Abstract: The invention provides a means capable of effectively inactivating and removing allergen or a precursor thereof. The invention relates to an allergen-reducing agent containing water and a water-soluble polymer compound having units having hydroxy or carboxy groups wherein at least a part of hydrogen atoms of the hydroxy or carboxy groups are substituted by specific groups containing a polyether group.

Abstract: Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes preparing as the resin material (Y) a low-melting-point oxymethylene-based polymer (B) having a melting point lower than that of the oxymethylene-based polymer (A) by 5 to 50° C., or preparing as the resin material (Y) the resin material (X) or another resin material, and providing the low-melting-point oxymethylene-based polymer (B) between the resin material (Y) and the resin material (X) and heating resin materials.

Abstract: According to an embodiment, an ultrasonic flaw detection device is provided with: an ultrasonic probe, which applies ultrasonic waves, by driving a plurality of ultrasonic elements, to a test object to be inspected, and which receives reflected ultrasonic waves from the test object; and an analysis unit, which analyzes the signals of the reflected ultrasonic waves received by the ultrasonic probe, and which calculates the flaw detection results. The analysis unit calculates the flaw detection results using an ultrasonic wave propagation path obtained on the basis of the surface information of the test object having the ultrasonic waves applied thereto, thereby obtaining highly accurate detection results even the surface of the test object is formed in complex shape.

Abstract: Described herein are methods and systems for aligning a wafer using a wafer leveling map with alignment marks. A set of alignment marks can be selected to create overlay correction parameters to realign the wafer. Alignment marks that are near wafer leveling hotspots, or alignment marks that have poor reproducibility are not selected for realignment purposes. The wafer leveling data is used to determine which alignment marks have poor reproducibility and can create an unstable offset. The wafer leveling data identifies areas on the wafer that are uneven. Only alignment marks which have a stable offset are used to calculate the associated overlay correction parameters.

Abstract: Provided are a method of bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), including: preparing an oxymethylene-based polymer composition (B) as resin material (Y), and resin material (X); or preparing resin material (X) and a resin material identical to resin material (X) or another resin material as resin material (Y), and providing polymer composition (B) between resin material (Y) and resin material (X); and heating: wherein polymer composition (B) has a melting point lower than that of polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and 50% or more of a peak area determined from a peak showing the molten state of polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of polymer (A) by 5° C. or more; and a structure obtained thereby.

Abstract: An ultrasonic flaw detector including an ultrasonic probe for emitting an ultrasonic wave on an object to be inspected and receiving a reflected ultrasonic wave from the object, a drive element control unit for controlling a plurality of ultrasonic elements to emit an ultrasonic wave on the ultrasonic probe and to control a reflected ultrasonic wave from the ultrasonic probe, and a calculation unit for obtaining, by using a refraction angle of the ultrasonic wave at a time of the ultrasonic wave entering the object, an incident position of the ultrasonic wave on a surface of the object, and a surface shape of a surface of the object at the incident position, the incident angle of the ultrasonic wave entering the incident position, and obtaining a plurality of ultrasonic elements to be driven, based on the incident position and the incident angle.

Abstract: Overlay control methods, semiconductor manufacturing method and a semiconductor manufacturing apparatus are provided for restraining overlay error between lithography processes, of a semiconductor manufacturing process, within a tolerance of a semiconductor device. According to one or more aspects, enhanced overlay control mechanisms are provided to enable previous layers to perform corrections to an extent that does not exceed a correction ability of a next layer. For instance, the next layer can inform the previous layer of a tolerated range that is correctable so that the previous layer can perform corrections without exceeding the tolerate range. Accordingly, a feedback loop is established that extends across two exposure events and is not closed within a single exposure event as with conventional systems.

Abstract: Provided is an oxymethylene copolymer composition for a stretched material having a high strength and a high elastic modulus, the composition including: an oxymethylene copolymer; and a crosslinkable compound to be blended with the oxymethylene copolymer in an amount of 0.001 to 0.05 part by mass with respect to 100 parts by mass of the oxymethylene copolymer. The present invention also relates to a stretched material obtained by using the oxymethylene copolymer composition. Further, the present invention relates to a structure obtained by the secondary processing of the above stretched material, and a structure obtained by using the above oxymethylene copolymer composition in a bonding layer of the structure. The present invention also relates to a method of producing a structure, the method including: using the oxymethylene copolymer composition in a bonding layer of the structure; and removing a polyalkylene glycol component with water or a solvent.

Abstract: An exposure method has irradiating a mask with light based on an exposure performing condition, a first mask pattern and a second mask pattern being formed in the mask, and projecting images of the first mask pattern and second mask pattern onto a wafer through a projection lens, a lower-layer film material and a photoresist being sequentially laminated on the wafer, wherein the exposure performing condition is a condition on which, when exposure is performed on a predetermined exposure condition, the predetermined exposure condition is adjusted such that a difference between a wafer position at which a best focus is obtained for the image of the first mask pattern and a wafer position at which a best focus is obtained for the image of the second mask pattern falls within a predetermined range, the wafer position of the first mask pattern and the wafer position of the second mask pattern being predicted using film thicknesses and optical characteristics of the photoresist and the lower-layer film material.

Abstract: A welding system has: a welding mechanism, a reception laser light source, a reception optical mechanism, an interferometer, a data recording/analysis mechanism and a data recording/analysis mechanism. The reception laser light source generates reception laser light so as to irradiate the object to be welded with the reception laser light for the purpose of detecting a reflected ultrasonic wave obtained as a result of reflection of a transmission ultrasonic wave. The reception optical mechanism transmits, during or after welding operation, the reception laser light generated from the reception laser light source to the surface of the object to be welded for irradiation while moving, together with the welding mechanism, relative to the object to be welded and collects laser light scattered/reflected at the surface of the object to be welded.

Abstract: A welding inspection method has steps of: generating transmission laser light for generating an ultrasonic wave and transmitting the transmission laser light to an object to be inspected during or after welding operation for irradiation; generating reception laser light for detecting an ultrasonic wave and transmitting the reception laser light to the object to be inspected for irradiation; collecting laser light scattered and reflected at surface of the object to be inspected; performing interference measurement of the laser light and obtaining an ultrasonic signal; and analyzing the ultrasonic signal obtained by the interference measurement. At least one of the transmission laser light generated in the transmission laser light irradiation step and the reception laser light generated in the reception laser light irradiation step is irradiated onto a welded metal part or a groove side surface.

Abstract: A cleaning sheet (1A) includes: a substrate sheet (2); and a plurality of long-fiber bundles (3) provided thereon, each long-fiber bundle (3) being made by aggregating long fibers (31), the long-fiber bundles (3) being arranged side-by-side and joined to the substrate sheet (2). Each long-fiber bundle (3) is joined together by fiber-joining sections (32). Each long-fiber bundle (3) is joined to the substrate sheet (2) by sheet-joining sections (21). Each sheet-joining section (21) is provided so as to overlap one of the fiber-joining sections (32). Each long-fiber bundle (3) has been cut by linear cut sections (24), each linear cut section (24) being formed in a region between adjacent sheet-joining sections (21). Each long-fiber bundle (3) includes cut fibers (311) and uncut fibers (312).

Abstract: The present invention has an object of providing a molded article of a composite structure obtained by bonding a polar thermoplastic resin, especially polyacetal, with another resin in a simple manner. According to the present invention, a molded article of a composite structure obtained by bonding a polar thermoplastic resin and a resin containing an aliphatic ester structure as a main component to each other in the state where at least a face at which both of the materials contact each other is in a melted state can be provided.

Abstract: The object is to provide a brush which does not easily damage metal during contact therewith. The present invention can provide a brush formed using polyacetal-containing filaments, in which the flexural rigidity per filament is 1 to 100 ?g·m2/yarn.

Abstract: The present invention has an object of providing a novel multilayer composite fiber using polyacetal mainly derived from methanol, which is a petroleum-independent raw material, and having a low environmental load, and also providing a nonwoven fabric obtained by thermally bonding such fibers. According to the present invention, a multilayer composite fiber comprising a resin containing polylactic acid as a main component and a resin containing polyacetal as a main component, in which the components both form continuous layers in an axial direction of the fiber, and also a nonwoven fabric obtained by thermally bonding such fibers, can be provided.

Abstract: A photomask unit includes a mask substrate having patterns arranged at a pitch P; and a pellicle which protects the mask substrate, wherein the pellicle is configured so that transmittance of incident light of an incident angle ? (0°<?<90°) is higher than transmittance of incident light of an incident angle 0°.

Abstract: The problem to be solved is to provide a process for producing a polyoxymethylene copolymer in a molding machine with a reduced generation of formaldehyde gas. In a process for continuously producing a polyoxymethylene copolymer comprising a step of melt-kneading a crude polyoxymethylene copolymer at a temperature not lower than the melting point thereof, devolatilizing under reduced pressure the formaldehyde gas generated as a decomposition product, subsequently mixing a formaldehyde scavenger containing a hydrazide compound (A) while keeping the copolymer in a molten state and immediately pelletizing the mixture, a dispersed solution obtained by slurry-dispersing said (A) in a diluent (B) having a melting point lower than temperature (Ta) which is the lower of the melting point and the decomposition temperature of (A), within a temperature range not lower than the melting point of (B) and lower than (Ta) is used as the formaldehyde scavenger.

Abstract: A method for evaluating flare of an exposure tool has measuring a first reference integral exposure amount of illumination light emitted from the light source, and a unit reference integral exposure amount of illumination light emitted from the light source, the first reference integral exposure amount being required for the first evaluation pattern to be developed on the photosensitive film, the unit reference integral exposure amount being required for the first effective exposure region to be developed on the photosensitive film; calculating a first evaluation value by dividing the unit reference integral exposure amount by the first reference integral exposure amount; and evaluating a total flare amount of the illuminating optical system and the projecting optical system, using the first evaluation value.

Abstract: A semiconductor device manufacturing method includes designing a resist structure including a film having antireflection function for exposure light and a resist on the film to be formed on a substrate, designing an exposure condition of the resist obtained by exposing and developing the resist such that a resist pattern is finished as designed, obtaining criteria value for estimating influence of a resist pattern upon a dimension or shape of a device pattern, the resist pattern being obtained by exposing the resist under the designed exposure condition and developing the exposed resist, the device pattern being obtained by etching the resist structure using the resist pattern as a mask, determining whether the designed exposure condition is acceptable or not based on the criteria value, and redesigning the exposure condition of the resist without changing the designed resist structure when the designed exposure condition is determined not acceptable.

Abstract: The invention provides a means capable of effectively inactivating and removing allergen or a precursor thereof. The invention relates to an allergen-reducing agent containing water and a water-soluble polymer compound having units having hydroxy or carboxy groups wherein at least a part of hydrogen atoms of the hydroxy or carboxy groups are substituted by specific groups containing a polyether group.