Patents by Inventor Satoshi Kitaoka

Satoshi Kitaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7614293
    Abstract: A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: November 10, 2009
    Assignees: Towa Corporation, Japan Fine Ceramics Center
    Inventors: Takaki Kuno, Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima, Seiichi Suda, Masato Yoshiya, Norio Yamaguchi
  • Publication number: 20090110429
    Abstract: A powder conveyance unit, providable to an image forming apparatus, includes a path forming member configured to form a powder conveyance path including an inner wall to convey powder therethrough and connect first and second powder containers, and a substantially planar plate-like powder remover configured to remove powder adhering to the inner wall of the powder conveyance path. The plate-like powder remover is disposed in the powder conveyance path with both lateral edges thereof in a width direction perpendicular to a powder conveyance direction in the powder conveyance path contacting or nearly contacting the inner wall of the powder conveyance path. Opposed flat surfaces of the plate-like powder remover moves reciprocally between opposed surfaces of the inner wall of the powder conveyance path to remove powder adhering to the surfaces of the inner wall of the powder conveyance path.
    Type: Application
    Filed: October 30, 2008
    Publication date: April 30, 2009
    Inventor: Satoshi KITAOKA
  • Publication number: 20090107361
    Abstract: An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).
    Type: Application
    Filed: December 27, 2006
    Publication date: April 30, 2009
    Applicants: TOWA CORPORATION, JAPAN FINE CERAMICS CENTER
    Inventors: Takaki Kuno, Yoshinori Noguchi, Keiji Maeda, Satoshi Kitaoka, Naoki Kawashima
  • Publication number: 20080296532
    Abstract: A resin molding die has a molding surface formed of a low adhesion material formed of a solid solution of La—Y2O3 produced from Y2O3 and an other oxide of La2O3. La2O3 contains La, which has an ionic radius larger than Y3+, and is larger in basicity than Y2O3. The low adhesion material contains La2O3 at a predetermined ratio relative to a total of Y2O3 and La2O3. The low adhesion material thus has a large iconic radius contributing to a smaller number of sites per unit area than Y2O3, a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y2O3, and a ratio contributing to shape retention. The low adhesion material thus less adhesive and more shape-retentive than Y2O3 configures the molding surface. A low adhesion material that is less adhesive to a basic substance than Y2O3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained.
    Type: Application
    Filed: December 27, 2006
    Publication date: December 4, 2008
    Inventors: Takaki Kuno, Yoshinori Noguchi, Keiji Maeda, Satoshi Kitaoka, Naoki Kawashima, Masato Yoshiya, Seiichi Suda
  • Publication number: 20080279593
    Abstract: A toner bottle unit detachable to an image forming apparatus includes an opening/closing device for making an opening of a toner bottle by removing a cap from the opening and closing the opening by attaching the cap. An opening/closing operation device is provided to swing from an open position, in which the opening/closing device makes the opening, to close position, in which the opening/closing device closes the opening. The opening/closing device is operated to make the opening in conjunction with swinging movement of the opening/closing operation device from the close position to the open position, and closes the opening in conjunction with the swinging movement of the opening/closing operation device from the open position to the close position. The opening/closing operation device is swung between the open and close positions substantially around the central axis.
    Type: Application
    Filed: December 14, 2007
    Publication date: November 13, 2008
    Inventor: Satoshi Kitaoka
  • Publication number: 20080254286
    Abstract: A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.
    Type: Application
    Filed: March 3, 2005
    Publication date: October 16, 2008
    Inventors: Takaki Kuno, Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima, Seiichi Suda, Masato Yoshiya, Norio Yamaguchi
  • Patent number: 7407146
    Abstract: A composite material used for a resin mold for forming hardened resin by hardening fluid resin is provided. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: August 5, 2008
    Assignees: Towa Corporation, Japan Fine Ceramics Center
    Inventors: Takaki Kuno, Keiji Maeda, Yosinori Noguchi, Satoshi Kitaoka, Naoki Kawashima
  • Patent number: 7287975
    Abstract: A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 ?m; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: October 30, 2007
    Assignees: Towa Corporation, Japan Fine Ceramics Center
    Inventors: Kazuhiko Bandoh, Keiji Maeda, Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima
  • Patent number: 7222471
    Abstract: A packing tool for packing large articles such as image forming apparatuses has a pallet to place the article, and an article-fixing member to secure the article to the pallet. The article-fixing member is accommodated in an accommodating section in the pallet. When securing the article to the pallet, the article-fixing member is pulled out and wound around the article.
    Type: Grant
    Filed: December 24, 2003
    Date of Patent: May 29, 2007
    Assignee: Ricoh Company, Ltd.
    Inventors: Juusei Matsumoto, Tomoaki Arai, Satoshi Ishihara, Sakae Ishikawa, Takefumi Adachi, Hisao Chikano, Satoshi Kitaoka, Junichi Murano
  • Publication number: 20060286346
    Abstract: A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.
    Type: Application
    Filed: January 25, 2005
    Publication date: December 21, 2006
    Inventors: Takaki Kuno, Keiji Maeda, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima
  • Publication number: 20060226046
    Abstract: A packing tool for packing large articles such as image forming apparatuses has a pallet to place the article, and an article-fixing member to secure the article to the pallet. The article-fixing member is accommodated in an accommodating section in the pallet. When securing the article to the pallet, the article-fixing member is pulled out and wound around the article.
    Type: Application
    Filed: June 8, 2006
    Publication date: October 12, 2006
    Inventors: Juusei Matsumoto, Tomoaki Arai, Satoshi Ishihara, Sakae Ishikawa, Takefumi Adachi, Hisao Chikano, Satoshi Kitaoka, Junichi Murano
  • Publication number: 20060093693
    Abstract: A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.
    Type: Application
    Filed: November 1, 2005
    Publication date: May 4, 2006
    Inventors: Takaki Kuno, Yoshinori Noguchi, Keiji Maeda, Seiichi Suda, Satoshi Kitaoka, Naoki Kawashima, Masato Yoshiya
  • Publication number: 20050154113
    Abstract: The present invention relates to a composite material used for a resin mold for forming hardened resin by hardening fluid resin. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 14, 2005
    Inventors: Takaki Kuno, Keiji Maeda, Yosinori Noguchi, Satoshi Kitaoka, Naoki Kawashima
  • Publication number: 20050035504
    Abstract: An electromagnetic type molten metal supply device having superior accuracy in supplying molten metal. This device is comprised of a rotary vane that rotates in accordance with the movement of molten metal inside a molten metal transport conduit, and the amount of molten metal being transported can be measured by detecting the rotational frequency of the rotary vane.
    Type: Application
    Filed: May 19, 2003
    Publication date: February 17, 2005
    Applicants: JAPAN FINE CERAMICS CENTER, ROOT CO., LTD., KIMURA CO., LTD., YUSHIN KOSAN CO., LTD., MARUSU GLAZE CO., LTD.
    Inventors: Satoshi Kitaoka, Kazumi Kashiwagi, Fusayuki Nanjo, Hiroshi Kawamoto, Katsutoshi Noda, Masane Kimura, Masaharu Kimura, Yuji Kawasaki, Itsuo Suzuki, Sadahiko Suzuki, Toshio Kume
  • Publication number: 20040253334
    Abstract: A resin mold material includes a number of one-dimensional communicating holes extending substantially linearly from a mold surface toward inside and having diameter from 1 nm order to 100 nm order; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface, layer; and a number of three-dimensional communicating holes provided to communicate to the one-dimensional communicating holes in the support layer and having 1 &mgr;m order diameter. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing contact area of the mold surface and the liquid resin, i.e., the mold surface being repellant to the liquid resin. Gas in a cavity is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, release property of a molded product from the mold surface is improved and generation of voids is suppressed.
    Type: Application
    Filed: May 26, 2004
    Publication date: December 16, 2004
    Applicants: TOWA CORPORATION, JAPAN FINE CERAMICS CENTER
    Inventors: Kazuhiko Bandoh, Keiji Maeda, Takaki Kuno, Yoshinori Noguchi, Satoshi Kitaoka, Naoki Kawashima
  • Publication number: 20040182048
    Abstract: A packing tool for packing large articles such as image forming. apparatuses has a palette to place the article, and an article-fixing member to secure the article to the palette. The article-fixing member is accommodated in an accommodating section in the palette. When securing the article to the palette, the article-fixing member is pulled out and wound around the article.
    Type: Application
    Filed: December 24, 2003
    Publication date: September 23, 2004
    Inventors: Juusei Matsumoto, Tomoaki Arai, Satoshi Ishihara, Sakae Ishikawa, Takefumi Adachi, Hisao Chikano, Satoshi Kitaoka, Junichi Murano