Patents by Inventor Satoshi Ishino
Satoshi Ishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150372504Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.Type: ApplicationFiled: August 28, 2015Publication date: December 24, 2015Inventors: Noboru KATO, Ikuhei KIMURA, Kimikazu IWASAKI, Satoshi ISHINO
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Publication number: 20150325900Abstract: A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.Type: ApplicationFiled: July 17, 2015Publication date: November 12, 2015Inventors: Takahiro BABA, Yasuko YOSHINAGA, Satoshi ISHINO, Jun SASAKI, Noboru KATO, Kuniaki YOSUI
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Patent number: 9177696Abstract: A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors.Type: GrantFiled: June 24, 2014Date of Patent: November 3, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki
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Patent number: 9173289Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.Type: GrantFiled: February 23, 2015Date of Patent: October 27, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
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Patent number: 9165239Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.Type: GrantFiled: January 31, 2013Date of Patent: October 20, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Ikuhei Kimura, Kimikazu Iwasaki, Satoshi Ishino
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Patent number: 9166291Abstract: An antenna device includes an antenna coil including a first conductive pattern disposed on a first major surface of a magnetic sheet, a second conductive pattern disposed on a first major surface of a non-magnetic sheet, and an interlayer conductor connecting the first conductive pattern and second conductive pattern. The antenna coil including the first conductive pattern and second conductive pattern defines a spiral or substantially spiral pattern. The antenna device is a resin multilayer structure in which its base body is a laminate of the magnetic layer and non-magnetic layer and the predetermined patterns are disposed inside and outside the laminate.Type: GrantFiled: February 7, 2013Date of Patent: October 20, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
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Patent number: 9161160Abstract: A wireless communication system includes a plurality of communication devices, and a communication terminal that is a separate structure from the plurality of communication devices. Each of the communication devices includes a coupling portion to be coupled with the communication terminal, a power source, and a signal processing section arranged to process a signal received and a signal to be sent. The communication terminal includes neither a power source nor a signal processing section, and the communication terminal includes a coupling portion to be coupled with the coupling portion of each of the communication devices, an antenna arranged to send and receive radio waves, and a connector arranged to connect the coupling portion and the antenna to each other.Type: GrantFiled: June 3, 2013Date of Patent: October 13, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Noboru Kato
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Patent number: 9136228Abstract: An ESD protection device includes a semiconductor substrate including input/output electrodes and a rewiring layer provided on a surface of the semiconductor substrate. An ESD protection circuit is provided on or in an outer layer of the semiconductor substrate, and the input/output electrodes are connected to the ESD protection circuit. The rewiring layer includes interlayer wiring lines, in-plane wiring lines, and post electrodes. First ends of the interlayer wiring lines disposed in the thickness direction are connected to the input/output electrodes disposed on the surface of the semiconductor substrate, and second ends of the interlayer wiring lines are connected to first ends of the in-plane wiring lines routed in plan view. Prismatic post electrodes are provided between second ends of the in-plane wiring lines and terminal electrodes.Type: GrantFiled: November 30, 2012Date of Patent: September 15, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Kosuke Yamada, Satoshi Ishino
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Patent number: 9113560Abstract: A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.Type: GrantFiled: October 25, 2013Date of Patent: August 18, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
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Patent number: 9064198Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.Type: GrantFiled: April 26, 2007Date of Patent: June 23, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Ikuhei Kimura, Kimikazu Iwasaki, Satoshi Ishino
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Publication number: 20150173184Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.Type: ApplicationFiled: February 23, 2015Publication date: June 18, 2015Inventors: Noboru KATO, Jun SASAKI, Satoshi ISHINO
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Publication number: 20150091674Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.Type: ApplicationFiled: December 9, 2014Publication date: April 2, 2015Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI, Kuniaki YOSUI, Takahiro BABA, Nobuo IKEMOTO
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Patent number: 8993893Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.Type: GrantFiled: February 19, 2014Date of Patent: March 31, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Satoshi Ishino
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Publication number: 20150048906Abstract: A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.Type: ApplicationFiled: November 3, 2014Publication date: February 19, 2015Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
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Publication number: 20150024700Abstract: A signal line conductor extends in a direction in which a signal propagates, and a dielectric, surrounding the signal line conductor, also extends in the direction in which the signal propagates. Conductive films that define and function as a ground conductor extend on a side surface of the dielectric in the direction in which the signal propagates. Furthermore, conductive films that define and function as a bridge conductor extend on a side surface of the dielectric in a direction across the direction in which the signal propagates, and thus connect the conductive films to each other.Type: ApplicationFiled: October 8, 2014Publication date: January 22, 2015Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
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Publication number: 20150022288Abstract: A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.Type: ApplicationFiled: October 8, 2014Publication date: January 22, 2015Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
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Publication number: 20150022289Abstract: A signal line includes a first line portion at a first layer level and a second line portion at a second layer level, which are connected by a first interlayer connection. A first ground portion at the first layer level includes end portions closer to the first line portion than an intermediate portion, and a second ground portion at the second layer level includes end portions closer to the second line portion than an intermediate portion. A second interlayer connection connects one of the end portions of the first ground portion and one of the end portions of the second ground portion. A distance between the first and second interlayer connections is less than a distance between the first line portion and the intermediate portion of the first ground portion and is less than a distance between the second line portion and the intermediate portion of the second ground portion.Type: ApplicationFiled: October 8, 2014Publication date: January 22, 2015Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
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Publication number: 20150022286Abstract: A high-frequency signal line includes a base layer including first and second principal surfaces, a signal line provided on the first principal surface, a ground conductor provided on the first principal surface along the signal line, and a plurality of high-permittivity portions arranged along the signal line and in contact with a portion of both the signal line and the ground conductor, each of the high-permittivity portions having a higher specific permittivity than the base layer.Type: ApplicationFiled: October 8, 2014Publication date: January 22, 2015Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI
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Publication number: 20140376199Abstract: A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination.Type: ApplicationFiled: September 9, 2014Publication date: December 25, 2014Inventors: Noboru KATO, Masahiro OZAWA, Satoshi ISHINO, Jun SASAKI
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Publication number: 20140299374Abstract: A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors.Type: ApplicationFiled: June 24, 2014Publication date: October 9, 2014Inventors: Noboru KATO, Satoshi ISHINO, Jun SASAKI