Patents by Inventor Satoshi Nishimura

Satoshi Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970018
    Abstract: It is an object to provide a trimmer that can trim a fore-edge portion of a bound material except a cover and that can be excellent in productivity and cost. A cover has flap portions adjacent to the fore-edge portion of the bound material, a trimmer includes: a trim cutter that trims the bound material; a blade receiving portion that receives an edge of the trim cutter; a base portion and a pressure portion that nip and position the bound material; and a pair of guide portions arranged for movement in a direction close to or away from the bound material, wherein the guide portions are inserted between the book block and the cover so as to peel the cover together with the flap portions up when the fore-edge portion of the bound material is trimmed by the trim cutter.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 30, 2024
    Assignee: Horizon International Inc.
    Inventors: Osamu Nishimura, Kazuyuki Fukushima, Satoshi Tsunawaki
  • Publication number: 20240123654
    Abstract: Provided is a separation and recovery apparatus for continuously separating and recovering, from a resin mixture containing a resin containing a hydrolyzable polymer and a resin containing a nonhydrolyzable polymer, a hydrolytic component a of the hydrolyzable polymer A and the nonhydrolyzable polymer B, the apparatus including: a crushing unit that crushes the resin mixture a melting/discharging unit that melts a crushed product obtained by the crushing unit to form a fluid and discharges the fluid at a high pressure; and a hydrothermal reaction treatment unit that continuously subjects the fluid discharged from the melting/discharging unit to a hydrothermal reaction treatment, wherein, in the melting/discharging unit, the hydrolyzable polymer A is hydrolyzed, and the hydrolytic component a thereof is dissolved and transferred into water permeating a sintered alloy diaphragm, thereby separating the nonhydrolyzable polymer B.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 18, 2024
    Applicant: TOPPAN INC.
    Inventors: Masaru WATANABE, Aritomo YAMAGUCHI, Osamu SATO, Yuuma IRISA, Akira TAKAMA, Kousuke NISHIMURA, Hiroki KUJIRAOKA, Hideki MIYAZAKI, Keita AKIMOTO, Takuya TAKAHATA, Daisuke KUGIMOTO, Shingo KOUDA, Satoshi HAMURA, Takahiro IMAI, Yumiko OMORI, Manabu KAWA
  • Publication number: 20230207331
    Abstract: A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.
    Type: Application
    Filed: March 30, 2021
    Publication date: June 29, 2023
    Inventors: Takuo Kawauchi, Masataka Matsunaga, Ryoichi Sakamoto, Masaru Honda, Satoshi Nishimura
  • Publication number: 20230190958
    Abstract: The present invention provides a recombinant adeno-associated virus (rAAV) vector for treating a blood coagulation-related disease to provide a novel gene therapy means for hemophilia. The virus vector comprises a virus genome comprising a liver-specific promoter sequence and a polynucleotide sequence encoding a genome editing means operably linked to the promoter sequence, wherein the genome editing means is (a) a means comprising CRISPR/Cas9 composed of a Cas9 protein and a guide RNA (gRNA) and a repair gene, or (b) a means comprising CRISPR/Cas9 composed of a Cas9 protein and a gRNA, and the gRNA comprises a nucleotide region complementary to a part of a region related to expression of a disease-related protein on the genome of a patient and a region that interacts with the Cas9 protein.
    Type: Application
    Filed: January 9, 2018
    Publication date: June 22, 2023
    Applicant: Jichi Medical University
    Inventors: Tsukasa Ohmori, Yasumitsu Nagao, Hiroaki Mizukami, Asuka Sakata, Keiya Ozawa, Shin-ichi Muramatsu, Shin-ichi Tominaga, Yutaka Hanazono, Satoshi Nishimura, Yoichi Sakata, Nobuhiko Kamoshita
  • Publication number: 20230178392
    Abstract: A separating system includes a placing unit, a removing apparatus and a transfer device. The placing unit is configured to place therein a first cassette allowed to accommodate a combined substrate in which a first substrate and a second substrate are bonded to each other with a separation layer therebetween, a second cassette allowed to accommodate the first substrate, and a third cassette allowed to accommodate the second substrate. The removing apparatus is configured to remove the separation layer by radiating laser light to the combined substrate. The transfer device is configured to perform a processing of transferring the combined substrate to the removing apparatus and a processing of transferring the first substrate and the second substrate separated from the combined substrate to the placing unit.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 8, 2023
    Inventors: Satoshi Nishimura, Takeshi Tamura, Takashi Koga, Yohei Maeda
  • Patent number: 11626302
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: April 11, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Publication number: 20230084246
    Abstract: Provided are a novel amorphous curcumin compound powdery composition that is inexpensive, is improved in bioabsorbability and bioavailability of curcumin, and has long-term stability, and a method for producing the powdery composition. The present invention relates to a powdery composition containing an amorphous curcumin compound and a hydrophilic modified starch and having a Raman spectrum including one or more peaks at wavenumbers of 1630, 1599, 1428, and 1243 (expressed in ±2 cm?1) and a method for producing the powdery composition.
    Type: Application
    Filed: January 25, 2021
    Publication date: March 16, 2023
    Applicant: THERABIOPHARMA INC.
    Inventors: Masashi ITOH, Satoshi NISHIMURA, Tatsuya OGAWA, Tadashi HASHIMOTO
  • Publication number: 20220351987
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Application
    Filed: July 19, 2022
    Publication date: November 3, 2022
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Patent number: 11473182
    Abstract: A component for use in a plasma processing apparatus, which is to be exposed to a plasma, includes a base material, an alumite layer and a thermally sprayed film. The base material has a plurality of through holes and a rough surface at which one end of each of the through holes is opended. The alumite layer is formed on a surface of the base material having the rough surface by an anodic oxidation process. The thermally sprayed film is formed on the rough surface with the alumite layer therebetween.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: October 18, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koji Mitsuhashi, Satoshi Nishimura
  • Patent number: 11424142
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: August 23, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Publication number: 20210000476
    Abstract: A hemostatic device is disclosed capable of effectively performing hemostasis on a puncture site of a subject without generating over-pressurization compression. The hemostatic device includes a first hemostatic member and a second hemostatic member which is movable relatively close to or away from the first hemostatic member, pinches a skin around the puncture site of the subject between the first hemostatic member and the second hemostatic member when the second hemostatic member moves toward the first hemostatic member, and performs hemostasis on the puncture site.
    Type: Application
    Filed: September 16, 2020
    Publication date: January 7, 2021
    Applicant: TERUMO KABUSHIKI KAISHA
    Inventors: Erika NISHIGAYA, Masako MIYASHITA, Satoshi NISHIMURA
  • Publication number: 20210002754
    Abstract: A component for use in a plasma processing apparatus, which is to be exposed to a plasma, includes a base material, an alumite layer and a thermally sprayed film. The base material has a plurality of through holes and a rough surface at which one end of each of the through holes is opended. The alumite layer is formed on a surface of the base material having the rough surface by an anodic oxidation process. The thermally sprayed film is formed on the rough surface with the alumite layer therebetween.
    Type: Application
    Filed: September 15, 2020
    Publication date: January 7, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Koji MITSUHASHI, Satoshi Nishimura
  • Patent number: 10808309
    Abstract: A component for use in a plasma processing apparatus, which is to be exposed to a plasma, includes a base material, an alumite layer and a thermally sprayed film. The base material has a plurality of through holes and a rough surface at which one end of each of the through holes is opended. The alumite layer is formed on a surface of the base material having the rough surface by an anodic oxidation process. The thermally sprayed film is formed on the rough surface with the alumite layer therebetween.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: October 20, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koji Mitsuhashi, Satoshi Nishimura
  • Patent number: 10781177
    Abstract: The present invention provides a compound represented by formula (I) (in the formula, R1 to R4 each represent a hydrogen atom, an unsubstituted or G1-substituted C1-6 alkyl group or the like, A represents an oxygen atom or the like, Cy represents a C6-10 aryl group or the like), an N-oxide compound thereof, a tautomer or salt thereof. The present invention also provides an agricultural and horticultural fungicide, harmful organism control agent and insecticidal/acaricidal agent containing at least one compound selected from the group consisting of a compound represented by formula (I), a tautomer and salt thereof, as an active ingredient.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: September 22, 2020
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Takaaki Teranishi, Shinya Uesusuki, Jun Iwata, Takuya Kamada, Youhei Munei, Satoshi Nishimura, Hiroki Inoue, Tetsuya Tanaka, Yuka Nakamura, Yusuke Fukushima, Tomomi Kobayashi, Shinya Koubori
  • Publication number: 20200294824
    Abstract: A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
    Type: Application
    Filed: March 10, 2020
    Publication date: September 17, 2020
    Inventors: Yuji Mimura, Hiroshi Maeda, Satoshi Nishimura
  • Patent number: 10553385
    Abstract: Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: February 4, 2020
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Koji Nakanishi, Satoshi Nishimura
  • Patent number: 10463043
    Abstract: The present invention provides a fungicide composition for agricultural and horticultural use, comprising compound A represented by formula (1) (in formula (1), Xs each independently represents a halogeno group or a C1-6 alkyl group; n represents a number of Xs and is an integer of 0 to 5; X? represents a halogeno group; R1, R2 and R3 each independently represents a C1-6 alkyl group, a C1-6 alkoxy group or a hydroxyl group; A1 and A2 each independently represents a nitrogen atom or a carbon atom), and at least one compound B selected from the group consisting of pydiflumetofen, pyraziflumid, isofetamid, tolprocarb, fluxametamide, broflanilide, tiadinil, fenoxanil and triflumezopyrim.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: November 5, 2019
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Satoshi Nishimura, Takayuki Fujii
  • Patent number: 10340248
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: July 2, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura, Masaru Honda, Toshifumi Inamasu, Satoshi Nishimura
  • Publication number: 20190071403
    Abstract: The present invention provides a compound represented by formula (I) (in the formula, R1 to R4 each represent a hydrogen atom, an unsubstituted or G1-substituted C1-6 alkyl group or the like, A represents an oxygen atom or the like, Cy represents a C6-10 aryl group or the like), an N-oxide compound thereof, a tautomer or salt thereof. The present invention also provides an agricultural and horticultural fungicide, harmful organism control agent and insecticidal/acaricidal agent containing at least one compound selected from the group consisting of a compound represented by formula (I), a tautomer and salt thereof, as an active ingredient.
    Type: Application
    Filed: March 9, 2017
    Publication date: March 7, 2019
    Applicant: NIPPON SODA CO., LTD.
    Inventors: Takaaki TERANISHI, Shinya UESUSUKI, Jun IWATA, Takuya KAMADA, Youhei MUNEI, Satoshi NISHIMURA, Hiroki INOUE, Tetsuya TANAKA, Yuka NAKAMURA, Yusuke FUKUSHIMA, Tomomi KOBAYASHI, Shinya KOUBORI
  • Patent number: 10111437
    Abstract: A novel guanidine compound having excellent fungicidal activity is represented by formula [I]. (In the formula, Y represents a divalent group represented by formula [II] (wherein each of R7-R9 independently represents a hydrogen atom or the like) or the like; each of X and Z independently represents an unsubstituted or substituted alkylene group or the like; each of Q1 and Q2 independently represents a single bond or the like; each of A1 and A2 independently represents an unsubstituted or substituted divalent heterocyclic compound residue or the like; and each of R1-R6 independently represents a hydrogen atom or the like.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: October 30, 2018
    Assignee: Nippon Soda Co., Ltd.
    Inventors: Yoichi Ihori, Shuuji Inoue, Kotaro Shibayama, Chang-Kyung Kang, Yasuyuki Shiinoki, Takuya Kamada, Hiroaki Naito, Satoshi Nishimura