Patents by Inventor Satoshi Sakimichi

Satoshi Sakimichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11035629
    Abstract: A heat exchange apparatus includes a heat exchanger through which a heat exchange medium flows inside, a fluid transport device that causes the heat exchange medium to flow, and a flow path through which the heat exchange medium flows. The heat exchange apparatus includes a flow rate controller configured to increase or decrease the flow rate of the heat exchange medium flowing through the flow path, and a driving part that drives the flow rate controller by receiving a force from the flow of the heat exchange medium flowing through the flow path.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: June 15, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yousuke Goto, Kimio Kohara, Satoshi Sakimichi, Shogo Kawaguchi
  • Publication number: 20190242662
    Abstract: A heat exchange apparatus includes a heat exchanger through which a heat exchange medium flows inside, a fluid transport device that causes the heat exchange medium to flow, and a flow path through which the heat exchange medium flows. The heat exchange apparatus includes a flow rate controller configured to increase or decrease the flow rate of the heat exchange medium flowing through the flow path, and a driving part that drives the flow rate controller by receiving a force from the flow of the heat exchange medium flowing through the flow path.
    Type: Application
    Filed: December 3, 2018
    Publication date: August 8, 2019
    Inventors: Yousuke GOTO, Kimio KOHARA, Satoshi SAKIMICHI, Shogo KAWAGUCHI
  • Patent number: 8772925
    Abstract: A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: July 8, 2014
    Assignees: DENSO CORPORATION, Nippon Soken, Inc.
    Inventors: Koji Noda, Satoshi Sakimichi, Masahiro Sakamoto, Kimio Kohara
  • Publication number: 20120152510
    Abstract: A bonding structure includes a first member, a second member and a bonding member. The first member has a plate shape and is made of a carbon-base material. The first member serves as a heat diffusion member that transfers heat at least in a thickness direction, which is perpendicular to a plane of the plate shape. The second member is bonded to the first member through the bonding member. The first member has a metal thin film at least on an opposed surface that is opposed to the second member. The bonding member is disposed between the opposed surface of the first member and the second member. The bonding member is provided by a sintered body of metal particle. For example, the bonding structure is employed in a cooling unit including a heat source.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 21, 2012
    Applicants: Nippon Soken, Inc., DENSO CORPORATION
    Inventors: Koji Noda, Satoshi Sakimichi, Masahiro Sakamoto, Kimio Kohara
  • Publication number: 20110303399
    Abstract: A thermal diffuser includes a plurality of thermally-conductive plates, each of which has a strip-like shape. The plurality of thermally-conductive plates is laminated onto one another in a plate-thickness direction of the strip-like shape to form a laminated body. Each of the plurality of thermally-conductive plates has thermal conductivities in a longitudinal direction and in a width direction of the strip-like shape better than a thermal conductivity in the plate-thickness direction. The thermally-conductive plates has sides, each of which extends in the longitudinal direction. The laminated body is formed such that the sides of the thermally-conductive plates form a plate surface of the laminated body, which surface extends in the plate-thickness direction that serves as a lamination direction, in which the thermally-conductive plates of the laminated body are laminated. A direction perpendicular to the plate surface corresponds to a thickness direction of the laminated body.
    Type: Application
    Filed: May 11, 2011
    Publication date: December 15, 2011
    Inventors: Satoshi Sakimichi, Kimio Kohara, Koji Noda
  • Publication number: 20080022706
    Abstract: An object is to provide a two-stage expansion refrigerating device capable of performing control with low cost so that a pressure of a refrigerant which has flowed through a high-pressure-side expansion unit is an optimum pressure, the device comprises a control unit (a controller) which controls a compressor (a low-stage-side compression element and a high-stage-side compression element) and each expansion unit (a high-pressure-side expansion valve as a high-pressure-side expansion unit and a low-pressure-side expansion valve as a low-pressure-side expansion unit), and a temperature sensor (a temperature detection unit) which detects a temperature of the refrigerant which has flowed through the high-pressure-side expansion valve, and the controller estimates a pressure of the refrigerant which has flowed through the high-pressure-side expansion valve based on a temperature detected by the temperature sensor, and controls one of the high-pressure-side expansion valve and the low-pressure-side expansion valve
    Type: Application
    Filed: July 31, 2007
    Publication date: January 31, 2008
    Inventors: Satoshi Sakimichi, Ryosuke Tsuihiji, Satoshi Imai, Hiroyuki Itsuki