Patents by Inventor Satoshi Ishino

Satoshi Ishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150372504
    Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.
    Type: Application
    Filed: August 28, 2015
    Publication date: December 24, 2015
    Inventors: Noboru KATO, Ikuhei KIMURA, Kimikazu IWASAKI, Satoshi ISHINO
  • Publication number: 20150325900
    Abstract: A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.
    Type: Application
    Filed: July 17, 2015
    Publication date: November 12, 2015
    Inventors: Takahiro BABA, Yasuko YOSHINAGA, Satoshi ISHINO, Jun SASAKI, Noboru KATO, Kuniaki YOSUI
  • Patent number: 9177696
    Abstract: A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: November 3, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki
  • Patent number: 9173289
    Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: October 27, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
  • Patent number: 9165239
    Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: October 20, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Ikuhei Kimura, Kimikazu Iwasaki, Satoshi Ishino
  • Patent number: 9166291
    Abstract: An antenna device includes an antenna coil including a first conductive pattern disposed on a first major surface of a magnetic sheet, a second conductive pattern disposed on a first major surface of a non-magnetic sheet, and an interlayer conductor connecting the first conductive pattern and second conductive pattern. The antenna coil including the first conductive pattern and second conductive pattern defines a spiral or substantially spiral pattern. The antenna device is a resin multilayer structure in which its base body is a laminate of the magnetic layer and non-magnetic layer and the predetermined patterns are disposed inside and outside the laminate.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: October 20, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
  • Patent number: 9161160
    Abstract: A wireless communication system includes a plurality of communication devices, and a communication terminal that is a separate structure from the plurality of communication devices. Each of the communication devices includes a coupling portion to be coupled with the communication terminal, a power source, and a signal processing section arranged to process a signal received and a signal to be sent. The communication terminal includes neither a power source nor a signal processing section, and the communication terminal includes a coupling portion to be coupled with the coupling portion of each of the communication devices, an antenna arranged to send and receive radio waves, and a connector arranged to connect the coupling portion and the antenna to each other.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: October 13, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Satoshi Ishino, Noboru Kato
  • Patent number: 9136228
    Abstract: An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer provided on a surface of the semiconductor substrate. An ESD protection circuit is provided on or in an outer layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post electrodes. First ends of the interlayer wiring lines disposed in the thickness direction are connected to the input/output electrodes disposed on the surface of the semiconductor substrate, and second ends of the interlayer wiring lines are connected to first ends of the in-plane wiring lines routed in plan view. Prismatic post electrodes are provided between second ends of the in-plane wiring lines and terminal electrodes.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: September 15, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki, Kosuke Yamada, Satoshi Ishino
  • Patent number: 9113560
    Abstract: A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: August 18, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
  • Patent number: 9064198
    Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: June 23, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Ikuhei Kimura, Kimikazu Iwasaki, Satoshi Ishino
  • Publication number: 20150173184
    Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
    Type: Application
    Filed: February 23, 2015
    Publication date: June 18, 2015
    Inventors: Noboru KATO, Jun SASAKI, Satoshi ISHINO
  • Publication number: 20150091674
    Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
    Type: Application
    Filed: December 9, 2014
    Publication date: April 2, 2015
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI, Kuniaki YOSUI, Takahiro BABA, Nobuo IKEMOTO
  • Patent number: 8993893
    Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: March 31, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
  • Publication number: 20150048906
    Abstract: A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
  • Publication number: 20150024700
    Abstract: A signal line conductor extends in a direction in which a signal propagates, and a dielectric, surrounding the signal line conductor, also extends in the direction in which the signal propagates. Conductive films that define and function as a ground conductor extend on a side surface of the dielectric in the direction in which the signal propagates. Furthermore, conductive films that define and function as a bridge conductor extend on a side surface of the dielectric in a direction across the direction in which the signal propagates, and thus connect the conductive films to each other.
    Type: Application
    Filed: October 8, 2014
    Publication date: January 22, 2015
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
  • Publication number: 20150022288
    Abstract: A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.
    Type: Application
    Filed: October 8, 2014
    Publication date: January 22, 2015
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
  • Publication number: 20150022289
    Abstract: A signal line includes a first line portion at a first layer level and a second line portion at a second layer level, which are connected by a first interlayer connection. A first ground portion at the first layer level includes end portions closer to the first line portion than an intermediate portion, and a second ground portion at the second layer level includes end portions closer to the second line portion than an intermediate portion. A second interlayer connection connects one of the end portions of the first ground portion and one of the end portions of the second ground portion. A distance between the first and second interlayer connections is less than a distance between the first line portion and the intermediate portion of the first ground portion and is less than a distance between the second line portion and the intermediate portion of the second ground portion.
    Type: Application
    Filed: October 8, 2014
    Publication date: January 22, 2015
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
  • Publication number: 20150022286
    Abstract: A high-frequency signal line includes a base layer including first and second principal surfaces, a signal line provided on the first principal surface, a ground conductor provided on the first principal surface along the signal line, and a plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer.
    Type: Application
    Filed: October 8, 2014
    Publication date: January 22, 2015
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
  • Publication number: 20140376199
    Abstract: A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination.
    Type: Application
    Filed: September 9, 2014
    Publication date: December 25, 2014
    Inventors: Noboru KATO, Masahiro OZAWA, Satoshi ISHINO, Jun SASAKI
  • Publication number: 20140299374
    Abstract: A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors.
    Type: Application
    Filed: June 24, 2014
    Publication date: October 9, 2014
    Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI