Abstract: A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

Abstract: A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead.