contact portion for seating the relief valve thereon. The relief valve is disposed closer to the plunger than the seat member. The seat member has an annular groove portion which forms a space communicating with the pressurizing chamber, between the annular groove portion and a second chamber (a fixing portion) surrounding the outer peripheral surface of the seat member. The space is provided at a position farther from the plunger than the valve contact portion.

Abstract: A multi-mode interferometric optical waveguide device includes: a multi-mode interferometric optical waveguide which includes a first reflective surface; a first single-mode waveguide connected to the multi-mode interferometric optical waveguide; and a second single-mode waveguide connected to the multi-mode interferometric optical waveguide and oppose the first reflective surface. Consequently, the multi-mode interferometric optical waveguide device can propagate light from the first single-mode waveguide to the second single-mode waveguide, with further reduced optical losses.

Abstract: Provided is a burner of double tube structure including an outer tube and an inner tube. The inner tube includes a tip-side support portion fixed on the outer tube, a base-side support portion fixed on the outer tube, a main body portion supported by the tip-side support portion, bellows interposed between the main body portion and the base-side support portion, and a bulkhead member attached at a position between the tip-side support portion and the base-side support portion. Between an outer peripheral surface of the bulkhead member and an inner peripheral surface of the outer tube, a second gap smaller than a first gap between an outermost peripheral surface of the bellows and the inner peripheral surface of the outer tube is interposed.

Abstract: The circuit board includes a plurality of bonding pads having a first bonding pad and a second bonding pad configured to supply a ground potential; a first ground wiring connected to the first bonding pad; a second ground wiring connected to the second bonding pad; and a first extension pad connected to the first ground wiring and a second extension pad connected to the second ground wiring, the first extension pad and the and second extension pad being provided in a different area from an area in which the plurality of bonding pads is provided, the first extension pad and the and second extension pad being connectable through a wire.

Abstract: A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet.

Abstract: A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet.

Abstract: The circuit board includes a plurality of bonding pads having a first bonding pad and a second bonding pad configured to supply a ground potential; a first ground wiring connected to the first bonding pad; a second ground wiring connected to the second bonding pad; and a first extension pad connected to the first ground wiring and a second extension pad connected to the second ground wiring, the first extension pad and the and second extension pad being provided in a different area from an area in which the plurality of bonding pads is provided, the first extension pad and the and second extension pad being connectable through a wire.

Abstract: A coil spring includes a helically formed wire having end turn portions at ends thereof, a plurality of first rough surfaces, each including first shot peening indentations formed on a part of a surface of the end turn portions, and a second rough surface including second shot peening indentations formed on the entire surface of the wire except for the first rough surface. The second rough surface has a surface roughness different from that of the first rough surface.

Abstract: A coil spring processing device includes an end positioning device, shot peening device, and controller. The end positioning device positions ends of a coil spring. The shot peening device includes a turntable mechanism, pressure mechanism, rotation mechanism which rotates the coil spring, and projection mechanism which projects shots. Holding mechanisms each include a lower shifting prevention jig and an upper shifting prevention jig. The controller stops a first holding mechanism and a second holding mechanism in rotation stop positions corresponding to end turn portions of the coil spring.

Abstract: A coil spring includes a helically formed wire having end turn portions at ends thereof, a plurality of first rough surfaces, each including first shot peening indentations formed on a part of a surface of the end turn portions, and a second rough surface including second shot peening indentations formed on the entire surface of the wire except for the first rough surface. The second rough surface has a surface roughness different from that of the first rough surface.

Abstract: A vertical motion impeller-type shot peening device performs a second shot peening to a coil spring including first shot peening indentations. The vertical motion impeller-type shot peening device includes a workpiece holding mechanism including a lower end turn support and an upper end turn support, a stress applying mechanism which compresses the coil spring, a rotation mechanism, and a projection mechanism which includes a pair of vertically movable impeller units. A first rough surface including first shot peening indentations is formed on a part of end turn portions of the coil spring. A second rough surface including second shot peening indentations is formed on the entire surface of wire except for the first rough surface.

Abstract: A coil spring processing device includes an end positioning device, shot peening device, and controller. The end positioning device positions ends of a coil spring. The shot peening device includes a turntable mechanism, pressure mechanism, rotation mechanism which rotates the coil spring, and projection mechanism which projects shots. Holding mechanisms each include a lower shifting prevention jig and an upper shifting prevention jig. The controller stops a first holding mechanism and a second holding mechanism in rotation stop positions corresponding to end turn portions of the coil spring.

Abstract: A shot peening device includes a turntable which rotates about a revolution axis, holding mechanism which moves with the turntable, pressure mechanism which compresses a coil spring, rotation mechanism which rotates the coil spring, projection mechanism which projects shots to the compressed coil spring, load cell which detects a load applied to the coil spring, and controller. A signal output from the load cell is input to the controller, and the controller detects a chronological change of the load applied to the coil spring during the shot peening.

Abstract: The invention provides a pyrazolothiazole compound of the formula [I], or a pharmaceutically acceptable salt thereof: The compound of the invention has JAK1 inhibitory activity, and thus, immunosuppressive effect, anti-inflammatory effect and anti-proliferative effect, and is useful in the treatment of the diseases, for example, rheumatoid arthritis, inflammatory bowel disease, psoriasis and vasculitis, bronchial asthma, chronic obstructive pulmonary disease and eosinophilic sinusitis, nasal polyp.

Abstract: The invention provides a pyrazolothiazole compound of the formula [I], or a pharmaceutically acceptable salt thereof: The compound of the invention has JAK1 inhibitory activity, and thus, immunosuppressive effect, anti-inflammatory effect and anti-proliferative effect, and is useful in the treatment of the diseases, for example, rheumatoid arthritis, inflammatory bowel disease, psoriasis and vasculitis, bronchial asthma, chronic obstructive pulmonary disease and eosinophilic sinusitis, nasal polyp.

Abstract: The invention provides a pyrazolothiazole compound of the formula [I], or a pharmaceutically acceptable salt thereof: The compound of the invention has JAK1 inhibitory activity, and thus, immunosuppressive effect, anti-inflammatory effect and anti-proliferative effect, and is useful in the treatment of the diseases, for example, rheumatoid arthritis, inflammatory bowel disease, psoriasis and vasculitis, bronchial asthma, chronic obstructive pulmonary disease and eosinophilic sinusitis, nasal polyp.

Abstract: The invention provides a pyrazolothiazole compound of the formula [I], or a pharmaceutically acceptable salt thereof: The compound of the invention has JAK1 inhibitory activity, and thus, immunosuppressive effect, anti-inflammatory effect and anti-proliferative effect, and is useful in the treatment of the diseases, for example, rheumatoid arthritis, inflammatory bowel disease, psoriasis and vasculitis, bronchial asthma, chronic obstructive pulmonary disease and eosinophilic sinusitis, nasal polyp.

Abstract: A vertical motion impeller-type shot peening device performs a second shot peening to a coil spring including first shot peening indentations. The vertical motion impeller-type shot peening device includes a workpiece holding mechanism including a lower end turn support and an upper end turn support, a stress applying mechanism which compresses the coil spring, a rotation mechanism, and a projection mechanism which includes a pair of vertically movable impeller units. A first rough surface including first shot peening indentations is formed on a part of end turn portions of the coil spring. A second rough surface including second shot peening indentations is formed on the entire surface of wire except for the first rough surface.

Abstract: Provided is a method for classifying a powder using a classifier, wherein the method comprises: a mixing step for mixing a powder and an auxiliary agent formed from an alcohol aqueous solution containing 10 to 50 mass % of an alcohol; an introduction step for introducing the powder mixed in the mixing step to the classifier; a heating step for heating a gas; a feed step for feeding the gas heated in the heating step to the classifier; and a classifying step for classifying the powder in the classifier on the basis of grain size.