Abstract: A manufacturing method of a plate-like member assembly includes the steps of: preparing a first plate-like member including a projecting region, projecting from one surface of the first plate-like member along a thickness direction thereof, on the one surface; forming a light transmitting film, having a light transmitting property, in a nonoverlapping region, not-overlapping the projecting region, on the one surface of the first plate-like member; arranging a fixing member to cover a border between an overlapping region, overlapping the projecting region, and the nonoverlapping region with the light transmitting film intervening between the fixing member and the first plate-like member; and arranging a second plate-like member in such way that the light transmitting film and the fixing member intervene between the second plate-like member and the first plate-like member.

Abstract: A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.