Abstract: A semiconductor device formed by the steps of forming a contact hole in an insulation film so as to extend therethrough and so as to expose a conductor body at a bottom part of the contact hole, forming a barrier metal film of tungsten nitride on the bottom part and a sidewall surface of the contact hole with a conformal shape to the bottom part and the sidewall surface of the contact hole, forming a tungsten layer so as to fill the contact hole via the barrier metal film, and forming a tungsten plug in the contact hole by the tungsten layer by polishing away a part of the tungsten film on the insulation film until a surface of the insulation film is exposed, wherein there is conducted a step of cleaning a surface of the conductor body prior to the forming step of the barrier metal film.

Abstract: An LED illumination apparatus comprising a radiative substrate, at least one LED provided on the radiative substrate and a constant current circuit connected to the LED is provided.

Abstract: A method of fabricating a semiconductor device comprises the steps of forming a contact hole in an insulation film so as to extend therethrough and so as to expose a conductor body at a bottom part of the contact hole, forming a barrier metal film of tungsten nitride on the bottom part and a sidewall surface of the contact hole with a conformal shape to the bottom part and the sidewall surface of the contact hole, forming a tungsten layer so as to fill the contact hole via the barrier metal film, and forming a tungsten plug in the contact hole by the tungsten layer by polishing away a part of the tungsten film on the insulation film until a surface of the insulation film is exposed, wherein there is conducted a step of cleaning a surface of the conductor body prior to the forming step of the barrier metal film.

Abstract: In an LED lamp device including a surface mount device type of LED lamp, an LED lighting circuit protecting part, a resistive element, a circuit part, and a case part, the circuit part has a metal plate which is embedded in the case part in a state where the metal plate is partially exposed, the LED lamp is mounted on the exposed portion on a front side of the metal plate, and the resistive element is mounted on the exposed portion on a rear side of the metal plate.

Abstract: An LED lamp device includes a light emitting element that emits light in a blue-based or violet-based color, an LED having a fluorescent material that emits fluorescent light in a yellow to yellow-green-based color in response to light received from the light emitting element, a lens having a light incident surface to which light emitted from the LED comes in and a convex lens part that radiates incident light, and a light shielding member provided on the light radiation side of the LED, having an opening, and made of a non-transmitting material to light from the LED. The member externally radiates light from the LED radiated through the lens from the opening and cuts the peripheral part of the light from the LED. Therefore, illumination light with no color irregularity in yellow observed around the illumination region can be provided, and a lamp device suitable for illumination can be provided.

Abstract: Aiming at obtaining stable and uniform element isolation characteristics without forming the oxide film liner or the like on the inner wall surface of the isolation trench, and ensuring a sufficient level of adhesiveness of the insulating material filled in the isolation trench, and obtaining uniform and excellent element isolation characteristics and a sufficient level of adhesiveness of the buried insulating material, even when applied to large-diameter semiconductor substrates, a thermal oxide film is formed on the inner wall surface of isolation trenches, and a silicon semiconductor substrate is then annealed using a lamp annealer at a temperature higher than in the process of forming thermal oxide film, typically at 950° C. for a predetermined short time (30 seconds herein, for example), wherein the annealing modifies at least the surficial portion of thermal oxide film to have a further complete and uniform state of oxidation.

Abstract: A weather strip has a trim part adapted to be mounted on a flange, a seal part having a hollow portion and a cover lip. The trim part has a bottom wall portion, and an interior and an exterior side wall portions which constitute a pair of side wall portions and is formed into a shape, as a whole, having a substantially U-shaped cross section, and an insert of a center bonded type is embedded in the interior of the trim part so constructed. In a skeletal piece of the insert, an angle ?a formed by a bottom wall part embedded in the bottom wall portion and an internal part embedded in the interior side wall portion and an angle ?b formed by the bottom wall part and an external part embedded in the exterior side wall portion are made to form acute angles.

Abstract: When an STI element isolation structure is formed, it is formed in such a manner that its upper portion protrudes further than the surface of a substrate than by a normal STI method, and a dummy electrode pattern is formed in a gate electrode forming portion. After a source/drain is formed in alignment with a gap portion, a conductive layer formed by filling the gap portion with W is formed, the dummy electrode pattern is removed, and a gate insulating film and a gate electrode are formed.

Abstract: A light source device includes a light emitting diode (LED) device, a lens and a light diffusing layer. The LED device includes an LED chip, which emits light, and a fluorescent, which converts a part of the light from the LED chip. The lens is located on a side of a light emitting face of the LED device. The light diffusing layer is located between the LED device and the lens. An air layer exists between the light diffusing layer and the LED device or between the light diffusing layer and the lens.

Abstract: A method of fabricating a semiconductor device comprises the steps of forming a contact hole in an insulation film so as to extend therethrough and so as to expose a conductor body at a bottom part of the contact hole, forming a barrier metal film of tungsten nitride on the bottom part and a sidewall surface of the contact hole with a conformal shape to the bottom part and the sidewall surface of the contact hole, forming a tungsten layer so as to fill the contact hole via the barrier metal film, and forming a tungsten plug in the contact hole by the tungsten layer by polishing away a part of the tungsten film on the insulation film until a surface of the insulation film is exposed, wherein there is conducted a step of cleaning a surface of the conductor body prior to the forming step of the barrier metal film.

Abstract: A light-emitting device has two light-emitting element. In a substrate portion of the light-emitting device having a first internal positive electrode connected to the positive electrode side of a first light-emitting element, a first internal negative electrode connected to the negative electrode side of the first light-emitting element, a second internal positive electrode connected to the positive electrode side of a second light-emitting element, and a second internal negative electrode connected to the negative electrode side of the second light-emitting element, these electrodes are provided so that homopolar electrodes are disposed diagonally.

Abstract: A glass run for use in a motor vehicle includes an outside wall, an inside wall and a bottom wall and has a generally U-shaped cross-section. An outside seal lip and an inside seal lip respectively project from open ends of the outside wall and the inside wall to extend into an interior of the glass run. An outside cover lip and an inside cover lip respectively project from the open ends of the outside wall and the inside wall for covering an outside end and an inside end of the door frame. And a corner part of the glass run, which is adapted to be attached to a corner of the door frame, has a lip extension along a projecting end of the outside cover lip for covering a joint between an upper frame and a vertical frame of the door frame.

Abstract: A method of producing a semiconductor device is disclosed that is able to reduce fluctuations of a sheet resistance of a silicide layer in the semiconductor device formed by a salicide process. When depositing a titanium nitride film on a cobalt film in the salicide process, the thickness of the titanium nitride film is set to be sufficiently small so that a nano-grain structure or an amorphous structure is formed in the titanium nitride film. In the titanium nitride film, the titanium composition is enriched.

Abstract: An LED illumination apparatus comprising a radiative substrate, at least one LED provided on the radiative substrate and a constant current circuit connected to the LED is provided.

Abstract: An illumination device having a first light source, a second light source, whose luminous color differs from that of said first light source, and a controller for controlling the illuminating condition of each of the first light source and the second light source is configured. The controller turns on the first light source so that the light intensity of the first light source gradually increases at an early stage of a turning-on operation. Moreover, the controller turns on the second light source when the light intensity of the first light source gradually increases after a lapse of a predetermined time from the start of the turning-on of the first light source.

Abstract: A glass run is provided with extruded portions and a molded portion. The extruded portions and molded portion each have an extension portion provided in the base portion so as to extend and contract in a direction toward the inside and outside of a vehicle. The extension portion is provided at a position which deviates from a position of the base portion which constitutes a section defined as extending from a position which intersects with an extension along an interior side of the door window glass to a position which intersects with an extension along an exterior side of the door window glass and to which an end face of the door window glass is opposed.

Abstract: A weather strip has a trim part adapted to be mounted on a flange, a seal part having a hollow portion and a cover lip. The trim part has a bottom wall portion, and an interior and an exterior side wall portions which constitute a pair of side wall portions and is formed into a shape, as a whole, having a substantially U-shaped cross section, and an insert of a center bonded type is embedded in the interior of the trim part so constructed. In a skeletal piece of the insert, an angle ?a formed by a bottom wall part embedded in the bottom wall portion and an internal part embedded in the interior side wall portion and an angle ?b formed by the bottom wall part and an external part embedded in the exterior side wall portion are made to form acute angles.

Abstract: A method of fabricating a semiconductor device includes the steps depositing a metal film on a silicon substrate so as to cover a polysilicon gate electrode and a diffusion region on the silicon substrate, forming a silicide layer by causing a reaction between a surface of the polysilicon gate electrode and the metal film and between a surface of the diffusion region and the metal film, and removing the metal film after the step of forming the silicide layer, wherein there is provided, before the deposition step of the metal film, a step of removing a native oxide film from a surface of the polysilicon gate electrode and a surface of the diffusion region, and wherein there is provided, after the step of removing the native oxide film, the step of forming a chemical oxide film on the surface of the polysilicon gate electrode and the surface of the diffusion region.

Abstract: An LED lamp device includes a light emitting element that emits light in a blue-based or violet-based color, an LED having a fluorescent material that emits fluorescent light in a yellow to yellow-green-based color in response to light received from the light emitting element, a lens having a light incident surface to which light emitted from the LED comes in and a convex lens part that radiates incident light, and a light shielding member provided on the light radiation side of the LED, having an opening, and made of a non-transmitting material to light from the LED. The member externally radiates light from the LED radiated through the lens from the opening and cuts the peripheral part of the light from the LED. Therefore, illumination light with no color irregularity in yellow observed around the illumination region can be provided, and a lamp device suitable for illumination can be provided.