Patents by Inventor Satoshi Ibe

Satoshi Ibe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240066870
    Abstract: A liquid ejection head includes a recording element substrate and a supporting member. The recording element substrate includes ejection ports that eject liquid, pressure chambers that communicate with respective ejection ports and are supplied with the liquid, and a liquid supply path that supplies the liquid to the pressure chambers. The supporting member is joined with the recording element substrate via an adhesive. The liquid supply path faces a joining portion of the recording element substrate and the supporting member, and includes at least one recess portion on an inner surface of the liquid supply path.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 29, 2024
    Inventors: YUYA YAMADA, SATOSHI IBE
  • Publication number: 20230234353
    Abstract: A recording element substrate includes an ejection port forming member in which an ejection port configured to eject liquid is formed, and a substrate. The substrate includes a liquid supply port that supplies the liquid to the ejection port, a first surface on which the ejection port forming member is placed, and a second surface that is a rear surface of the first surface. The liquid supply port includes a first portion perpendicularly connected to the first surface, and a second portion connected to the first portion. An inner wall of the second portion includes an inclined surface that is inclined toward an inner wall of the first portion such that a width of the second portion is gradually increased toward the second surface. A hydrophilic film is formed at least on the inner wall of the first portion.
    Type: Application
    Filed: December 19, 2022
    Publication date: July 27, 2023
    Inventors: TAKANOBU MANABE, JUNICHIRO IRI, HIROYUKI MURAYAMA, KENJI FUJII, SATOSHI IBE, NARUMI SHINOHARA
  • Patent number: 11123987
    Abstract: In a liquid ejection head and a method of manufacturing the ejection head, an ejection port board is provided with an expanded portion that communicates with a supply port and has an open end that is larger than an opening of the supply port.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: September 21, 2021
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Takanobu Manabe
  • Patent number: 10861703
    Abstract: To provide dummy openings having at least one of arrangement and shape determined depending on the shape of a non-effective region.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: December 8, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hirohisa Fujita, Kenji Fujii, Satoshi Ibe, Makoto Watanabe, Shuhei Oya, Yusuke Hashimoto
  • Publication number: 20200079084
    Abstract: Provided are a lower price liquid ejection head and a method of manufacturing the liquid ejection head. To this end, an ejection port board is provided with an expanded portion that communicates with a supply port and has a larger open end than an opening of the supply port.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 12, 2020
    Inventors: Satoshi Ibe, Takanobu Manabe
  • Patent number: 10442201
    Abstract: A method for manufacturing a liquid ejection head includes: a step of preparing a substrate having a first surface on which energy generation elements and a first layer are provided; and a step of forming a supply port by etching the substrate with an etching liquid or an etching gas from a second surface which is a surface opposite to the first surface so as to enable the etching liquid or the etching gas to reach the first layer, and the first layer is divided by a region which is located between a portion of the first layer covering the energy generation elements and a portion of the first layer to which the etching liquid or the etching gas is reached.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 15, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Kenji Fujii, Yusuke Hashimoto, Shuhei Oya, Hirohisa Fujita
  • Publication number: 20190051533
    Abstract: To provide dummy openings having at least one of arrangement and shape determined depending on the shape of a non-effective region.
    Type: Application
    Filed: August 2, 2018
    Publication date: February 14, 2019
    Inventors: Hirohisa Fujita, Kenji Fujii, Satoshi Ibe, Makoto Watanabe, Shuhei Oya, Yusuke Hashimoto
  • Patent number: 10166779
    Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: January 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shiro Sujaku, Keiji Watanabe, Kouji Hasegawa, Junya Hayasaka, Satoshi Ibe
  • Publication number: 20180319165
    Abstract: A method for manufacturing a liquid ejection head includes: a step of preparing a substrate having a first surface on which energy generation elements and a first layer are provided; and a step of forming a supply port by etching the substrate with an etching liquid or an etching gas from a second surface which is a surface opposite to the first surface so as to enable the etching liquid or the etching gas to reach the first layer, and the first layer is divided by a region which is located between a portion of the first layer covering the energy generation elements and a portion of the first layer to which the etching liquid or the etching gas is reached.
    Type: Application
    Filed: April 27, 2018
    Publication date: November 8, 2018
    Inventors: Satoshi Ibe, Kenji Fujii, Yusuke Hashimoto, Shuhei Oya, Hirohisa Fujita
  • Patent number: 9610773
    Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: April 4, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Keiji Watanabe, Junya Hayasaka, Shiro Sujaku, Kouji Hasegawa
  • Patent number: 9604454
    Abstract: A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: March 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Jun Yamamuro, Satoshi Ibe, Toshiaki Kurosu, Shiro Sujaku
  • Publication number: 20160229184
    Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 11, 2016
    Inventors: Satoshi Ibe, Keiji Watanabe, Junya Hayasaka, Shiro Sujaku, Kouji Hasegawa
  • Publication number: 20160229183
    Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.
    Type: Application
    Filed: February 1, 2016
    Publication date: August 11, 2016
    Inventors: Shiro Sujaku, Keiji Watanabe, Kouji Hasegawa, Junya Hayasaka, Satoshi Ibe
  • Patent number: 9211715
    Abstract: A liquid ejection head including a recording element substrate provided with a substrate and a flow-path-forming member forming a flow path in a principal surface of the substrate, a support member supporting the recording element substrate and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other, wherein the flow-path-forming member is formed in such a manner that an end portion thereof projects from at least one side surface of the substrate, the underfill material covers an external surface of the joint portion and covers the at least one side surface of the substrate in such a manner that the underfill material reaches the projecting end portion of the flow-path-forming member.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: December 15, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Shingo Nagata
  • Patent number: 9174439
    Abstract: A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: November 3, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Yoshinori Tagawa, Jun Yamamuro, Hiroto Komiyama, Kouji Hasegawa, Shiro Sujaku
  • Publication number: 20150290939
    Abstract: A method for manufacturing a liquid ejection head having a substrate, heat generating elements formed at the front surface side of the substrate, and a nozzle layer forming liquid chambers and liquid ejection ports at the front surface side of the substrate, and the method includes a process of preparing a substrate having heat generating elements and a nozzle layer formation material layer at the front surface side, a process of driving the heat generating elements for heating to form air bubbles serving as the liquid chambers in the nozzle layer formation material layer, and a process of forming liquid ejection ports which communicate with the liquid chambers in the nozzle layer formation material layer, and then forming a nozzle layer forming the liquid chambers and the liquid ejection ports at the front surface side of the substrate.
    Type: Application
    Filed: April 6, 2015
    Publication date: October 15, 2015
    Inventors: Jun Yamamuro, Satoshi Ibe, Toshiaki Kurosu, Shiro Sujaku
  • Patent number: 9108406
    Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: August 18, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kouji Hasegawa, Satoshi Ibe, Jun Yamamuro, Shuhei Oya, Shiro Sujaku, Junya Hayasaka
  • Patent number: 9085141
    Abstract: A liquid ejection head and a printing apparatus can perform high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section is formed on the side surface of the substrate.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: July 21, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shuhei Oya, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Junya Hayasaka
  • Publication number: 20150109368
    Abstract: A liquid ejection head including a recording element substrate provided with a substrate and a flow-path-forming member forming a flow path in a principal surface of the substrate, a support member supporting the recording element substrate and an underfill material covering at least a joint portion at which the substrate and the support member are joined to each other, wherein the flow-path-forming member is formed in such a manner that an end portion thereof projects from at least one side surface of the substrate, the underfill material covers an external surface of the joint portion and covers the at least one side surface of the substrate in such a manner that the underfill material reaches the projecting end portion of the flow-path-forming member.
    Type: Application
    Filed: September 8, 2014
    Publication date: April 23, 2015
    Inventors: Satoshi IBE, Shingo Nagata
  • Publication number: 20150062260
    Abstract: There are provided a liquid ejection head and a printing apparatus capable of performing high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section 11 is formed on the side surface of the substrate 1.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 5, 2015
    Inventors: Shuhei OYA, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Junya Hayasaka