Abstract: A light-emitting element with high emission efficiency and high reliability is provided. The light-emitting element includes a host material and a guest material in a light-emitting layer. The host material has a function of converting triplet excitation energy into light emission and the guest material emits fluorescence. The molecular structure of the guest material is a structure including a luminophore and protecting groups, and five or more protecting groups are included in one molecule of the guest material. The introduction of the protecting groups into the molecule inhibits energy transfer of triplet excitation energy by the Dexter mechanism from the host material to the guest material. As the protecting group, an alkyl group or a branched-chain alkyl group is used.

Abstract: A novel compound is provided. The novel compound is represented by General Formula (G1). In General Formula (G1), A represents a substituted or unsubstituted condensed aromatic ring having 10 to 30 carbon atoms or a substituted or unsubstituted condensed heteroaromatic ring having 10 to 30 carbon atoms, and R1 represents a substituted or unsubstituted aryl group having 6 to 25 carbon atoms. Each of Y1 and Y2 independently represents a cycloalkyl group having a bridge structure and having 7 to 10 carbon atoms.

Abstract: The method for manufacturing the printed wiring board having a shield layer of the present invention is characterized in that, in a method for manufacturing a printed wiring board wherein a printed wiring circuit is provided on one or both sides of an insulating board and a shield layer is provided on the printed wiring circuit through an insulating layer, a shield layer and an earth circuit are formed on the insulating layer while injecting under pressure a coating for shield from a filling nozzle through a mask.

Abstract: A printed wiring board having a shielding layer for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion, a printed wiring circuit provided on one or both surfaces of the insulating sheet, an insulating layer having a thickness of 20.about.50 .mu.m which is provided on the printed wiring circuit, and an electromagnetic shielding layer provided on the insulating layer.

Abstract: A printed wiring board has a substrate having an outer peripheral edge. A printed circuit is formed on at least one side of the substrate. A shock-absorbing band formed of copper foil is disposed along at least a portion of the outer peripheral edge of at least one side of the substrate and is effective to absorb at least some of the impact applied to the printed wiring board during cutting thereof.

Abstract: A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower openings of the through-holes by means of squeegees. In this method, the mask may be a silk screen provided with open-worked packing holes for packing the filler in the positions corresponding to those in which the through-holes of said printed circuit board are packed. In the above method, the filler may be packed by delivering pressurized filler from a packing nozzle, which comprises 1) a packing means connected both to a manipulation means for actuating a delivery valve for delivering the filler from said nozzle tip and to a supply means for supplying the filler and 2) a nozzle tip attached to the delivery end of said packing nozzle. In the above-described method, said filler may be a solvent-less filler.

Abstract: A method of forming an insulating layer on a printed circuit board for use in a manufacture of the printed circuit board is disclosed. The method comprises steps of providing a base material plate for the printed circuit board, forming a circuit pattern on the base material plate, providing an insulating layer on the circuit pattern, providing a conducting circuit on the insulating layer, and forming the insulating layer by a dry film.

Abstract: A method of manufacturing a printed circuit comprising the following steps: in a connection portion of a printed circuit formed on an insulating substrate, another circuit portion such as a jumper circuit is applied with resin ink; and a connection circuit for the circuit terminal portion of said printed circuit is formed by applying electroconductive ink.

Abstract: A printed wiring board having a shielding layer for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion, a printed wiring circuit provided on one or both surfaces of the insulating sheet, an insulating layer having a thickness of 20.about.50 .mu.m which is provided on the printed wiring circuit, and an electromagnetic shielding layer provided on the insulating layer.

Abstract: In the method for forming through-holes of the present invention, by injecting a conductive material into the through-holes by means of a filling nozzle while removing the excessive conductive material with a squeegee, the filling can quickly and uniformly be performed independently of the board thickness of the substrate and the number and diameter of the through-holes.

Abstract: An apparatus for packing a filler of conductive material into through-holes in a printed circuit board comprises a packing nozzle, an mask and a covering plate. The packing nozzle delivers a filler of conductive material through a delivery opening, and a delivery valve is mounted at the delivery opening. A manipulator is provided on the upper part of the nozzle for manipulating the delivery valve, and a nozzle tip is attachable to and detachable from the delivery opening. The mask has packing holes disposed in positions corresponding to those of the through-holes in the printed circuit board, and the mask is mountable on the upper side of the printed circuit board. The covering plate has escape holes in positions corresponding to those of through-holes in the printed circuit board, and the covering plate is disposable on the lower side of the printed circuit board. A squeegee may be provided on the lower part of the nozzle.

Abstract: To achieve the above object, the invention provides a novel method of filling through holes of a printed wiring board with conductive filler material by initially feeding compressed air to the conductive filler material by initially feeding compressed air to the conductive filler material across mask in the direction of through holes so that pressurized conductive filler material can be filled into through holes from a conductive-material extruding nozzle unit.It is suggested that such silk screen be used for the mask, which is provided with through holes at positions corresponding to the positions of these through holes of the printed wiring board.

Abstract: A method of manufacturing a printed circuit board for use in an electronic circuit is disclosed. The method comprises steps of forming a printed circuit on an insulating base board, of forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and of adhering the conductive ink through an uneven surface formed on a terminal portion to be connected to the printed circuit.

Abstract: A printed wiring board for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion including a possible plated through hole, a printed wiring circuit provided on one or both surface of the insulating sheet, an insulating layer provided on a part of the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer and a part of the printed wiring circuit, a solder resist provided on the electromagnetic wave shielding layer and a sealing member of heat-resistant material or weather-resistant material which is filled or packed in the connecting through hole portion.

Abstract: A double sided or multi-layered printed circuit board comprises an insulating substrate having conductors on opposed major surfaces thereof which are electrically connected together via a through-hole. A sealing member composed of conductive resin fills the through-hole. An insulating layer covers the conductors and sealing member, and an electronic wave-shielding layer covers the insulating layer.

Abstract: A printed circuit board has a vibration-absorbing electroconductive body disposed in a through-hole to electrically interconnect electrical conductors disposed on opposed sides of the board. The electroconductive body is formed from the expansion of a decomposed, foamed electroconductive paste which is heated and hardened to form the electroconductive body.

Abstract: The present invention relates to a printed wiring board, and more particularly to a solder resist film applied on the printed wiring board, and to solder resist printing ink utilized to form such solder resist film.

Abstract: The invention relates to a printed wiring board (7) which includes at least one carbon resistor (3) formed across terminals (2a, 2b) of printed wiring circuit (2). A heat dissipating film layer (4) is formed at least on the carbon resistor (3). Thus, heat produced in the resistor (3) is effectively dissipated.

Abstract: Outer surface of a printed circuit board having circuit conductors on one or both surfaces may be covered by shield film or layer to shield outer noise from reaching the circuit conductors. To shield cross talk and noise from reaching each other, all electrically exposed surfaces of the circuit conductors are covered also by shield film.

Abstract: A printed circuit board comprises a base plate and a circuit conductor formed on at least one of the opposed surfaces of the base plate. A heat-radiating film is formed on at least a portion of the surface of the circuit conductor, and an insulating film is formed over the exposed surfaces of the heat-radiating film and the circuit conductor. At least one opening is formed in the insulating film, and the opening overlies the heat-radiating film thereby directly exposing the heat-radiating film to ambient atmosphere so as to promote dissipation of heat from the circuit conductor during use of the printed circuit board. The opening in the insulating film may be in the form of a slot or may comprise a pattern of circular or oval openings. The heat-radiating film may be copper or nickel paste, or non-organic material such as aluminum oxide.